444 Signal Integrity Jobs - Page 9

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profie: Qualifications: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: Analog Circuit design. Experience: 1-3 Years.

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: VLSI Board Design. Experience: 3-5 Years. >

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: Analog Layout. Experience: 1-3 Years. >

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industrytargeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelors degree in electrical engineering or equivalent work experience; Masters degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNAs and TDRs Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

Job role: Handle current portfolio of Light Commercial Vehicles Handling the loans of Commercial (Used/New). Handle the whole process of providing Vehicle loan to customers. Follow up EMI customers & arrears customers for collection. Developing the new market area and gathering market information. Always try to make new market to generate sales. Making good relation with Dealers and also with existing Clients.

, multi-voltage domain designs., multiple PVT conditions using Tempus. , STA tools - Tempus, cross-talk noise, Signal Integrity, Layout Parasitic Extraction,

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience.PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains"“ LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux- Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications 8+ years Hardware Engineering experience or related work experience. 6+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Responsibilities: STA setup, convergence, reviews and signoff for multi-mode, multi-voltage domain designs. Timing analysis, validation and debug across multiple PVT conditions using PT/Tempus. Run Primetime and/or Tempus for STA flow optimization and Spice to STA correlation. Evaluate multiple timing methodologies/tools on different designs and technology nodes. Work on automation scripts within STA/PD tools for methodology development. Good Technical writing and Communication skills, should be willing to work in cross-collaborative environment Experience in design automation using TCL/Perl/Python. Familiar with digital flow design implementation RTL to GDS ICC, Innovous , PT/Tempus Familiar with process technology enablementCircuit simulations using Hspice/FineSim, Monte Carlo. Education B.Tech or MTech/MS in Electrical/Electronics/Microelectronics/VLSI. Preferred Qualification/Skills Strong expertise in STA timing analysis basics, AOCV/POCV concepts, CTS, defining and managing timing constraints, Latch transparency handling, 0-cycle, multi-cycle path handling Hands-on experience with STA tools - Prime-time, Tempus Have experience in driving timing convergence at Chip-level and Hard-Macro level In-depth knowledge cross-talk noise, Signal Integrity, Layout Parasitic Extraction, feed through handling, Knowledge of ASIC back-end design flows and methods and tools (ICC2, Innovus) Knowledge of Spice simulation Hspice/FineSim, Monte Carlo. Silicon to spice model correlation. Proficient is scripting languages- TCL, Perl, Awk Basic knowledge of device physics Applicants Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Technically Lead team of experienced IO Design Engineers Strategic development of next generation IO for scaling speed Build Best in Class IP Design Handling BU communication on all IO Roadmap, RMA, FA Drive E/E IO Design capability and execution till Silicon to Productization Capability (technical/leadership skills) to drive IO Design in project as Project Lead Qualifications Bachelors/Masters degree in Electronics & Telecommunication/Electrical engineering (VLSI Design) Extensive Hands-on design experience in IO Design High Speed Design concepts (LVCMOS, HVCMOS, D

Handle current portfolio of Small Commercial Vehicles Handling the loans of Commercial (Used/New). Handle the whole process of providing Vehicle loan to customers. Follow up EMI customers & arrears customers for collection. Developing the new market area and gathering market information. Always try to make new market to generate sales. Making good relation with Dealers and also with existing Clients

Handle current portfolio of Small Commercial Vehicles Handling the loans of Commercial (Used/New). Handle the whole process of providing Vehicle loan to customers. Follow up EMI customers & arrears customers for collection. Developing the new market area and gathering market information. Always try to make new market to generate sales. Making good relation with Dealers and also with existing Clients

Job role: Handle current portfolio of Light Commercial Vehicles Handling the loans of Commercial (Used/New). Handle the whole process of providing Vehicle loan to customers. Follow up EMI customers & arrears customers for collection. Developing the new market area and gathering market information. Always try to make new market to generate sales. Making good relation with Dealers and also with existing Clients.

