444 Signal Integrity Jobs - Page 7

InfinityX Innovations Pvt Ltd is revolutionizing electric mobility with breakthrough technology, enabling EVs to recharge faster than filling a petrol tank. As a dynamic team of engineers, innovators, and problem-solvers, we are dedicated to making electric vehicles practical, accessible, and future-ready. With patented solutions and a rapidly expanding presence in India's EV startup landscape, InfinityX offers you the chance to build the future of electric mobility. As a part of our team, you will lead the conceptualization, design, and deployment of advanced electronic and embedded systems for transformative ultra-fast charging and intelligent EV platforms. Your responsibilities will include architecting and developing complex electronic systems involving multiple subcomponents, leading full hardware lifecycle activities, solving multidisciplinary challenges, integrating and optimizing sensor networks, developing robust embedded firmware, collaborating with cross-functional teams, staying updated on emerging electronics technologies, and fostering an environment of experimentation and innovation. To excel in this role, you should have demonstrated hands-on leadership in end-to-end development, proficiency in embedded C/C++, circuit simulation, PCB design, rapid prototyping, experience in integrating sensors and networked embedded systems, a strong foundation in EMC/EMI practices, a drive for creative problem-solving, and a passion for pioneering sustainable transport and smart infrastructure. If you are eager to shape the electronics at the heart of the electric mobility revolution, innovate with InfinityX and apply today to build the next generation of ultra-fast EV technology!,

As the Hardware Design Lead at Haystack Robotics, you will be responsible for leading all system hardware design activities for our Autonomous Mobile Robot products. You will work closely with the Software and Industrial Design teams to ensure the success of product development. Your role will involve planning hardware development for new products, executing projects on schedule, and maintaining high quality standards. You will be expected to solve technical issues with a disciplined approach, scope effort, create schedules, oversee test plan execution, and provide regular updates to management. In this position, you will be required to constantly pursue operational efficiency improvements and serve as a role model for disciplined bug/issue tracking and resolution. Additionally, you will lead the hiring process and build a capable team while mentoring junior engineers. To be successful in this role, you should have a minimum qualification of B.E/B-tech in Electronics or a related discipline, with an M.E./M.Tech. preferred. You should have 8 to 10 years of experience in hardware design and validation in robotics or embedded systems. Hands-on experience in all aspects of embedded system hardware development on multiple projects with increasing responsibility and scope is essential, along with exposure to Firmware/Software. Your experience should include embedded system design and integration, working with various components such as CPUs, memory interfaces, USB, MIPI, I2C, UART, SPI, Lidar, cameras, sensors, batteries, Bluetooth/WiFi, and more. You should also have knowledge of processors like i.MX8, nVidia Jetson, Qualcomm Snapdragon, and their subsystem design. Expertise in handling sensor-based design, power supply design, coordination with PCB Layout and Software team, and high-speed design capabilities is required. Experience with FCC/CE/UL certification processes is also necessary. As a Hardware Design Lead, you should be able to translate high-level product requirements into system hardware specifications, evaluate and select components, and utilize bug/issue tracking tools like Mantis and JIRA. Demonstrated leadership experience, effective project management skills, and the ability to mentor and lead teams are key aspects of this role. You should possess strong collaboration skills, the ability to influence others, and a track record of achieving results in a fast-paced, start-up environment.,

You should have a strong background in x86 Board design with a solid foundation and experience in the analysis of Digital and Power Electronic circuits. It is important to have an understanding of signal integrity, EMI/EMC concepts for both Digital and Power Electronics. You should have experience in at least one complete project, from high-level design to final validation. Your responsibilities will include independently handling schematic design, design analysis, coordinating reviews with peer designers, Layout, SI, and EMC teams. Experience in board bring-up, issue investigation & triage, in coordination with firmware and software teams is essential. You should also be proficient in preparing and reviewing hardware design documentation and issue investigation reports. You must be capable of developing the board bring-up plan, identifying required test equipment, and executing tasks independently. Strong communication and interpersonal skills are necessary to effectively collaborate with various cross-functional teams, including post-silicon IP Validation, BIOS, and Driver Development/QA teams.,

