Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for passionate engineers to help achieve that mission.

As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, the AISiE team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for seasoned engineers with a dedicated passion for customer focused solutions, insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.

We are looking for a Principal PD Engineer to join the team.

• Bachelor's or Master’s in Electrical or Computer Engineering or related field with 15+ years of experience

• Experience in tapeouts of complex ASICs in leading edge technology

• 10+ years of experience in floorplanning, physical design, and integration of semiconductor designs.

• Expertise in physical design tools and methodologies such as Cadence Innovus, Synopsys DP, and Calibre.

• Strong understanding of semiconductor design principles, methodologies, and tools.

• Proven track record of successfully leading physical design projects and delivering high-quality semiconductor products.

• Excellent communication, teamwork, and leadership skills.

• Ability to work in a fast-paced and dynamic environment, and drive cross-functional collaboration.
• Good understanding of foundry tech files and rule decks

• This role will require access to information that is controlled for export under export control regulations, potentially under the U.S. International Traffic in Arms Regulations or Export Administration Regulations, the EU Dual Use Regulation, and/or other export control regulations. As a condition of employment, the successful candidate will be required to provide either proof of their country of citizenship or proof of their US. residency or other protected status (e.g., under 8 U.S.C. 1324b(a)(3)) for assessment of eligibility to access the export-controlled information. To meet this legal requirement, and as a condition of employment, the successful candidate’s citizenship will be verified with a valid passport. Lawful permanent residents, refugees, and asylees may verify status using other documents, where applicable.

We are seeking a highly skilled and experienced Principal Floorplan and Physical Integration Engineer to join our dynamic team. As a key member of our semiconductor design team, you will be responsible for leading the floorplanning and physical integration efforts to ensure the successful development of cutting-edge semiconductor products.

• Lead the floorplanning process to optimize chip area, power, and performance for complex semiconductor designs.

• Collaborate with Architecture, design, and implementation teams to ensure that floorplan meets design requirements and constraints.

• Develop and implement methodologies and strategies to improve physical design efficiency and performance.

• Conduct physical design reviews, identify and resolve design issues, and provide guidance to junior engineers.

• Work closely with cross-functional teams to drive project success and meet project milestones.

• Stay current with industry trends and emerging technologies to continuously improve physical design processes and methodologies.