Strong understanding of electrical circuit analysis, design, and test fundamentals. Working knowledge on Analog, Digital Electronics, Knowledge in C, experience in either characterization or signal integrity, ADC, DAC, PLL, LOW POWER and IO PADs.

As a Senior Engineer, Signal Integrity at Micron Technology, you will be part of the inclusive culture that drives the innovation of memory and storage solutions. Your role within the Signal Integrity Research and Development (SI R&D) group will involve supporting various product developments, including DRAM, LPDRAM, NAND, CXL, LPCAMM, DIMM modules, and SSDs across different business sectors. Your responsibilities will include analysis of end-to-end systems solutions, circuit level IO and Power Distribution, integrated circuit packages, printed circuit boards, and measurements to ensure optimal Signal Integrity (SI) and power integrity (PI) performance for Micron's memory solutions. Working within the Signal Integrity team, you will be tasked with various aspects of SI and PI for high-speed interfaces, including modeling at silicon, package, and board levels, time and frequency domain analysis, electrical performance evaluation, and correlation to measurements for different products. You will collaborate with global teams for the development and optimization of methodologies, represent the SI R&D team in cross-functional groups, and integrate with various departments to ensure overall product performance. Successful candidates for this position will possess a Bachelor's or Master's degree in Electrical/Electronics Engineering with 4-8 years of experience. You should have a strong background in SI/PI/EMI theory and application, modeling, analysis, simulation, and a deep understanding of electromagnetic and transmission line theory. Experience with E.M. field solvers, simulation tools, and lab equipment is required. Additionally, familiarity with statistical analysis tools and experience in high-speed interface design and analysis are beneficial. The ideal candidate will be proactive in identifying gaps and opportunities, collaborate effectively with global teams and customers, and communicate complex issues and solutions clearly in both written and verbal formats. If you are ambitious, possess strong problem-solving skills, and enjoy taking ownership of projects, this role at Micron Technology may be the perfect fit for you. Micron Technology, Inc. is a leading industry player in memory and storage solutions, committed to transforming how information enriches life for all. With a focus on technology leadership and operational excellence, Micron delivers high-performance DRAM, NAND, and NOR memory and storage products that power innovations in artificial intelligence and 5G applications. For more information about Micron Technology and potential career opportunities, please visit micron.com/careers. If you require assistance during the application process or need reasonable accommodations, please contact hrsupport_india@micron.com. Micron strictly prohibits the use of child labor and adheres to all applicable labor laws and standards.,

Position Overview: As an Application Engineer (AE), you will play a vital role in providing exceptional pre-sale and post-sale support for Electronic Design Automation (EDA) tools, specifically focused on Schematic Entry, PCB Design, and Libraries used in printed circuit board (PCB) development. You will collaborate closely with high-profile customers, delivering technical expertise and ensuring their success through various support channels. Key Responsibilities : Pre-Sales Support: Actively engage with customers to understand their success criteria and tailor solutions that drive customer satisfaction. Deliver compelling presentations and product demonstrations to prospective and existing customers, showcasing the latest products and updates. Gather and analyze feedback from customers for continuous improvements in our product offerings and services. Provide proactive technical guidance to sales teams throughout the sales process. Customer Support: Deliver world-class support as part of a collaborative team based in both India and the USA. Employ innovative problem-solving techniques, leveraging your domain knowledge to address complex customer issues effectively. Guide technical training sessions and workshops to enhance customer understanding and product utilization. Investigate and document customer issues, proposing workarounds and identifying bugs/enhancements, while creating supporting documentation and instructional videos. Stay informed on industry trends in design flow and methodologies, offering insights for product and service improvements. Technical Skills: Strong expertise in the Cadence PCB toolset, including Allegro and OrCAD, with a solid understanding of PCB design flows. Proven analytical skills to evaluate customer environments and recommend tailored support solutions. Ability to architect design flows and address potential technical challenges proactively. Qualifications: Minimum of 2 to 5 years of experience using Cadence Schematic tools (OrCAD Capture, Allegro Design Entry HDL, Allegro System Capture) and PCB tools (Allegro PCB Editor). Bachelors degree or diploma in Computer Engineering, Electrical Engineering, or a related field is preferred. Soft Skills: Excellent written and verbal communication skills in English is Must. Strong analytical and critical-thinking abilities. Proven capacity to communicate complex concepts clearly and negotiate effectively with stakeholders. Travel Requirements: Willingness to travel for customer visits, internal training, and industry exhibitions, which may range from 10% to 20%. Join Us: If you are passionate about technology and eager to contribute to customer success while working in a dynamic, collaborative environment, Sunstream Global invites you to apply for the Application Engineer (AE) position.