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. 7-14 yrs experience in Physical Design and timing signoff for high speed cores. Should have good exposure to high frequency design convergence for physical design with PPA targets and PDN methodology. Masters/Bachelors Degree in Electrical/Electronics science engineering with at least 7+ years of experience in IC design. Experience in leading block level or chip level Physical Design, STA and PDN activities. Work independently in the areas of RTL to GDSII implementation. Ability to collaborate and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Knowledge of low power flow (power gating, multi-Vt flow, power supply management etc.) Circuit level comprehension of time critical paths in the design Understanding of deep sub-micron design problems and solutions (leakage power, signal integrity, DFM etc.) Tcl/Perl scripting Willing to handle technical deliveries with a small team of engineers. Strong problem-solving skills. Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

As an Electronics Embedded Engineer, you will have the opportunity to work with Eeki (One of Uplers" Clients) in an office setting located in Kota. You will play a vital role in designing and testing embedded hardware interfaces for sensors and communication modules. Your responsibilities will include developing Product Requirement Documents (PRDs), system architecture, and supporting documentation throughout the product development lifecycle. You will be involved in schematic design, PCB layout, component selection, Bill of Materials (BOM) creation, Gerber file generation, and managing PCB manufacturing and assembly. Additionally, you will oversee board bring-up activities, manage vendors, handle import logistics for electronic components, plan project budgets, define test strategies, design custom test jigs, and manage product certification processes. The ideal candidate must possess skills in UART, Embedded Linux, SPI, I2C, Raspberry Pi, Eagle, and developing Product Requirement Documents (PRDs). You should also have experience in PCB bring-up, debugging, and validation, power optimization, signal integrity, and hardware integration of edge AI systems. Proficiency in schematic and PCB design tools such as Altium Designer, KiCAD, and Eagle is required for this role. In addition, there is an opportunity for a Manufacturing & Field Deployment Lead position where you will be responsible for developing low-level firmware for precise control and interfacing of sensors and camera modules. You will optimize and deploy edge machine learning (ML) models on embedded platforms like NVIDIA Jetson Nano and Raspberry Pi. Managing hardware interfaces for wireless connectivity, implementing Over-The-Air (OTA) update mechanisms, and designing strategies for efficient power management across edge computing systems and sensor networks are also crucial aspects of this role. To apply for this opportunity, follow the easy 3-step process: 1. Click on Apply! and register or log in on the portal. 2. Upload your updated resume and complete the screening form. 3. Increase your chances of getting shortlisted and meeting the client for an interview. If you are passionate about your work, eager to learn and grow, and committed to delivering exceptional results in the field of Electronics Embedded Engineering, this is the perfect opportunity for you. Join Eeki and be a part of a dynamic team that values innovation and excellence. Apply today and take your career to the next level with Uplers!,

As an Electronic Embedded Engineer at Eeki, you will be responsible for designing and testing embedded hardware interfaces for sensors and communication modules. Your key duties will include developing Product Requirement Documents (PRDs), system architecture, and supporting documentation throughout the product development lifecycle. You will also be involved in schematic design, PCB layout, component selection, Bill of Materials (BOM) creation, Gerber file generation, and managing PCB manufacturing and assembly. Additionally, you will oversee board bring-up activities, manage vendors, handle import logistics for electronic components, plan project budgets, define test strategies, design custom test jigs, and manage product certification processes. To excel in this role, you must possess skills in UART, Embedded Linux, SPI, I2C, Jetson Nano, Raspberry Pi, Altium Designer, KiCAD, Eagle, and developing PRDs. Your qualifications should include expertise in embedded Linux, PCB bring-up, debugging, validation, power optimization, signal integrity, and hardware integration of edge AI systems. Familiarity with schematic and PCB design tools such as Altium Designer, KiCAD, and Eagle is essential. Furthermore, as a Manufacturing & Field Deployment Lead, you will be responsible for developing low-level firmware for precise control and interfacing of sensors and camera modules. Your role will involve optimizing and deploying edge machine learning (ML) models on embedded platforms, managing hardware interfaces for wireless connectivity, implementing Over-The-Air (OTA) update mechanisms, and designing strategies for efficient power management across edge computing systems and sensor networks. To succeed in this position, you should have proficiency in C/C++ for embedded firmware, edge ML frameworks (TensorRT, OpenCV, PyTorch Lite), connectivity protocols (MQTT, HTTP, custom serial protocols), OTA frameworks, and power profiling techniques. The roles are based in Kota, Rajasthan, with a salary range of INR 4-6 LPA. The working hours are Monday to Saturday from 10 am to 6 pm. To apply for these opportunities, click on Apply! on the portal, register or login, complete the Screening Form, and upload your updated resume to increase your chances of getting shortlisted for an interview. Uplers is dedicated to simplifying and expediting the hiring process, providing support to all talents in finding and applying for relevant contractual onsite opportunities to advance their careers. If you are seeking a new challenge, a supportive work environment, and a chance to elevate your career, apply today and seize the opportunity to grow with us.,

