Engineering Development Manager

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Role Overview

The Manager – Engineering & Development (Railways) will lead the design, development, and innovation of embedded hardware and firmware solutions for railway applications, ensuring compliance with industry standards (IEC, EN, CENELEC, IRIS). This role involves managing processors, microcontrollers, FPGAs, and chipsets used in railway systems, overseeing technology transfer, obsolescence management, and cross-functional collaboration to deliver high-reliability solutions.

Key Responsibilities

1. Embedded Systems Development

• Lead the design and development of embedded hardware (PCBs, SoCs, FPGAs) and firmware for railway applications, including:
• Select and validate processors (ARM Cortex, PowerPC, x86), microcontrollers (STM32, NXP, Renesas), and FPGAs (Xilinx, Intel/Altera) for railway-grade applications.
• Ensure compliance with IEC standards e.g. IEC 62280 (SIL-2/4), IEC 61373 and other EN 50155 (railway electronics), EN 50657 (software), EN 50121, EN 61000, RDSO and CENELEC standards.

2. Technology Transfer & Collaboration

• Manage technology transfer from R&D/partners to production, ensuring seamless integration of railway-specific chipsets (TI, Infineon, Microsemi).
• Collaborate with global technology partners for IP cores, ASICs, and safety-certified components.

3. Cross-Functional Coordination

• Act as the primary interface between R&D, production, QA, and procurement to align on railway-grade component selection (extended temp, shock/vibration resistance).
• Ensure EN 50128 compliance or DO-178C (software) for firmware development.

4. Obsolescence Management

• Develop strategies to mitigate component obsolescence in long-lifecycle railway systems.
• Identify alternate chipsets, pin-compatible replacements, and redesign solutions while maintaining EN 50126/50129 compliance.

5. Engineering Management

• Oversee V-model development, HARA (Hazard Analysis), and FMEA for railway safety-critical systems.
• Ensure projects meet SIL (Safety Integrity Level) requirements and RAM (Reliability, Availability, Maintainability) targets.

6. Innovation & Cost Optimization

• Drive adoption of AI/ML-based predictive maintenance, IoT-enabled sensors, and edge computing in railway systems.
• Optimize BOM costs by selecting industrial-grade SoCs (NXP i.MX, TI Sitara) and modular designs.

7. Manufacturing SOP Compliance

• Ensure adherence to IPC-A-610 (PCB standards) and railway manufacturing SOPs.
• Resolve EMC/EMI issues (EN 50121-3-2) and thermal management challenges in embedded designs.

Qualifications & Experience

• Bachelor’s/Master’s in Electronics/Electrical/Embedded Systems Engineering.
• 12–15 years in embedded hardware/firmware development, preferably in railways or automotive or aerospace.
• Expertise in:
• Processors: ARM Cortex-R (real-time), PowerPC QorIQ, Intel Atom E3900.
• FPGAs: Xilinx Zynq UltraScale+, Microsemi ProASIC3.
• Communication protocols: CAN, Ethernet , MVB, RS-485.
• Experience with IEC 61508, EN 5012x series, and IRIS certification.

Key Competencies

• Technical Leadership in railway embedded systems.
• Safety-Certified Design (SIL-4, ASIL-D).
• Cost-driven innovation with long-lifecycle component strategies.
• Stakeholder management across suppliers (TI, Infineon), OEMs, and certification bodies.