5+ years of experience in PCB design including high-speed & high-density layouts Proficiency in PCB design tool ( Altium Designer, Cadence Allegro, Mentor Graphics) Strong knowledge of DFM, DFT standards & signal integrity principles

Summary / Role Purpose As Senior Application Engineer, you will be part of the team deploying Ansys EDA products with a primary focus on RedHawk-SC for Power Integrity and EMIR signoff across all top Semiconductor companies. This involves working with Software developers, Architects, & Product Specialists to get the product developed, and deploy it on leading edge SoCs across Semiconductor companies. Key focus areas will include all areas related to IP/SoC/3DIC Power Integrity, Signal Integrity, Reliability aspects like EM/ESD/Thermal, Advanced timing/jitter, Packaging - the top challenges for any chip design on advanced nodes like 7/5/3/2 nm. Key Duties and Responsibilities Be a senior member of Application Engineering Team that Works with Global-Customers / IP-providers / Foundries to understand design challenges of cutting-edge SoCs & 3DICs on 7/5/3/2 nm and creates EDA product specifications. Works with Product development team to get state-of-the-art EDA products developed. Works on Ansys-Seascape platform - Semiconductor Industrys First and Only True Big-Data design Platform! Works with top Semiconductor companies around the globe to deploy EDA products for solving Power/Signal/Reliability challenges across Chip-Package-System. Works on RedHawk and RedHawk-SC to help users and to perform EMIR/power-integrity sign-off analysis. Provides expert guidance / consultation to Customers around the globe for solving design challenges. Minimum Education/Certification Requirements and Experience Bachelors or Masters degree (B. Tech/M. Tech/BS/MS) in Electrical or Electronics Engineering from a recognized institution. Minimum 3 years of industry experience in Power Integrity / Signal Integrity / EMIR signoff with Redhawk-SC hands-on knowledge. Strong problem-solving skills. Good programming skills. Excellent verbal and written communication skills Preferred Qualifications and Skills Passion to learn and deploy new technologies. Ability for minimal travel At Ansys, we know that changing the world takes vision, skill, and each other. We fuel new ideas, build relationships, and help each other realize our greatest potential. We are ONE Ansys. We operate on three key components: our commitments to stakeholders, our values that guide how we work together, and our actions to deliver results. As ONE Ansys, we are powering innovation that drives human advancement Our Commitments: Amaze with innovative products and solutions Make our customers incredibly successful Act with integrity Ensure employees thrive and shareholders prosper Our Values: Adaptability: Be open, welcome what s next Courage: Be courageous, move forward passionately Generosity: Be generous, share, listen, serve Authenticity: Be you, make us stronger Our Actions: We commit to audacious goals We work seamlessly as a team We demonstrate mastery We deliver outstanding results

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profie: Qualifications: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Education MTech/PHD Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.

