9 Die Attach Jobs

As the Director of Manufacturing Engineering at Micron Technology, you will lead the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role involves managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality o...

As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your primary responsibilities will include overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. Your contributions will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations. **Key Responsibilities:** - **Engineering Leadership & Strategy** - Lead and manage the manufacturing engineerin...

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities And Tasks Bring up equipment in an efficient manner and minimum downtime Operate and maintain equipment Apply problem solving technique by available tools and resources to solve problem Perform routine equipment health check / conversion as defined Performs electrical or mechanical troubleshooting to determine problems in non-functioning electro-mechanical equipment used in the...

Job Description Senior Process Engineer (OSAT Facility) Position: Senior Process Engineer Location: Gujarat Industry: Semiconductor OSAT (Outsourced Semiconductor Assembly & Test) Employment Type: Full-time, Permanent About the Role Leading business house is setting up one of India's finest OSAT facilities, focused on advanced semiconductor assembly, packaging, and testing. As a Senior Process Engineer , you will be responsible for driving process excellence in assembly operations, optimizing yields, and ensuring smooth ramp-up of new technologies. Key Responsibilities Lead process development and optimization for semiconductor packaging (Die Attach, Wire Bond, Molding, Wafer Bumping, Singul...

Role Overview: As the Director of Manufacturing Engineering at Micron Technology, you will lead the engineering organization responsible for semiconductor backend assembly processes. You will oversee a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing oper...

As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing opera...

As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your...

As a Process Engineer at A Sahasra Group Company located in Bhiwadi, you will be responsible for process optimization in Die attach, wire bonding, molding, and Sawing processes within the Semiconductor/Electronics industry. With a minimum of 8 years of experience, you will utilize your expertise to optimize critical parameters, standardize processes, and ensure maximum product yield. Your role will involve optimizing and standardizing critical parameters in various processes such as Die attach, wire bonding, molding, and Saw machine. You will collaborate with equipment suppliers, raw material suppliers, and quality teams to achieve process optimization and yield improvement. Additionally, yo...

As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering su...