Senior Hardware Engineer Location: Hyderabad Age : 30+ years Experience : 5-10+ years Languages : English, Hindi and Telugu Qualification : Electronics Engineering Target Salary : 12 lacs Activities: Independent System Design and planning Independent board design, selection of parts Coordinate for design analysis reliability, thermal, signal integrity, power analysis, FMEA Coordinate with the program manager for providing inputs to project plan Review and track the projects periodically with concerned team members Prepare detailed work breakdown structure (WBS) and time schedule Review and track the projects periodically with concerned team members Interact with the customer to gather requirements, communicate the design, work status Manage project team hardware team members, mechanical team, software team members Skill Sets Understand product design from initial concept to manufacturing Should have worked in Processor based design, high speed board design, Microcontroller/FPGA Based Board Design, Analog and digital circuit design Good tool knowledge in minimum one EDA tool Part Selection, Schematics Drafting, Layout Review Should have worked in multi-layer board design, SI, PI and thermal analysis Knowledge of protocols UART, SPI, I2C, Wi-Fi, Ethernet, USB etc. Knowledge on memory device like DDR, Nor flash, eMMC Knowledge of Communication protocols (USB, Ethernet, MIL-STD-1553, ARINC-429, ARINC-717 etc.), interfaces with peripheral devices like memories, ADC etc. To provide guidance and technical assistance to Team Members Preparation of required design documentation Additional Skill Sets for FPGA Engineers In depth understanding of FPGA architecture and FPGA based design and verification flow. Strong knowledge in RTL(FPGA/SOC/IP) design architecture and coding experience in VHDL or Verilog Should have experience in FPGA board bring up and board level debugging of FPGA designs Should have worked on functional simulation timing simulations, etc. Analysis Timing Analysis, Signal Integrity Analysis and knowledge on high-speed digital design are added benefits.

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: ASIC Design. Experience: 3-5 Years.

Description The Bonding/RDL Routing/Package Interface role is crucial for developing innovative packaging solutions in the semiconductor industry. The candidate will be responsible for designing and optimizing bonding and routing strategies, ensuring effective integration of package interfaces, and collaborating with various teams to deliver high-quality products. Responsibilities Design and optimize bonding and routing strategies for advanced packaging solutions. Collaborate with cross-functional teams to ensure seamless package interface integration. Analyze and troubleshoot issues related to RDL routing and bonding processes. Develop and maintain documentation for bonding and routing methodologies and best practices. Conduct testing and validation of package interfaces to ensure reliability and performance. Skills and Qualifications Bachelor's degree in Electrical Engineering, Electronics, or a related field. Strong understanding of semiconductor packaging processes and materials. Proficiency in CAD tools for layout design and simulation (e.g., Cadence, Mentor Graphics). Experience with RDL (Re-distribution Layer) design and bonding techniques. Knowledge of electrical and thermal performance analysis for package interfaces. Familiarity with IPC standards related to electronic packaging.

We are seeking a skilled and highly motivated Physical Design Engineer to join our team. The ideal candidate will be responsible for the independent planning and execution of the entire Netlist-to-GDSII flow, demonstrating a strong understanding of all physical design aspects and methodologies. This role requires technical expertise, problem-solving abilities, and the capacity to guide junior engineers. Roles and Responsibilities: Responsible for independent planning and execution of the Netlist-to-GDSII flow. Demonstrate strong exposure to all aspects of design flows, including floor planning, placement, Clock Tree Synthesis (CTS), routing, crosstalk analysis, and physical verification . Possess good exposure to high-frequency design convergence and a solid understanding of physical design methodology . Work independently in all areas of RTL to GDSII implementation . Exhibit the ability to collaborate effectively and resolve issues related to constraints validation, verification, Static Timing Analysis (STA), and overall physical design. Apply knowledge of low power flow concepts such as power gating, multi-VT flow, and power supply management . Possess circuit-level comprehension of time-critical paths within the design. Utilize Tcl/Perl scripting for automation and efficiency. Be willing to handle technical deliveries and provide guidance to a team of engineers. Be well-versed with level timing closure (STA) , various timing closure methodologies , and ECO (Engineering Change Order) generation for predictable convergence. Be well-versed with parasitic extraction, LVS (Layout Versus Schematic)/DRC (Design Rule Checking) , and other Physical Verification checks . Provide clear directions to the team regarding Place & Route (PNR) issues . Understand deep sub-micron design problems and solutions , including leakage power, signal integrity, and DFM (Design For Manufacturability) . Education: B.E/B.Tech or M.E/M.Tech/M.S in Electrical or Electronics engineering.