Will be technically driving team Custom Circuit IO and Datapath solutions for next generation Memory in advanced CMOS technology nodes. Will work on architecture of High speed IO and DataPath solutions to meet the specifications and product requirements Work closely with team and actively participate in technical discussions and reviews. Pro-actively get design issues/problems solved. Contribute to or propose innovative design solutions and design methodologies. Qualifications Bachelors/Masters degree in Electronics & Telecommunication/Electrical engineering Hand-on design knowledge on both analog & mixed signal design environment. 8+ years of Experience on IO circuit blocks used in memory products like DDR4, DDR5, LPDDR4, LPDDR5, GDDR5, GDDR6 is desirable. Familiar with custom design methodology & flow, Calibration, JTAG design requirements, understanding of High-speed IO circuit and Datapath design including LDO, PLL, DLL, Rx, Tx and clocking circuits Knowledge of analog layout techniques, including floor-planning, matching, shielding and parasitic optimization Understanding Datapath circuits like pipelining, digital design, STA, fan-out and load estimation, FIFO design etc.. Familiarity with package/board/Power integrity /signal integrity constraints is a plus. Strong communication skills & circuit design knowledge is preferred. Tool knowledge: spice tools: spectre, finesim, hspice & other flows Good automation & scripting knowledge is plus.

Requisition #: 17089 Our Mission: Powering Innovation That Drives Human Advancement When visionary companies need to know how their world-changing ideas will perform, they close the gap between design and reality with Ansys simulation. For more than 50 years, Ansys software has enabled innovators across industries to push boundaries by using the predictive power of simulation. From sustainable transportation to advanced semiconductors, from satellite systems to life-saving medical devices, the next great leaps in human advancement will be powered by Ansys. Innovate With Ansys, Power Your Career. Summary / Role Purpose As Senior Application Engineer, you will be part of the team deploying Ansys EDA products with a primary focus on RedHawk-SC for Power Integrity and EMIR signoff across all top Semiconductor companies. This involves working with Software developers, Architects, & Product Specialists to get the product developed, and deploy it on leading edge SoCs across Semiconductor companies. Key focus areas will include all areas related to IP/SoC/3DIC Power Integrity, Signal Integrity, Reliability aspects like EM/ESD/Thermal, Advanced timing/jitter, Packaging - the top challenges for any chip design on advanced nodes like 7/5/3/2 nm. Key Duties and Responsibilities Be a senior member of Application Engineering Team that Works with Global-Customers / IP-providers / Foundries to understand design challenges of cutting-edge SoCs & 3DICs on 7/5/3/2 nm and creates EDA product specifications. Works with Product development team to get state-of-the-art EDA products developed. Works on Ansys-Seascape platform - Semiconductor Industrys First and Only True Big-Data design Platform! Works with top Semiconductor companies around the globe to deploy EDA products for solving Power/Signal/Reliability challenges across Chip-Package-System. Works on RedHawk and RedHawk-SC to help users and to perform EMIR/power-integrity sign-off analysis. Provides expert guidance / consultation to Customers around the globe for solving design challenges. Minimum Education/Certification Requirements and Experience Bachelors or Masters degree (B.Tech/M.Tech/BS/MS) in Electrical or Electronics Engineering from a recognized institution. Minimum 3 years of industry experience in Power Integrity / Signal Integrity / EMIR signoff with Redhawk-SC hands-on knowledge. Strong problem-solving skills. Good programming skills. Excellent verbal and written communication skills Preferred Qualifications and Skills Passion to learn and deploy new technologies. Ability for minimal travel At Ansys, we know that changing the world takes vision, skill, and each other. We fuel new ideas, build relationships, and help each other realize our greatest potential. We are ONE Ansys. We operate on three key components: our commitments to stakeholders, our values that guide how we work together, and our actions to deliver results. As ONE Ansys, we are powering innovation that drives human advancement Our Commitments: Amaze with innovative products and solutions Make our customers incredibly successful Act with integrity Ensure employees thrive and shareholders prosper Our Values: Adaptability: Be open, welcome what s next Courage: Be courageous, move forward passionately Generosity: Be generous, share, listen, serve Authenticity: Be you, make us stronger Our Actions: We commit to audacious goals We work seamlessly as a team We demonstrate mastery We deliver outstanding results VALUES IN ACTION Ansys is committed to powering the people who power human advancement. We believe in creating and nurturing a workplace that supports and welcomes people of all backgrounds; encouraging them to bring their talents and experience to a workplace where they are valued and can thrive. Our culture is grounded in our four core values of adaptability, courage, generosity, and authenticity. Through our behaviors and actions, these values foster higher team performance and greater innovation for our customers. We re proud to offer programs, available to all employees, to further impact innovation and business outcomes, such as employee networks and learning communities that inform solutions for our globally minded customer base. WELCOME WHAT S NEXT IN YOUR CAREER AT ANSYS At Ansys, you will find yourself among the sharpest minds and most visionary leaders across the globe. Collectively, we strive to change the world with innovative technology and transformational solutions. With a prestigious reputation in working with well-known, world-class companies, standards at Ansys are high met by those willing to rise to the occasion and meet those challenges head on. Our team is passionate about pushing the limits of world-class simulation technology, empowering our customers to turn their design concepts into successful, innovative products faster and at a lower cost. Ready to feel inspired? Check out some of our recent customer stories, here and here . At Ansys, it s about the learning, the discovery, and the collaboration. It s about the what s next as much as the mission accomplished. And it s about the melding of disciplined intellect with strategic direction and results that have, can, and do impact real people in real ways. All this is forged within a working environment built on respect, autonomy, and ethics. CREATING A PLACE WE RE PROUD TO BE Ansys is an S&P 500 company and a member of the NASDAQ-100. We are proud to have been recognized for the following more recent awards, although our list goes on: Newsweek s Most Loved Workplace globally and in the U.S., Gold Stevie Award Winner, America s Most Responsible Companies, Fast Company World Changing Ideas, Great Place to Work Certified (China, Greece, France, India, Japan, Korea, Spain, Sweden, Taiwan, and U.K.). For more information, please visit us at www.ansys.com Ansys is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, veteran status, and other protected characteristics. Ansys does not accept unsolicited referrals for vacancies, and any unsolicited referral will become the property of Ansys. Upon hire, no fee will be owed to the agency, person, or entity.

