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Micron Technology
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Director, Manufacturing Engineering

Director, Manufacturing Engineering

Micron Technology

20 - 24 years

0 Lacs

gujarat

Posted:22 hours ago| Platform: Shine logo

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Skills Required

die attach wire bonding flip chip molding process development automation cost reduction continuous improvement engineering support manufacturing operations strategic leadership process qualification process optimization scrap reduction cycle time reduction team building mentoring succession planning six sigma lean spc fmea doe project management communication stakeholder engagement semiconductor backend assembly processes backgrinder laser diser singulation aoi sustaining engineering yield enhancement new packages launch scaling packaging technologies quality output targets bestinclass engineering kpis engineering roadmap crossfunctional collaboration process sustaining bestknown methods bkms process control strategies package development npi transition automation initiatives smart factory problemsolving engineering solutions yield improvement career progression

Work Mode

On-site

Job Type

Full Time

Job Description

Role Overview: As the Director of Manufacturing Engineering at Micron Technology, you will lead the engineering organization responsible for semiconductor backend assembly processes. You will oversee a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality output targets while striving for best-in-class engineering KPIs. Key Responsibilities: - Provide leadership and strategy for the manufacturing engineering team supporting backend assembly operations across multiple product lines. - Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Drive cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. - Oversee the development, qualification, optimization, and sustaining of backend assembly processes. - Implement best-known methods (BKMs) and process control strategies to ensure process stability and high yield. - Collaborate with package development and NPI teams to ensure successful transition of new products from development to mass production. - Lead automation and smart factory initiatives to improve throughput, reduce manual handling, and enhance process control. - Lead structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. - Build, mentor, and retain a high-performing team of engineers and develop career progression and succession planning for key engineering roles. Qualifications: - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering. - Strong knowledge of backend assembly processes and experience with advanced packaging technologies. - Proficiency in engineering methodologies such as Six Sigma, Lean, SPC, FMEA, and DOE. - Strategic thinker with strong project management, communication, and stakeholder engagement abilities. If you are looking for an opportunity to lead a dynamic engineering organization in the semiconductor industry, drive innovation, and make a significant impact on high-volume manufacturing processes, then this role at Micron Technology might be the perfect fit for you.,

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Director, Manufacturing Engineering