Get alerts for new jobs matching your selected skills, preferred locations, and experience range. Manage Job Alerts
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will lead the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role involves managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to meet quality o...
Posted 1 week ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your primary responsibilities will include overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. Your contributions will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations. **Key Responsibilities:** - **Engineering Leadership & Strategy** - Lead and manage the manufacturing engineerin...
Posted 3 weeks ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
Role Overview: As the Director of Manufacturing Engineering at Micron Technology, you will lead the engineering organization responsible for semiconductor backend assembly processes. You will oversee a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing oper...
Posted 2 months ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will be leading the engineering organization responsible for semiconductor backend assembly processes. This includes overseeing a variety of processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve managing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial part in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing opera...
Posted 4 months ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will lead the semiconductor backend assembly processes, including backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your role will involve overseeing process development, sustaining engineering, automation, yield enhancement, cost reduction, and the successful launch of new packages into high-volume production. You will play a crucial role in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering support for manufacturing operations to achieve quality output targets while reaching best-in-class engineering KPIs. Your...
Posted 4 months ago
20.0 - 24.0 years
0 Lacs
gujarat
On-site
As the Director of Manufacturing Engineering at Micron Technology, you will play a crucial role in leading the engineering organization responsible for semiconductor backend assembly processes. Your responsibilities will include overseeing various processes such as backgrinder, laser diser, die attach, wire bonding, flip chip, molding, singulation, AOI, and related technologies. Your key focus areas will be process development, sustaining engineering, automation, yield enhancement, cost reduction, and successful new package launches into high-volume production. Your role will be instrumental in scaling packaging technologies, driving continuous improvement, and ensuring robust engineering su...
Posted 5 months ago
Browse through a variety of job opportunities tailored to your skills and preferences. Filter by location, experience, salary, and more to find your perfect fit.
We have sent an OTP to your contact. Please enter it below to verify.
Accenture
174558 Jobs | Dublin
Wipro
55192 Jobs | Bengaluru
EY
44116 Jobs | London
Accenture in India
37169 Jobs | Dublin 2
Turing
30851 Jobs | San Francisco
Uplers
30086 Jobs | Ahmedabad
IBM
27225 Jobs | Armonk
Capgemini
23907 Jobs | Paris,France
Accenture services Pvt Ltd
23788 Jobs |
Infosys
23603 Jobs | Bangalore,Karnataka