Process Manager - Plasma Etch

Job Description

About the Company: Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence. Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust. Job Description: We are seeking an experienced and highly motivated Process Manager to lead our Plasma Etch team. The successful candidate will be responsible for the development, optimization, and sustaining of plasma etch processes for advanced semiconductor devices. This role requires a strong technical background in plasma physics, semiconductor processing, and equipment operation, coupled with excellent leadership and problem-solving skills. The Process Manager will drive continuous improvement initiatives, manage a team of talented engineers, and collaborate cross-functionally to achieve aggressive technology and manufacturing goals. Key Responsibilities: Process Development & Optimization: Lead the development and characterization of new plasma etch processes for current and future technology nodes, meeting stringent performance, yield, and reliability targets. Optimize existing etch processes to improve device performance, reduce cost, enhance yield, and increase throughput. Design and execute Design of Experiments (DOE) to understand process windows, identify critical parameters, and establish robust process controls. Implement advanced process control (APC) and statistical process control (SPC) methodologies. Team Leadership & Management: Manage, mentor, and develop a team of highly skilled process engineers and technicians. Foster a collaborative, innovative, and high-performance team environment. Set clear objectives, conduct performance reviews, and support career growth for team members. Manage team resources, including staffing, budget, and project allocation. Troubleshooting & Problem Solving: Lead root cause analysis and implement effective corrective actions for process excursions, yield detractors, and equipment issues related to plasma etch. Utilize data analysis tools and methodologies (e.g., JMP, Minitab, Python, R) to diagnose complex process problems. Collaboration & Communication: Collaborate extensively with integration, device, materials, equipment, and manufacturing teams to ensure seamless process flow and achieve overall product goals. Present technical findings, project updates, and recommendations to senior management and cross-functional teams. Work closely with equipment suppliers to evaluate new tools, resolve issues, and drive equipment roadmaps. Continuous Improvement & Innovation: Identify and implement opportunities for process simplification, automation, and cost reduction. Stay abreast of industry trends, new technologies, and best practices in plasma etch and semiconductor manufacturing. Drive intellectual property generation (patents, trade secrets). Safety & Quality: Ensure all process development and manufacturing activities adhere to strict safety protocols and quality standards. Promote a strong safety culture within the team. Qualifications: Education: Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, Physics, or a related discipline with 8+ years of relevant experience in semiconductor process engineering. Master's degree with 10+ years of relevant experience. Bachelor's degree with 12+ years of relevant experience. Experience: Minimum of [e.g., 3-5+] years of experience in a leadership or management role within semiconductor process engineering, specifically in plasma etch. Extensive hands-on experience with various plasma etch platforms (e.g., Lam Research, Applied Materials, Tokyo Electron). Strong understanding of plasma physics, surface chemistry, and material science as they relate to semiconductor etching (e.g., RIE, ICP, MERIE, atomic layer etching). Proven track record of successful process development and yield improvement in a high-volume manufacturing environment. Experience with advanced technology nodes (e.g., 7nm, 5nm, 3nm and beyond for Logic/Memory). Proficiency in statistical data analysis, DOE, SPC, and APC. Skills: Excellent leadership, communication, and interpersonal skills. Strong analytical and problem-solving abilities. Ability to work effectively in a fast-paced, dynamic, and highly collaborative environment. Proficiency with data analysis software (e.g., JMP, Minitab, MATLAB, Python/R for data science). Strong presentation skills. Preferred Qualifications (Nice to Have): Experience with vacuum technology and gas delivery systems. Familiarity with metrology techniques used for etch process characterization (e.g., SEM, TEM, AFM, XPS, SIMS, ellipsometry). Knowledge of device physics and semiconductor device fabrication. Lean manufacturing or Six Sigma certification.