This role involves designing innovative and efficient printed circuit boards that meet high performance, reliability, and manufacturing standards. You will be responsible for the final output review and design documentation preparation, as well as designing and developing printed circuit boards (PCBs) tailored to product performance, quality, and cost targets. Collaboration with cross-functional teams across different locations is essential to ensure timely project execution. Working closely with hardware and firmware engineers, you will create schematic diagrams based on project requirements. Utilizing advanced PCB design software, you will create precise and manufacturable board layouts, focusing on component placement and routing with an emphasis on signal integrity and thermal management. Optimization of board layout for manufacturability, assembly, and cost-efficiency is a key aspect of this role. Symbol creation, schematic drawing, footprint assignment, and board outline creation based on DXF or design drawings are also part of the responsibilities. Identifying and resolving layout-related design issues in collaboration with the engineering team is crucial, as well as supporting the continuous improvement of internal design standards and workflows. Preparing designs for design reviews and manufacturing hand-off and staying updated with the latest in PCB materials, processes, and IPC standards are also important aspects of the role. Desired Candidate Profile: The ideal candidate will have experience in designing high-density boards involving microcontrollers, mixed analog/digital circuits, and interfaces such as Ethernet, USB, I2C, SPI, etc. Proficiency in designing RF, analog, and mixed-signal PCBs is required, along with skills in PCB design tools such as OrCAD, Altium, or DipTrace. Understanding impedance-controlled circuits, stack-up trade-offs, and panel optimization is essential. A strong grasp of PCB layout best practices, signal integrity, and thermal management is necessary, as well as familiarity with IPC standards and design for manufacturability principles. Knowledge in minimizing EMI/RFI and ESD through effective design, identifying and addressing mechanical challenges in PCB design, being detail-oriented, and having excellent verbal and written communication skills are important qualities. A solid foundation in basic electronics and electromagnetics is also essential. Work Location: Ahmedabad, Gujarat Educational Qualification: Bachelor's degree in Electrical Engineering, Electronics, or a related field (preferred). Industry: Electronics,

Experience in PCB design, including high-speed, RF, and mixed-signal designs Expertise in EMC/EMI mitigation, signal integrity, and power integrity Proficiency with PCB design software Altium, Allegro, KiCad Strong in DFM, DFA and material selection

Experience: 3 6 Years Location: Pune Joining: Immediate Work Location / Mode of Work Hinjewadi / Work from office Key Responsibilities: Design and layout of multi layer PCBs for EV powertrain modules (inverters, BMS, DC DC converters, OBC, motor controllers) Collaborate with hardware/thermal engineers and cross-functional teams to optimize layout Create schematics, footprints, BOMs; ensure DFM/DFT and high-speed design compatibility Coordinate with PCB manufacturers for prototyping and compliance Ensure designs follow IPC standards and EMI/EMC considerations Required Skills: Proficiency in PCB design tools (Altium, OrCAD, Allegro, etc.) Experience in power electronics, signal integrity, thermal constraints Familiarity with EMI/EMC compliance and automotive design practices Xpetize is a technology solutions company, supporting customers in IoT, application and engineering services, data services, cybersecurity, cloud and social services. We are headquartered in Trivandrum with offices in Bengaluru, Pune, USA and Japan. We work tirelessly to help our customers across the globe since 2011 and relentlessly trying to grow our expertise across geographies. Our flagship Industry 4.0 product XPETICS, is a fully managed IIoT platform that lets customers securely connect and process IoT data at scale. We have a flexible and open work culture, lots of fun, flexi work hours, up skilling programs, medical insurance for family and parents and ensuring work life balance.e

