Senior Package Design Engineer

Senior Engineer, Package Design – Bengaluru, KA- India

Top 100 Global Semiconductor MNC in the world

Bangalore

Description

We are a innovative enterprise that designs, develops, and delivers System-on-Chip products to customers worldwide. The company is focused on AR/VR, imaging, networking, storage, and other dynamic technologies that drive today’s leading-edge applications. We combine world-class expertise, experience, and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015, We are headquartered in Japan, and have offices in Japan, Asia, United States and Europe to lead its product development and sales activities.

Senior Engineer, Package Design – Bengaluru, KA- India

Responsibilities:

The Package substrate design focus on signal and power integrities analyses as well as routing analyses. You will be reporting to the Director of Package Design (USA) and working very closely with Package design team in our parent company’s headquarters in Japan and Marketing and Engineering teams located in our Milpitas office during the pre/post sales process.

This position requires a broad knowledge of package technology and design. Successful candidates will have a deep understanding and experience in the following areas: high performance build-up substrates, flip chip assembly or 2.5D packaging. Knowledge and experience in extracting/simulating package designs for Signal and Power integrities using tools such as HFSS, and/or ADS tools.

Education:

• Bachelor’s degree in Electrical Engineering, or other semiconductor packaging related discipline

• MS is preferred

Required Experience and Skills:

• 8 to 10 years of experience in semiconductor packaging design, modeling, extraction, and simulations

• Record of success in cross-functional team environment

• Good experience with Signal and power integrity tools for package level modeling/extraction/simulation

• Ability to work with Package Layout engineers.

• Strong presentation and communication skills

Preferred Experience and Skills:

• Hands-on package design; high-speed Signal integrity and Power integrity and package decoupling caps optimizations, combined package and PCB Signal integrity and Power integrity Characterizations, impedance verification, high frequency s-parameters extraction, Hspice model, package Hspice and RLC model extraction and designs

• Hands-on high-speed package and PCB design for: high-speed Serdes 112 Gbps, PCIeX5 and 6, LPDDR4,5, Ethernet 25 GBps, power aware SI/PI analysis, up to 40 GHZ s-parameters extraction and verification

• Packaging+PCB high-speed interconnections timing analyses, eye-diagram and jitter budgeting calculation following the LPDDR JEDEC spec, or other highs-speed frequency domain s-parameters extraction following the base Spec of high-speed interconnect

• Hands-on PCB design; SI, PI analyses, decoupling caps optimizations, SI and PI Characterization and extractions, impedance verification, s-parameters verifications with lab measurements, Hspice model, PCB RLC model extraction and designs

• Packaging routing analyst, trace impedance analyses and package layout bump to ball analyses

• Package material characterization frequency dependent model; skin effects, smoothness, roughness, dielectric loss and dielectric constant

• PCB material characterization frequency dependent; routing degree of freedom

• Time domain analyses and jitter budgeting for PCIe2/3/4/5, Serdes 112 GBps, Ethernet 25 Gbps, LPDDR4/5X MIPI, high-speed frequency signaling

• Time domain analyses and budgeting model for LPDDR 3/4/5, LPDDRX 3/4/5/6

• Bathtub curve and BER analyses of high speed signaling

• DDR frequency and time domains model and jitter analyses and path findings to improve package and PCB layout and improve high-speed interconnections

• Clk jitter analyses, routing, clk tree analyses

• Simulating multi-physics electro-thermal analysis

• Collateral packaging manufacturing and assembly rules

• Chip and package Reliability analyses

• Die+Pkg+pcb PDN model time and frequency, Impedance profile, AC droop, DC drop DC, etc.

• IR drop, and CPM (chip power model) die model using Redhawk and other tolls

• Core PI: simulation capability, tool/flow and past experience on measurement capability, lab tool set up.

Contact:Uday

Mulya Technologies

muday_bhaskar@yahoo.com"

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