6 Yield Enhancement Jobs

Orbit & Skyline India Pvt. Ltd. is a prominent semiconductor service provider with a skilled team dedicated to offering environmentally friendly semiconductor manufacturing solutions. Our cross-functional team excels in Mechanical, Electrical, Electronics, Software, Equipment, and process engineering, providing comprehensive solutions to semiconductor equipment manufacturers. We collaborate with customers across the semiconductor value chain, offering services in hardware design, supply chain management, quality management, data science, and more. Our diverse team of engineers and technologists is committed to driving technological advancements for prestigious clients globally. As a Senior Process Engineer at Orbit & Skyline, you will play a key role in CMOS semiconductor manufacturing. You will join a seasoned team of semiconductor professionals, collaborating with vendors worldwide to deliver efficient solutions and contribute to the growth of the Indian semiconductor ecosystem. Your responsibilities will include leading projects in Fab upgradation, accelerating project delivery, collaborating with scientists and engineers for process improvement, and providing progress updates to senior management. To be eligible for this role, you should have over 5 years of experience in International FABs with expertise in various semiconductor processes such as Inline Yield, Integration, Device Engineering, and more. A Masters or Ph.D. degree is required, along with strong interpersonal and analytical skills. A willingness to relocate to India is essential. Orbit & Skyline offers a dynamic work environment where employees are encouraged to reach their full potential. We prioritize employee well-being by providing health insurance, wellness allowances, communication allowances, and coverage under the Gratuity act. Our commitment to technical advancement is reflected in periodic trainings, service awards, and recognition programs. We foster team spirit through various engagement activities like team lunches, outings, and festival celebrations, creating a vibrant workplace culture for our dedicated employees.,

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components. Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India's first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission "To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust. Job Summary: Tata Semiconductor Manufacturing Pvt. Ltd. (TSMPL) is seeking an experienced embedded Flash (eFlash - NOR) FEOL Process Integration Lead to drive the development and optimization of embedded Flash technology across CMOS nodes from 130nm to 28nm, including BCD platforms. The role requires deep expertise in integrating eFlash into CMOS flows, including flash stack formation, etching, and performance characterization. Experience in modules such as RX, PC, SD, HK-MG, MOL, and BEOL is highly valued. Key responsibilities include setting up CMOS and eFlash flows, defining BKMs and inline measurement strategies, and ensuring robust integration. Strong knowledge of flash device architecture and FEOL integration is essential. Qualifications: - 5-15 years experience in the semiconductor industry with embedded Flash - B.Tech, MS, or PhD in Physics, Electrical Engineering, or related field with strong CMOS device and process integration knowledge - Experience in process/device integration, product, or process engineering - In-depth understanding of semiconductor processing, device physics, and eFlash cell design and integration - Familiarity with automotive-grade memory qualification (AEC-Q100) - Knowledge of key process modules, yield enhancement, DFM, and process variation management Responsibilities: - Lead the development and qualification of eFlash for planar CMOS (130nm to 28nm including BCD) - Lead the tool and unit process/module owners to optimize the processes for the eFlash cell and integration. - Understand design rules, generation rules as well as tapeout process flow - Understand the product design and layout to decide on product specific weak points and how they may affect eFlash - Design and run all aspects of experiments to test hypotheses. Perform data analysis (DOE, Process window) and problem solving for ET, yield or process issues - Understand and verify the process control window using characterization, yield and cycling results - Guide the setup and collect inline and physical measurements on the prototype lots with the integrated eFlash. Prototyping activities (minesweeper, proto lots, skew splits etc) from tapeout to lot execution - Ensure the initial success of mass production with specialized DoEs and other safe launch procedures - Run customer sample silicon and determine the appropriate measurements to ensure the success of qualification and timely transition to mass production - Integrate new processes, design test structures, create new process flow (STF, ECN, etc), define new ET & inline specs, during technology development - Prolific in filing innovations & solutions as potential disclosures Essential Attributes: - Ability to work with cross functional teams - Able to work independently, self-motivated with a strong drive to win. - Team player with the ability to work across diverse cross-functional teams spread across the world. - You're inclusive, adapting your style to the situation and diverse global.,

As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality output targets while striving for best-in-class engineering KPIs. Your key responsibilities will include: - Providing leadership and strategy for the manufacturing engineering team supporting backend assembly operations across multiple product lines. - Defining a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Driving cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. - Overseeing the development, qualification, optimization, and sustaining of backend assembly processes. - Implementing best-known methods (BKMs) and process control strategies to ensure process stability and high yield. - Collaborating with package development and NPI teams to ensure successful transition of new products from development to mass production. - Leading automation and smart factory initiatives to improve throughput, reduce manual handling, and enhance process control. - Leading structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. - Building, mentoring, and retaining a high-performing team of engineers and developing career progression and succession planning for key engineering roles. Qualifications: - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering. - Strong knowledge of backend assembly processes and experience with advanced packaging technologies. - Proficiency in engineering methodologies such as Six Sigma, Lean, SPC, FMEA, and DOE. - Strategic thinker with strong project management, communication, and stakeholder engagement abilities. If you are looking for an opportunity to lead a dynamic engineering organization in the semiconductor industry, drive innovation, and make a significant impact on high-volume manufacturing processes, then this role at Micron Technology might be the perfect fit for you. For more information about Micron Technology, Inc. and to explore career opportunities, please visit micron.com/careers.,