As a Lead Analog Validation Engineer, you should have a minimum of 7 years of experience and hold a Bachelors or Masters degree in Electronics or Electronics & Communication. Your expertise should include a strong understanding of electrical circuit analysis, design, and test fundamentals. You must be proficient in automating Analog Characterization Setups using Labview and Test Stand, and have strong debugging and problem-solving skills. Your responsibilities will include bringing up Silicon & Analog Validation Platforms for new ASIC/SoC designs, developing bench characterization test methodologies for various Analog IPs such as ADC, DAC, PLL, USB, VREG, OSC, DDR, LOW POWER, and IO PADs. You will also be required to develop automated code to control test equipment and generate required PVT electrical parameters. Additionally, you should possess expertise in using test & measurement equipment for Analog Validation, PVT characterization of Analog IPs, and have experience in Multilayer Board design, testing, integration, and Signal Integrity issues. Knowledge of C programming is essential for this role. Strong leadership and planning skills are crucial as you will be expected to deliver timely results in lead positions. You will work closely with cross-functional teams including marketing, systems, design, test, and project management to support the successful launch of new products. Your ability to communicate effectively with individuals from diverse backgrounds and strong team-building skills are essential for this role. Your motivation and energy to tackle bench characterization challenges on stand-alone/automated setups will be key to success in this position.,

You will be part of Kinara, a Bay Area-based venture backed company, founded based on research conducted at Stanford University. Kinara's game-changing AI solutions aim to revolutionize what individuals and businesses can accomplish. Their Ara inference processors, combined with an innovative SDK, offer unparalleled deep learning performance at the edge. This enables the acceleration and optimization of real-time decision-making, emphasizing the importance of speed and power efficiency. By embedding high-performance AI into edge devices, Kinara contributes to creating a smarter, safer, and more enjoyable world. As the field of Edge AI is on the verge of a significant growth phase, Kinara is poised to play a pivotal role in this evolution. Your responsibilities will include the physical design of complex data path and control blocks, development of new techniques and flows for rapid hardware prototyping, creation of flows enabling detailed power estimation, collaboration with the design team to understand placement and recommend implementation options, as well as engagement with external teams to drive and deliver subsystems leading to chip tapeout. Preferred qualifications for this role include a BTech/MTech degree in EE/CS with at least 8 years of experience in Physical Design. You should possess extensive knowledge of Automated synthesis, Technology mapping, Place-and-Route, and Layout techniques, along with skills in Physical verification and quality checks such as LVS, DRC, IR drop, Clock tree synthesis, Power mesh design, and Signal integrity. Familiarity with the latest foundry nodes up to 7nm is desirable, as well as hands-on experience with various design aspects including Synthesis, Place-and-route, Full Chip STA, IO Planning, Floorplan, Power Mesh creation, Bump Planning, RDL Routing, and Low power design flows. Strong expertise in advanced digital design architectures and clocking structures is essential to manage timing and physical design constraints effectively. Furthermore, you should be able to collaborate with designers to analyze and explore physical implementation options for complex designs, possess basic knowledge of DFT techniques, and be familiar with industry-standard PnR, Synthesis, and TCL Scripting tools. Strong communication skills and the ability to work well in a team are also crucial. At Kinara, the work culture is centered around fostering innovation. The environment encourages professionals to tackle exciting challenges under the guidance of technology experts and mentors. The company values diverse perspectives and shared responsibilities, creating a collaborative and inclusive atmosphere where every individual's input is respected and appreciated. If you are passionate about making an impact and are eager to take on rewarding challenges, Kinara awaits your application eagerly. Join Kinara and be a part of a dynamic team that values innovation, collaboration, and personal growth. Your unique skills and experiences will contribute to shaping the future of AI solutions and advancing the field of Edge AI. Share your story with us, and let's work together to create a smarter, safer, and more enjoyable world.,

The ideal candidate for this position should have at least 7+ years of experience in the field. The location for this role includes Bangalore, Delhi NCR, and Hyderabad with 8-10 openings available. The preferred education qualifications are BE/B.Tech./MS/M.Tech. in Electronics or Electronics & Communication. **Required Basic Qualification & Skills:** - Strong understanding of electrical circuit analysis, design, and test fundamentals - Automation of Analog Characterization Setups using Labview and Test Stand - Strong debugging and problem-solving skills - Experience in bring up of Silicon & Analog Validation Platforms - Proficiency in C programming - Leadership and planning skills for timely results delivery **Additional Preferred Qualifications:** - Expertise in using test & measurement equipment for Analog Validation - PVT characterization experience of Analog IPs like ADC, DAC, PLL, USB, VREG, OSC, DDR, LOW POWER, and IO PADs - Good debugging exposure and root cause analysis for new analog designs - Knowledge of Multilayer Board design, testing, integration, and Signal Integrity issues - Experience with LabVIEW and Test Stand automation software - Working experience in a lab environment **Primary and Secondary Responsibilities:** - Develop unique bench characterization test methodologies for Analog IPs - Write automated code for controlling test equipment during data collection and processing - Perform Design Evaluation and Bench Characterization for Analog IPs - Provide requirements and review schematics for circuit board development **Other Complex Tasks:** - Provide customer application note support by generating characterization data - Collaborate with cross-functional teams for successful product launches **Team and People Skills:** - Strong team-building skills and effective communication abilities are essential for this role.,

