Product Engineer

Years of experience : 2-5 Years

Why IPP-MPP

IPP-MPP product line offers high performance, innovative and cost-effective power solutions for a broad range of customer applications in enterprise, communications and automotive which include multiple phase DC/DC controllers, smart power stages, and sequencers. In MPP, our mission is to deliver the converter solutions which power large CPU, SOC, ASIC platforms in the rapidly expanding Enterprise Computing/Datacenter market. Target platforms include Intel, AMD, ARM, NVidia and custom ASIC/FPGAs from various vendors.

Product engineering (PE) works with our design, systems and back-end (test/val) teams to ensure a product is designed for manufacturability and reliability. PEs usually work on a product family or category and ensure that those devices are meeting specifications and quality targets as defined in our data sheets. In addition, PEs may be responsible for "sustaining support," meaning they work with design, ATD (process technology), SCP (packaging), manufacturing, test, quality, reliability, and marketing teams to further optimize the manufacturing flow of a given device, targeting to reduce cost or otherwise improve the overall long-term development and profit profile of the device post-release.

Responsibilities may include, but are not limited to:

1. Development work in support of a broad range of Power devices (Buck converter multiphase controller, power stages, Power sequencers, etc.)
2. Collaborate and work in a team environment with Design, Applications, Test, Marketing, Manufacturing, Quality and Reliability in all aspects of new product development, production release to accomplish goals and objectives
3. Design sHTOL, dHTOL, ELFR, BHAST, and PTC boards to qualify Power products
4. Perform evaluation, debug and characterization of integrated circuits to ensure they meet the product requirement specifications and manufacturing requirements
5. Work with failure analysis (FA) to determine root cause of any reliability and qualification failures
6. Work with process and package technology development to develop and qualify technologies for new product development
7. Work closely with the global manufacturing facilities to address customer specific product quality, yield management and cost reductions issues on mature products. Scope of work could include product spins and derivatives
8. Work with planning team to ensure smooth device ramp post release to manufacturing (RTM)
9. Qualify second source wafer fab, assembly / test (A/T) facility, and Bill of Materials (BOM) to ensure device continuity of supply
10. Perform test conversion, test time reduction, and yield improvements to achieve device entitlement operational transfer cost (OTC)
11. Handle material builds post design release by working with manufacturing sites
12. Drive any customer returns to full closure with a Root cause analysis

Minimum requirements

• Bachelor’s/ Masters degree in Electrical Engineering, ECE

• Strong technical background, with the ability to produce high quality technical documentation

Preferred qualifications

Solid understanding of analog and digital circuits their operation and analysis

Hands on experience working with different lab equipment For example, use of the curve tracers, oscilloscopes

Programming skills such as C and or C++

Ability to work effectively in a fast-paced and rapidly changing environment and flexible to changing priorities.

Ability to take the initiative and drive for results

Strong problem solving, verbal and written communications skills

Ability to multiplex between projects and be able to maintain project schedules