Responsibilities: Develops, modifies, verifies, troubleshoots, and evaluates analog and mixed signal electronic parts, components or integrated circuitry for analog and mixed signal electronic equipment and other hardware systems. Assists in building evaluation boards for analog and mixed signal electronic products and performing ESD, Surge tests. Conducts circuit simulation and analysis to validate designs. Performs signal integrity analysis and parasitic extraction and analysis to identify and minimize issues that could impact circuit performance Help in product characterizations and product verifications with final reports. Selects components and equipment based on analysis of specifications and reliability. Documents design features, test plans, specifications, block diagrams, and schematics. Minimum Qualifications: 7+ years of relevant industry experience in Analog and mixed signal electronic products Degree in Electrical Engineering Fluent spoken and written English Solid understanding and enthusiasm for analog circuit design Desired Qualifications Experience with ORCAD, Cadence, Altium electronic circuit layout software. Has experience working with Laptop computers/Power Management Products/ESD Protection products. Familiar with power electronic circuits and basic circuit operations. Know how to use lab equipment such as Oscilloscope, Source Meter, Electronic load, ESD gun, Surge tester and TLP machine.

Key Responsibilities Lead block-level PNR activities from floorplanning through final routing, ensuring robust physical implementation aligned with timing, power, and area goals. Drive power grid design and EM/IR-aware routing strategies to ensure block-level power integrity and reliability. Collaborate closely with timing closure engineers to resolve physical design bottlenecks impacting timing and signal integrity. Manage and optimize physical verification flows including DRC, LVS, antenna checks, and physical signoff. Automate PNR flows and develop scripts to improve productivity and design quality. Mentor and guide junior physical design engineers, fostering technical growth and best practices. Coordinate with cross-functional teams including RTL design, STA, verification, and backend integration to ensure seamless block-to-chip integration. Qualifications 8+ years of experience in physical design with a strong focus on block-level Place and Route (PNR) for complex SoC/IP subsystems, preferably at advanced technology nodes (16nm, 7nm, 5nm, or below). Proven expertise in block-level physical implementation including floorplanning, placement, clock tree synthesis (CTS), routing, and physical verification (DRC/LVS). Hands-on experience with industry-standard PNR tools such as Cadence Innovus, Synopsys ICC2, and Mentor Calibre. Strong understanding of power grid design, EM/IR analysis, signal integrity (SI), and reliability checks at the block level. Experience in managing timing closure in coordination with STA teams, resolving congestion, and optimizing for power, performance, and area (PPA). Proficiency in scripting languages (Tcl, Python, Perl) for flow automation and custom tool development. Demonstrated ability to lead block PNR efforts, coordinate with RTL designers, physical design teams, and verification groups to meet aggressive tapeout schedules. Familiarity with low-power design techniques and power-aware physical implementation. Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21, 000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what s next in electronics and the world.