As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your key responsibilities will include: 1. **Engineering Leadership & Strategy:** Lead and manage the manufacturing engineering team supporting backend assembly operations across multiple product lines. Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. Drive cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization:** Oversee the development, qualification, optimization, and sustaining of backend assembly processes. Implement best-known methods and process control strategies to ensure process stability and high yield. Apply engineering methodologies like DOE, SPC, FMEA, and root cause analysis for continuous improvement. 3. **New Product Introduction (NPI):** Collaborate with package development and NPI teams to ensure successful transition of new products into mass production. Drive Design for Manufacturability and Design for Assembly initiatives. Own process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation:** Drive automation roadmap and smart factory initiatives to improve throughput and enhance process control. Leverage data analytics and equipment data integration for process monitoring and predictive maintenance. Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements:** Lead structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. Collaborate with operations and quality teams to meet customer quality standards. Drive cost reduction programs through material substitution and productivity improvements. 6. **Talent Development & Team Management:** Build, mentor, and retain a high-performing team of engineers. Develop career progression and succession planning for key engineering roles. Foster a culture of accountability, innovation, and continuous learning. **Qualifications:** - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with expertise in assembly engineering. - Strong knowledge of backend assembly processes and engineering methodologies. - Leadership skills with a strategic mindset, project management abilities, and strong analytical decision-making. **Key Performance Indicators (KPIs):** - Assembly process yield and in-line scrap rate - NPI cycle time and time-to-production readiness - Engineering issue closure rate - Process CPK > 2.0 - Equipment uptime and OEE - Engineering team retention and engagement **Work Environment & Travel:** Primarily site-based in a high-volume manufacturing environment. Some travel may be required for corporate meetings, customer audits, vendor development, or multi-site alignment. Micron Technology, Inc. is an industry leader in innovative memory and storage solutions, driving advancements in artificial intelligence and 5G applications. If you are ready to lead engineering initiatives in semiconductor backend assembly, visit micron.com/careers for more information.,

As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching engineering KPIs. Your primary responsibilities will include: 1. **Engineering Leadership & Strategy**: - Lead and manage the manufacturing engineering team supporting backend assembly operations. - Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Foster cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization**: - Oversee the development, qualification, optimization, and sustaining of backend assembly processes. - Implement best-known methods and process control strategies to ensure process stability. - Utilize tools like DOE, SPC, FMEA, and RCA to drive process robustness and continuous improvement. 3. **New Product Introduction (NPI)**: - Collaborate with package development and NPI teams for the successful transition of new products to mass production. - Drive Design for Manufacturability (DfM) and Design for Assembly (DfA) initiatives. - Ensure process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation**: - Develop automation roadmap and smart factory initiatives to enhance throughput and process control. - Leverage data analytics and MES for process monitoring and predictive maintenance. - Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements**: - Lead structured problem-solving to reduce scrap, improve yield, and lower cycle time. - Collaborate with operations and quality teams to meet customer quality standards. - Drive cost reduction programs through material substitution, process simplification, and productivity improvements. 6. **Talent Development & Team Management**: - Build and mentor a high-performing team of engineers. - Develop career progression and succession planning for key engineering roles. - Foster a culture of accountability, innovation, and continuous learning. **Qualifications**: - Education: Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - Experience: 20+ years in semiconductor backend manufacturing, with at least 10 years in a senior engineering management role. - Technical Skills: Strong knowledge of backend assembly processes, experience with advanced packaging technologies, and proficiency in engineering methodologies. - Leadership Skills: Strategic thinker with strong project management and communication abilities. If you are looking to contribute to cutting-edge technology and drive innovation in the semiconductor industry, this role offers a unique opportunity to lead a team of engineers and shape the future of manufacturing at Micron Technology. Note: To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com. Micron Technology prohibits the use of child labor and complies with all applicable labor standards. Candidates are encouraged to use AI tools for resume enhancement, ensuring all information provided is accurate.,

As a Staff/Principal Engineer, Design Enablement at Micron Technology, you will be an integral part of an inclusive team driving vertical integration with a network of collaborators across various departments. Your responsibilities will include coordinating the work of engineers to provide design rules and device definitions, consolidating device test structure requirements, and partnering with CAD teams to ensure high-quality PDK work. You will proactively identify and address process issues, drive effective multi-functional communication on issue resolution, and create layouts to qualify design rules using industry-standard layout automation tools. Additionally, your role will involve writing custom rule decks to qualify design rule definitions, and possessing a deep understanding of semiconductor process flow. The ideal candidate for this position should hold a BS/MS/PhD in Electrical Engineering, Microelectronics, Physics, or a related field, with at least 10 years of experience in the semiconductor industry. You should have prior experience in enabling and/or Qualifying PDK components, be proficient in writing scripts in Perl, Python, SKILL, or SVRF, and have a proven grasp of design & layout with the ability to do minor layout work with Pcells. Furthermore, you should have experience with transistor-level circuit and layout design, a deep understanding of underlying device physics, and working knowledge of mixed-signal circuits such as Multiplexers, Amplifiers, Drivers, and Charge pumps. Clear thinking and communication skills in urgent and stressful situations are essential for this role. Micron Technology, Inc. is a world leader in innovative memory and storage solutions, focused on transforming how the world uses information to enrich life for all. With a relentless focus on technology leadership and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through its Micron and Crucial brands. If you are looking to be part of a dynamic team driving technological advancements in the semiconductor industry, Micron Technology is the place for you. Visit micron.com/careers to learn more about our innovative work culture, and to explore career opportunities with us. For any assistance with the application process or for reasonable accommodations, please reach out to hrsupport_in@micron.com. Micron strictly prohibits the use of child labor and complies with all applicable labor laws and standards. Join us at Micron Technology and be a part of a transformative journey in the world of information technology.,