Ciliconchip Talent Acquisition Head

Ciliconchip Talent Acquisition Head - Job Description

The Head of Talent Acquisition will lead the organization’s end-to-end talent acquisition

function, driving strategy, innovation, and execution across all hiring verticals.

Work closely with executive leadership, HR business partners, and business heads to anticipate

workforce needs, establish robust hiring frameworks, and elevate the company’s employer

brand in the market.

Key Responsibilities

1. Strategic Leadership & Talent Planning

 Develop and execute a semiconductor-specific talent acquisition strategy aligned with

business objectives in VLSI design, physical design, verification, DFT, and

analog/mixed-signal domains.

 Partner with CXOs, Design Heads, and Program Managers to forecast hiring demand

across design centers and delivery programs.

 Build proactive pipelines for niche and emerging skills (e.g., UCIe, AMS IPs, RTL design,

emulation, validation).

 Represent TA in HR leadership forums, ensuring alignment of hiring strategy with the

organization’s technology and growth roadmap.

2. Team Leadership & Capability Development

 Lead and mentor a geographically distributed TA team specialized in semiconductor and

engineering hiring.

 Establish domain-specific KPIs (time-to-fill, design talent conversion rates, campus-to-

hire ratios).

 Build recruiter capability in VLSI hiring through structured training on technology stacks,

job family structures, and skill taxonomies.

 Foster a culture of agility, collaboration, and precision execution within the TA function.

3. Recruitment Excellence & Process Optimization

 Drive the full recruitment lifecycle — from semiconductor talent mapping and sourcing to

selection, offer, and onboarding.

 Implement best-in-class ATS/CRM systems integrated with engineering skill-based

taxonomies.

 Standardize interview structures for technical evaluation (design challenges, coding,

schematic reviews).

 Ensure compliance with IP confidentiality, export control, and data-protection regulations

relevant to semiconductor hiring.

 Champion diversity hiring across engineering roles (women in hardware, campus

inclusivity programs).

4. Employer Branding & Talent Marketing

 Position the company as a leading semiconductor design employer through branding

campaigns, university collaborations, and thought-leadership events.

 Build partnerships with IITs, NITs, and Tier-1 VLSI campuses, and sponsor hackathons,

chip design contests, and industry conferences (e.g., DVCon, VLSID).

 Use digital platforms (LinkedIn, GitHub, IEEE, Semicon India forums) to enhance brand

visibility and engage with passive engineering talent.

 Measure and improve candidate experience and brand perception across all talent

touchpoints.

5. Stakeholder & Vendor Management

 Act as a strategic advisor to business heads on semiconductor talent availability,

compensation trends, and skill gaps.

 Manage partnerships with VLSI recruitment firms, contract staffing agencies, and

university placement cells.

 Negotiate service contracts and SLAs with niche semiconductor hiring partners to

ensure agility and ROI.

6. Capability Development & Collaboration

 Partner with Learning & Development and Technical Leadership teams to identify hiring-

related capability gaps in emerging semiconductor technologies.

 Lead recruiter certification programs on semiconductor fundamentals, design flow, and

talent analytics.

 Align talent acquisition insights with workforce planning for design centers, building a

sustainable engineering leadership pipeline.

Key Performance Indicators (KPIs)

 Fulfillment rate for critical/niche semiconductor roles.

 Time-to-hire, quality-of-hire, and offer-to-join ratio for design and verification engineers.

 Hiring manager and candidate satisfaction.

 Campus-to-hire conversion ratio and diversity metrics.

 Employer Brand Index in semiconductor talent market.

 Recruiter technical capability improvement metrics.

Required Qualifications

 Education: Master’s degree in Human Resources, Business Administration, or related

field.

Experience: Minimum 14 years of progressive TA experience, with at least 5 years in

semiconductor/VLSI hiring leadership.

 Proven success in scaling engineering hiring operations in high-growth or technology-

driven environments.

 Strong expertise in workforce planning for SoC, ASIC, and analog/mixed-signal design

organizations.

 Experience with TA analytics, ATS systems, and semiconductor industry benchmarks.

Preferred Skills

 Deep understanding of semiconductor design flow and talent ecosystem.

 Excellent stakeholder management with global delivery and R&D teams.

 Experience integrating TA and capability development initiatives.

 Strategic mindset with ability to translate business goals into talent pipelines.

 Strong analytical, communication, and influencing skills.