You are a highly skilled and motivated Analog Design Engineer who thrives at the intersection of innovation and precision. Your background in analog design fundamentals and deep knowledge of device physics allow you to tackle complex circuit design challenges with confidence. You possess a track record of successful high-speed IO designs and have hands-on experience working with advanced technologies such as CMOS, FinFET, and GAA. Your expertise extends to ESD and reliability concepts, and you are we'll-versed in JEDEC requirements for memory interfaces enabling you to design robust, standards-compliant solutions. Collaboration is central to your approach. You excel in diverse, global teams, sharing your insights while listening and learning from others. Analytical thinking and creative problem-solving are your hallmarks, and you approach each task with a meticulous attention to detail. You are adaptable, continuously seeking to stay ahead of industry trends and technological advancements. Your communication skills allow you to clearly articulate complex technical concepts to both technical and non-technical stakeholders, making you an invaluable bridge within cross-functional teams. Above all, you are driven by a passion for innovation, eager to contribute to projects that push the boundaries of what s possible in semiconductor technology. What you'll Be Doing: Developing next-generation high-speed memory interface PHY IPs, including DDR, HBM, and UCIe standards. Executing projects in advanced semiconductor technologies, leveraging strong analytical and problem-solving skills. Designing high-speed IOs for memory interface PHY IP in CMOS, FinFET, and GAA process nodes. Collaborating with cross-functional and global teams to achieve ambitious project goals and timelines. Ensuring exceptional product quality and efficiency in all analog design tasks from concept to implementation. Staying informed and responsive to the latest industry standards, best practices, and technological advancements. Participating in design reviews, mentoring junior engineers, and contributing to a culture of technical excellence. The Impact You Will Have: Drive the development and delivery of innovative, industry-leading high-speed memory interface PHY IPs. Enable integration of advanced capabilities into complex SoCs, helping customers achieve unique performance goals. Enhance performance, power efficiency, and area optimization in mission-critical applications. Accelerate time-to-market for differentiated products by reducing design risk and streamlining development cycles. Foster effective collaboration with global teams, ensuring high-quality and reliable products. Set new industry benchmarks through cutting-edge analog design technologies and methodologies. What you'll Need: BTech/MTech degree in Electrical Engineering, Electronics, or a related field. At least 3 years of experience in analog design fundamentals and device physics. Proven proficiency in high-speed IO designs using advanced semiconductor technologies. Hands-on experience with ESD protection and reliability concepts in circuit design. Strong knowledge of JEDEC requirements and memory interface standards (DDR/HBM/UCIe). Familiarity with signal integrity and/or power integrity concepts is a plus. Who You Are: An analytical thinker with exceptional problem-solving skills and technical curiosity. A collaborative team player who communicates effectively and values diverse perspectives. Detail-oriented and capable of executing tasks with high precision and efficiency. Adaptable and eager to learn and master new technologies and industry standards. Passionate about driving innovation and making an impact through technology Health & we'llness Comprehensive medical and healthcare plans that work for you and your family. Time Away In addition to company holidays, we have ETO and FTO Programs. Family Support Maternity and paternity leave, parenting resources, adoption and surrogacy assistance, and more. ESPP Purchase Synopsys common stock at a 15% discount, with a 24 month look-back. Retirement Plans Save for your future with our retirement plans that vary by region and country. Compensation Competitive salaries

Design and develop complex multilayer PCB HDI layouts (analog, digital, RF, power electronics) as per layout guidelines. Creating ECU layouts for automotive applications Collaborate with hardware engineers, signal integrity experts, and manufacturing teams to ensure designs meet performance, manufacturability (DFM), and testability (DFT) requirements. Worked on high-speed PCB design, impedance control, power planes, and signal integrity. Participate in design reviews, continuous improvement initiatives. Interface with PCB manufacturers and vendors for prototype procurement and cost optimization.

