Senior Process Engineer (OSAT Facility)

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About the Role

Senior Process Engineer

Key Responsibilities

• Lead process development and optimization for semiconductor packaging (Die Attach, Wire Bond, Molding, Wafer Bumping, Singulation, Underfill, Encapsulation, etc.).
• Monitor key process parameters, identify bottlenecks, and drive yield improvements.
• Support NPI (New Product Introduction) from customer design handover to stable mass production.
• Collaborate with equipment engineers to drive tool qualification, calibration, and process stability.
• Conduct failure analysis, root cause investigation, and corrective action implementation.
• Ensure adherence to industry standards (JEDEC, ISO, IATF) and EHS compliance in cleanroom operations.
• Work with global customers and cross-functional teams to ensure quality, delivery, and cost targets are met.
• Mentor junior engineers and technicians on best practices in OSAT process engineering.

Requirements

• Bachelor’s / Master’s in Mechanical, Electronics, Electrical, Materials, or related Engineering field.

• 8–12 years

  of relevant experience in semiconductor assembly/test, ATMP, or OSAT environment.
• Strong hands-on expertise in at least one core process area (Wire Bonding, Die Attach, Molding, WLP, Fan-out, etc.).
• Proven track record in yield improvement and process stabilization.
• Familiarity with SPC, DOE, FMEA, Six Sigma, Lean Manufacturing methodologies.
• Experience working in a cleanroom environment.
• Excellent analytical, problem-solving, and communication skills.

Compensation & Benefits

• CTC Range:

  ₹30-35 LPA (commensurate with experience & expertise).
• Benefits: PF, Medical Insurance, Relocation Assistance, Performance Bonus.
• Opportunity to be part of India’s fastest-growing semiconductor ecosystem with global exposure.