9 Wire Bonding Jobs

Job Description Senior Process Engineer (OSAT Facility) Position: Senior Process Engineer Location: Gujarat Industry: Semiconductor OSAT (Outsourced Semiconductor Assembly & Test) Employment Type: Full-time, Permanent About the Role Leading business house is setting up one of India's finest OSAT facilities, focused on advanced semiconductor assembly, packaging, and testing. As a Senior Process Engineer , you will be responsible for driving process excellence in assembly operations, optimizing yields, and ensuring smooth ramp-up of new technologies. Key Responsibilities Lead process development and optimization for semiconductor packaging (Die Attach, Wire Bond, Molding, Wafer Bumping, Singul...

Role Overview: As the Director of Manufacturing Engineering at Micron Technology, you will lead the engineering organization responsible for semiconductor backend assembly processes. You will oversee a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing oper...

As the Wire Bonding/Flip Chip Packaging Engineering, you will be responsible for developing technology and processes related to FOL (Front of Line) and EOL (End of Line) stages. This includes tasks such as back grinding, laser groove, mechanical sawing, SMT & Flip Chip Attach, mass reflow/TCB/fluxless, flux cleaning, plasma clean, underfill, mold underfill, ball attach, saw singulation, O/S, FVI, pick and place, and packing. Your role will involve understanding, integrating, and innovating solutions to meet customer packaging requirements in a cost-effective manner. You will be required to initiate technical discussions with vendors to gather relevant data and complete initial analyses for d...

As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing opera...

As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your...

As a Process Engineer at A Sahasra Group Company located in Bhiwadi, you will be responsible for process optimization in Die attach, wire bonding, molding, and Sawing processes within the Semiconductor/Electronics industry. With a minimum of 8 years of experience, you will utilize your expertise to optimize critical parameters, standardize processes, and ensure maximum product yield. Your role will involve optimizing and standardizing critical parameters in various processes such as Die attach, wire bonding, molding, and Saw machine. You will collaborate with equipment suppliers, raw material suppliers, and quality teams to achieve process optimization and yield improvement. Additionally, yo...

Exide Energy Solutions Limited (EESL) is a rapidly growing company with a vision to address social issues related to energy, environment, and resources by producing lithium-ion battery products. We are in the process of establishing India's first Giga plant for manufacturing Lithium Ion Cells in Bengaluru. Currently, we are seeking a Senior Manager Process Engineering to join our manufacturing organization and play a key role in achieving the company's objectives at the Battery Pack Manufacturing Location in Prantij, Gujarat. As a Senior Manager - Process & New Product Development, you will be responsible for Cell Module development (prismatic & cylindrical) and HV/LV Pack line. Your primary...

Role & responsibilities JD- Subject Matter Expert (SME) Qualification: Bachelors degree in mechanical engineering Experience: Serve as the go-to expert in a specific semiconductor domain (e.g., front-end fab processes, back-end packaging, lithography, metrology, materials, or EDA tools). Guide technical direction for projects, tools, and systems based on industry best practices and innovation. Lead or consult in process development, yield improvement, defect reduction, or technology transfers. Evaluate new technologies and provide feasibility assessments and technical risk analysis. Support cross-functional teams during new product introductions to ensure manufacturability, scalability, and ...

As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering su...