Job Requirements Key Responsibilities: Execute floorplanning, power planning, placement, CTS, routing, DRC/LVS, and timing closure for blocks/subsystems. Work on multi-voltage designs using UPF, level shifters, isolation cells, and retention strategies. Perform timing analysis and closure using PrimeTime and support IR/EM/Noise closure under guidance. Collaborate with DFT/RTL/STA teams to resolve integration and physical challenges. Run power optimization techniques at synthesis and post-route stage. Support subsystem-level integration and participate in debug and convergence discussions. Write scripts (Python, Tcl) for flow automation, data mining, and report generation. Required Skills: Hands-on experience with full RTL-to-GDS flow using Fusion Compiler, Innovus. Working knowledge of low power flows, UPF, VCLP, power intent checks. Familiarity with timing closure concepts, signal integrity, and power optimization. Good scripting skills in Python/Tcl/Perl for design automation. Enthusiastic team player with strong analytical and debugging skills. Work Experience Key Responsibilities: Execute floorplanning, power planning, placement, CTS, routing, DRC/LVS, and timing closure for blocks/subsystems. Work on multi-voltage designs using UPF, level shifters, isolation cells, and retention strategies. Perform timing analysis and closure using PrimeTime and support IR/EM/Noise closure under guidance. Collaborate with DFT/RTL/STA teams to resolve integration and physical challenges. Run power optimization techniques at synthesis and post-route stage. Support subsystem-level integration and participate in debug and convergence discussions. Write scripts (Python, Tcl) for flow automation, data mining, and report generation. Required Skills: Hands-on experience with full RTL-to-GDS flow using Fusion Compiler, Innovus. Working knowledge of low power flows, UPF, VCLP, power intent checks. Familiarity with timing closure concepts, signal integrity, and power optimization. Good scripting skills in Python/Tcl/Perl for design automation. Enthusiastic team player with strong analytical and debugging skills.

Ansys is looking for Product Specialist - HFSS, Python, Software Quality to join our dynamic team and embark on a rewarding career journey Product Knowledge: Develop a deep understanding of the product's features, specifications, use cases, and benefits to effectively convey its value to customers Product Presentations: Deliver engaging and informative presentations to showcase the product's capabilities and demonstrate how it addresses customers' needs Customer Education: Educate customers, clients, or end-users about the product's functionality, installation, setup, and troubleshooting Sales Support: Assist sales teams by providing product expertise, participating in client meetings, and addressing technical inquiries Technical Support: Offer technical assistance to customers, guiding them through any challenges, concerns, or issues related to the product Product Training: Conduct training sessions for internal teams, partners, and customers to ensure proper product usage and maximize its potential Market Research: Stay informed about industry trends, customer preferences, and competitive products to make informed recommendations for product enhancements

TechiesDesigns Electronics is looking for PCB Design Engineer to join our dynamic team and embark on a rewarding career journey Design and develop printed circuit board (PCB) layouts for electronic products and systems Collaborate with cross-functional teams, including electrical engineers, mechanical engineers, and product managers, to gather requirements and specifications Create schematics and circuit designs based on system requirements and electrical design principles Perform component selection, considering factors such as functionality, cost, availability, and manufacturability Generate PCB layouts using design software tools such as Altium Designer or Cadence Allegro Ensure proper placement and routing of components to meet electrical, mechanical, and thermal constraints Conduct design reviews and collaborate with engineers to optimize PCB designs for performance and manufacturability Incorporate design considerations for signal integrity, power integrity, and electromagnetic compatibility (EMC) Generate and review manufacturing files, including Gerber files, assembly drawings, and bill of materials (BOM) Collaborate with PCB fabrication and assembly vendors to ensure successful production and assembly of PCBs Perform design verification and validation activities, including design rule checks (DRC), electrical simulations, and prototyping Troubleshoot and debug PCB issues during development, testing, and production phases Stay updated with industry trends, standards, and technologies related to PCB design Contribute to process improvement initiatives to enhance design efficiency and quality Maintain accurate documentation and revision control of PCB designs and associated files Ensure compliance with regulatory requirements and industry standards in PCB design

