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20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality output targets while striving for best-in-class engineering KPIs. Your key responsibilities will include: - Providing leadership and strategy for the manufacturing engineering team supporting backend assembly operations across multiple product lines. - Defining a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Driving cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. - Overseeing the development, qualification, optimization, and sustaining of backend assembly processes. - Implementing best-known methods (BKMs) and process control strategies to ensure process stability and high yield. - Collaborating with package development and NPI teams to ensure successful transition of new products from development to mass production. - Leading automation and smart factory initiatives to improve throughput, reduce manual handling, and enhance process control. - Leading structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. - Building, mentoring, and retaining a high-performing team of engineers and developing career progression and succession planning for key engineering roles. Qualifications: - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with deep expertise in assembly engineering. - Strong knowledge of backend assembly processes and experience with advanced packaging technologies. - Proficiency in engineering methodologies such as Six Sigma, Lean, SPC, FMEA, and DOE. - Strategic thinker with strong project management, communication, and stakeholder engagement abilities. If you are looking for an opportunity to lead a dynamic engineering organization in the semiconductor industry, drive innovation, and make a significant impact on high-volume manufacturing processes, then this role at Micron Technology might be the perfect fit for you. For more information about Micron Technology, Inc. and to explore career opportunities, please visit micron.com/careers.,
Posted 3 weeks ago
3.0 - 15.0 years
0 Lacs
pune, maharashtra
On-site
The job requires you to understand how the product works and how customers use it. You will need to interact with customers both on-site and off-site to troubleshoot issues and provide workarounds using your software development skills. As the primary Technical Support Engineer for multiple large accounts, you should manage customer requirements effectively and fulfill enhancement requests based on customer use-cases. You will be responsible for guiding Senior Software Engineers and Lead Software Engineers for quicker issue resolutions and achieving productivity goals for the tech team. Providing technical expertise, guidance, mentorship, and leading in hiring processes will be part of your responsibilities. Additionally, you will train team members on new technologies and processes. Your duties will include providing hot fixes, patches, and upgrade deployment support in production and staging environments. Leading on RED accounts for technical issues/defects, offering innovative ideas to improve ticket resolution quality, and driving efficient ways for issue resolutions across customers are also key tasks. You should contribute to productivity and ticket resolution quality improvement initiatives and suggest or implement platform functionalities to enhance ticket turnaround time. To qualify for this role, you should have 12-15 years of overall experience in developing enterprise web applications, Technical Support on Microsoft platforms, or in a Sustaining engineering role. A minimum of 3-4 years of experience in a Support or Sustaining engineering role is essential. Troubleshooting skills on the Microsoft platform, expertise in C#, ASP.NET, MVC, SQL, Stored Procedures, and JavaScript are required. Knowledge of Windows Azure, Cloud Computing, and relevant certifications are advantageous. Understanding of customer support processes and tools, good written and verbal communication skills, and the ability to work independently on assigned issues are also necessary. A Science or Engineering graduate would be preferred for this position. Join us at Icertis, a company that leads in contract lifecycle management with its cutting-edge technology and innovation. Our Contract Intelligence platform transforms contracts into strategic assets, enabling organizations to structure and connect critical contract information effectively. Trusted by the world's most iconic brands and disruptive innovators, Icertis manages over 10 million contracts worth more than $1 trillion across 93 countries and 40+ languages. At Icertis, we are committed to our FORTE values - Fairness, Openness, Respect, Teamwork, and Execution. These values guide our interactions with employees, customers, partners, and stakeholders as we strive to be the leading contract intelligence platform globally. Our focus on how we achieve our goals is as significant as the goals themselves.,
Posted 3 weeks ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your key responsibilities will include: 1. **Engineering Leadership & Strategy:** Lead and manage the manufacturing engineering team supporting backend assembly operations across multiple product lines. Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. Drive cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization:** Oversee the development, qualification, optimization, and sustaining of backend assembly processes. Implement best-known methods and process control strategies to ensure process stability and high yield. Apply engineering methodologies like DOE, SPC, FMEA, and root cause analysis for continuous improvement. 3. **New Product Introduction (NPI):** Collaborate with package development and NPI teams to ensure successful transition of new products into mass production. Drive Design for Manufacturability and Design for Assembly initiatives. Own process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation:** Drive automation roadmap and smart factory initiatives to improve throughput and enhance process control. Leverage data analytics and equipment data integration for process monitoring and predictive maintenance. Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements:** Lead structured problem-solving and engineering solutions to reduce scrap, improve yield, and lower cycle time. Collaborate with operations and quality teams to meet customer quality standards. Drive cost reduction programs through material substitution and productivity improvements. 6. **Talent Development & Team Management:** Build, mentor, and retain a high-performing team of engineers. Develop career progression and succession planning for key engineering roles. Foster a culture of accountability, innovation, and continuous learning. **Qualifications:** - Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - 20+ years of experience in semiconductor backend manufacturing with expertise in assembly engineering. - Strong knowledge of backend assembly processes and engineering methodologies. - Leadership skills with a strategic mindset, project management abilities, and strong analytical decision-making. **Key Performance Indicators (KPIs):** - Assembly process yield and in-line scrap rate - NPI cycle time and time-to-production readiness - Engineering issue closure rate - Process CPK > 2.0 - Equipment uptime and OEE - Engineering team retention and engagement **Work Environment & Travel:** Primarily site-based in a high-volume manufacturing environment. Some travel may be required for corporate meetings, customer audits, vendor development, or multi-site alignment. Micron Technology, Inc. is an industry leader in innovative memory and storage solutions, driving advancements in artificial intelligence and 5G applications. If you are ready to lead engineering initiatives in semiconductor backend assembly, visit micron.com/careers for more information.,
Posted 3 weeks ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching engineering KPIs. Your primary responsibilities will include: 1. **Engineering Leadership & Strategy**: - Lead and manage the manufacturing engineering team supporting backend assembly operations. - Define a strategic engineering roadmap for backend PDE technologies in alignment with business objectives. - Foster cross-functional collaboration with PDE/CEM, operations, quality, planning, and supply chain. 2. **Process Development & Optimization**: - Oversee the development, qualification, optimization, and sustaining of backend assembly processes. - Implement best-known methods and process control strategies to ensure process stability. - Utilize tools like DOE, SPC, FMEA, and RCA to drive process robustness and continuous improvement. 3. **New Product Introduction (NPI)**: - Collaborate with package development and NPI teams for the successful transition of new products to mass production. - Drive Design for Manufacturability (DfM) and Design for Assembly (DfA) initiatives. - Ensure process readiness, capability demonstration, and yield ramp targets during pilot and production ramp-up. 4. **Automation & Digital Transformation**: - Develop automation roadmap and smart factory initiatives to enhance throughput and process control. - Leverage data analytics and MES for process monitoring and predictive maintenance. - Champion Industry 4.0 and AI-driven process optimization. 5. **Cost, Yield & Quality Improvements**: - Lead structured problem-solving to reduce scrap, improve yield, and lower cycle time. - Collaborate with operations and quality teams to meet customer quality standards. - Drive cost reduction programs through material substitution, process simplification, and productivity improvements. 6. **Talent Development & Team Management**: - Build and mentor a high-performing team of engineers. - Develop career progression and succession planning for key engineering roles. - Foster a culture of accountability, innovation, and continuous learning. **Qualifications**: - Education: Bachelor's or Master's degree in Engineering (Mechanical, Electrical, Materials, Chemical, or Industrial Engineering). - Experience: 20+ years in semiconductor backend manufacturing, with at least 10 years in a senior engineering management role. - Technical Skills: Strong knowledge of backend assembly processes, experience with advanced packaging technologies, and proficiency in engineering methodologies. - Leadership Skills: Strategic thinker with strong project management and communication abilities. If you are looking to contribute to cutting-edge technology and drive innovation in the semiconductor industry, this role offers a unique opportunity to lead a team of engineers and shape the future of manufacturing at Micron Technology. Note: To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com. Micron Technology prohibits the use of child labor and complies with all applicable labor standards. Candidates are encouraged to use AI tools for resume enhancement, ensuring all information provided is accurate.,
Posted 4 weeks ago
3.0 - 8.0 years
5 - 14 Lacs
Ernakulam
Work from Office
Product Development and Extensions - Concept development - Customer/ sales interaction for necessary inputs and analysis - Product costing with support from various function - DOE/ Product/ Project Risk Assessment/ Design FMEA - Perform / interpret simulation results. - Tolerance Stack up analysis. - Material selection for metals and plastics - Drawing and 3D creation - Interact with tool design and other supporting functions for feasibility and DFM - Product testing and qualification- dimensional and functional - Prototype build and validation where necessary - Project management: liaise with various functions for schedules and ensure on time delivery of customer requests. - Coordinate debugging and hand over to production Sustaining Engineering - Product documentation - Technical support to QA for customer complaint resolution - Product crossing referencing/customer 3D, support to product manager - Identify cost reduction possibilities. - Qualification/Product certifications - Change Management/PCN (Product change modification) Skills Knowledge on ERP CAD 3D and Drawing Creation (Creo/Solidworks) PLM (Windchill) Tolerance stack up analysis Engineering change management/PCN FEA (Finite Element Analysis) Moldflow analysis DFM (Design for Manufacturability) FMEA (Failure Mode Effect Analysis) GD&T (Geometric Dimensioning & Tolerance) Rapid Prototyping & Reverse Engineering MS Office Candidates with experience in Connector & Automotive industry experience are preferred.
Posted 1 month ago
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