Qualcomm India Private Limited is looking for a Hardware Engineer to join their Engineering Group. As a Qualcomm Hardware Engineer, you will be involved in planning, designing, optimizing, verifying, and testing electronic systems, circuits, mechanical systems, and various other systems to develop cutting-edge products. You will work in collaboration with cross-functional teams to develop solutions that meet performance requirements. To be eligible for this position, you should have a Bachelor's degree, Master's degree, or PhD in Computer Science, Electrical/Electronics Engineering, or a related field, along with relevant work experience. The ideal candidate will have a solid understanding of Electronics engineering fundamentals, DDR, and High-Speed IO circuit analysis techniques, as well as semiconductor manufacturing processes. As a part of the Post Silicon Engineering group at Qualcomm, you will be responsible for developing test strategies and executing Bench characterization for LPDDR & PCDDR Subsystem components and High-Speed IO interfaces. You will drive first Silicon debug, evaluate semiconductor fabrication processes, and perform failure analysis to address design issues. Additionally, you will work with global teams in a time-critical environment. The desired candidate should have hands-on experience with Bench instruments such as oscilloscopes, network analyzers, and logic analyzers. Proficiency in writing and debugging test code using languages like C, C#, or Python is required. Knowledge of CAD software such as Mentor Graphics DA or Cadence Allegro would be a plus. Effective communication skills, both verbal and written, are essential for this role. Qualcomm is an equal opportunity employer committed to providing accessible processes for individuals with disabilities. If you require accommodations during the application/hiring process, you can email disability-accommodations@qualcomm.com or call Qualcomm's toll-free number. The company expects its employees to adhere to all applicable policies and procedures, including those related to the protection of confidential information. If you are interested in this role or need more information, please contact Qualcomm Careers.,

You should have at least 3+ years of relevant experience in SoC Physical design, with a focus on multiple technology nodes including 5nm for TSMC and other foundries. Your expertise should include hands-on P&R skills, particularly in ICC/Innovus. You must possess expert knowledge in all aspects of Physical Design (PD) from Synthesis to GDSII, with a strong background in Floorplanning, Placement, CTS, Routing, P&R, Extraction, IR Drop Analysis, Timing, and Signal Integrity closure. Experience in taping out multiple chips and working at the top level in the latest technology nodes will be highly beneficial. Collaboration with CAD, Methodology & IP teams for PD implementation is critical, requiring regular sync-ups for deliveries. You should have significant knowledge, and preferably hands-on experience, in SoC STA, Power, Physical Verification, and other sign-off processes. Problem-solving capabilities, proactive attitude, hardworking nature, and strong interpersonal skills are essential for this role. A Bachelor's Degree in Electrical, Electronics, or Computer Engineering is required for this position. About Company: 7Rays Semiconductor Private Ltd. provides end-to-end custom SoC design solutions, including SoC Architecture, RTL design, Design verification, DFT, Physical Design & Analog design. The company focuses on offering services to top semiconductor and system companies to assist them in designing complex SoCs. The company believes in building effective partnerships with clients to deliver high-quality solutions tailored to their needs. With a dedicated engineering team and a successful track record in project execution, the company is committed to excellence and innovation in SoC Design, Development, and deployment of customers" products.,