Hi, Greetings from Thales India Pvt Ltd.....! We are hiring for Technical Lead - Mixed Signal Design Engineer for our Engineering competency center for Bangalore location . JOB Description: Thales India Engineering Competency Center in Bangalore is seeking a Tech Lead Engineer role. In this role you will be responsible for generating reliable, cost effective, customized Electronics systems design, Obsolescence redesign for Defense products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.). You also perform trade analysis of design approaches, engineering simulations & modeling, derating analysis before finalizing the design. Qualifications: B.Tech in Electronics & Communication or Electrical engineering or equivalent with 8 to 12 years of relevant experience. Higher qualifications of Post-graduation and PhD are desirable. Working experience in Avionics and Defense systems design is desirable Location: Thales India Private Limited, Richmond Town, Bengaluru, Karnataka 560025. Technical Skills and Competencies: Must have strong experience in Product design and development from requirements to Conceptual design to architectural design to detailed design and analysis Must have strong experience in designing low to high power analog electronic boards (for example, power supply, signal processing etc) for Defense / avionics Industry Must have Strong knowledge in Specification, design and verification of electronic boards (including digital functions) Must have strong knowledge of using simulation tools (SPICE, ANSYS etc) for functional simulation signal integrity and power integrity analyses Must have working experience of product performance evaluation (Hardware Verification) and product qualification to comply to DO-160 and DO-254 standards Must have excellent troubleshooting skills on Electrical / Electronic boards to find the root cause and to propose the best solution Should have experience of working with multi-disciplinary team (Mechanical team for thermal analysis & enclosures design, PCB layout team and suppliers) Should have an understanding and use of DFMEA, DFT and DFM tools Definition and choice of components (including derating) Definition of electrical schematics and building blocks Boards place&route (including signal integrity) Manufacturing failures analysis / Root cause analysis Test procedures definition and execution Component obsolescence treatment : alternative solution identification, definition/design of the solution, verification Profile/Skills Analog Electronic Engineering Skills and ability. Mastering of electronic simulation and design software (Cadence, Allegro, ANSYS, PSPICE/LTSPICE) Knowledge or Defense, aeronautics constraints (MIL-STD, DO160, DO254) Design for manufacturing Design for environmental requirements including EMC General understanding of Engineering Development lifecycles including design, development, testing, verification and validation phaseshales India Engineering Competency Center in Bangalore is seeking a Technical Lead role to be part of Hardware engineering team. In this role he/she will be responsible for generating reliable, cost effective, customized Electronics systems design, Obsolescence redesign for avionics products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.).

Hi, Greetings from Thales India Pvt Ltd.....! We are hiring for Senior Engineer/Technical Lead - Digital Circuit design for our Engineering competency center for Bangalore Richmond Road location. JOB Details: Thales India Engineering Competency Center in Bangalore is seeking a Technical Lead engineer role to be part of Hardware engineering team. In this role you will be responsible for design and development of reliable, cost effective, customized products for Defense & avionics applications. Electronics systems design, Obsolescence redesign for Defense / avionics products to meet the customer requirements as well as governing regulatory standards (DO-160, DO-254, MIL-STD, etc.). You also perform trade analysis of design approaches, engineering simulations & modeling, derating analysis before finalizing the design. Qualifications: B.Tech in Electronics & Communication or Electrical engineering or equivalent with 5 to 10 years of relevant experience. Higher qualifications of Post-graduation and PhD are desirable. Working experience in Defense / Avionics domain is desirable Technical Skills and Competencies: Must have strong experience in Electronic design and development from requirements to Conceptual design to architectural design to detailed design and analysis Must have strong experience in the hardware design, development and testing of high speed digital electronic circuits including microprocessors, microcontrollers, FPGA and embedded firmware. Must have hands on experience in product design, board level testing, integration and validation testing including development of test plans and Pass/fail criteria. Must have strong knowledge of using Design and simulation tools Must have working experience of product performance evaluation (Hardware Verification) to comply to DO-160 or MIL-STD standards Must have excellent troubleshooting skills on Electrical / Electronic boards to find the root cause and to propose the best solution Should have experience of working with multi-disciplinary team ( Mechanical, PCB layout, Systems engineering and suppliers) Should have an understanding and use of DFMEA, DFT and DFM tools Definition and choice of components (including derating) Definition of electrical schematics and building blocks Boards place&route (including signal integrity) Manufacturing failures analysis / Root cause analysis Test procedures definition and execution Component obsolescence treatment : alternative solution identification, definition/design of the solution, verification Profile/Skills Digital Electronic Engineering Skills and ability. VHDL coding, Timing analysis Mastering of electronic simulation and design software (Cadence, Allegro, ANSYS, PSPICE/LTSPICE) Knowledge or Defense & aeronautics constraints (MIL-STD, DO160, DO254) General understanding of Engineering Development lifecycles including design, development, testing, verification and validation phases

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. DESIRED S Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Bachelors degree in Electrical Engineering. Should have total work experience of 3-5+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Competencies

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Bachelors degree in Electrical Engineering or equivalent work experience 5 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently DESIRED S: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Competencies