3D Spatial Vision Intelligence Engineer

3 years

0 Lacs

Posted:5 days ago| Platform: Linkedin logo

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Job Type

Full Time

Job Description

Spatial Intelligence


3D Spatial Vision Intelligence Engineer

What You Will Do

  • Architect the Vision Chip:

    Design and implement FPGA-based architectures to accelerate core spatial tasks: depth estimation, feature tracking, and point-cloud processing.
  • Hardware-Accelerated SLAM:

    Port, optimize, and "harden" state-of-the-art SLAM algorithms (e.g., ORB-SLAM, VIO, LOAM) from C++ into RTL (Verilog/VHDL).
  • Sensor Fusion at the Edge:

    Develop high-speed data pipelines to fuse multi-modal inputs (LiDAR, Stereo, IMU) directly on the FPGA to achieve sub-millisecond latency.
  • AI-Hardware Co-Design:

    Collaborate with our AI team to optimize 3D neural networks (like PointNet++ or 3D Segmentation) for deployment on custom hardware.
  • RTL to Reality:

    Manage the full FPGA lifecycle—from HLS prototyping and RTL coding to timing closure, verification, and on-device deployment.

Who You Are

  • The Bridge:

    You can read a SLAM research paper and visualize exactly how those matrix operations should be pipelined in hardware.
  • FPGA Power User:

    Mastery of

    Verilog/VHDL

    and toolchains like

    Xilinx Vivado

    or

    Intel Quartus

    . Experience with

    HLS (High-Level Synthesis)

    is a major plus.
  • 3D Geometry Expert:

    Deep understanding of the math that powers vision—quaternions, transformation matrices, epipolar geometry, and Kalman filters.
  • C++ Expert:

    Strong proficiency in modern C++ and experience with libraries like

    OpenCV, PCL, or Eigen

    .
  • Experience:

    3+ years in computer vision or robotics, with a proven track record of deploying algorithms on embedded hardware or FPGAs.


3D Spatial Vision Intelligence Engineer

Below are the detailed qualifications categorized by priority.

Educational Background
  • Minimum:

    Bachelor’s or Master’s degree in

    Electrical Engineering (EE), Computer Engineering (CE), Robotics

    , or a related field.
  • Preferred:

    A

    PhD

    with a research focus on

    Computational Imaging, SLAM, or Hardware Acceleration

    for Computer Vision.
  • Key Coursework:

    Digital Logic Design, Computer Architecture, Linear Algebra, Probability & Stochastic Processes, and Computer Vision.
Technical Skills: The "Spatial Intelligence" Stack

These are the core competencies required to design a chip that "sees" and "understands" 3D space.

1. SLAM & 3D Perception

  • Algorithmic Expertise:

    Deep understanding of

    Visual-Inertial Odometry (VIO)

    , LiDAR SLAM (e.g., LOAM, LeGO-LOAM), and Visual SLAM (e.g., ORB-SLAM3).
  • Geometric Math:

    Mastery of

    SO(3) and SE(3) Lie Groups

    , quaternions, epipolar geometry, and bundle adjustment.
  • State Estimation:

    Hands-on experience with

    Extended Kalman Filters (EKF)

    , Unscented Kalman Filters (UKF), and Factor Graph Optimization (GTSAM/Ceres).

2. FPGA & RTL Engineering

  • Hardware Description Languages:

    Expert-level

    Verilog

    or

    SystemVerilog

    (preferred) or VHDL.
  • Design Tools:

    Proficiency in

    Xilinx Vivado

    , Intel Quartus, and

    High-Level Synthesis (HLS)

    for rapid algorithm prototyping.
  • Architectural Knowledge:

    Experience with

    AXI protocols

    , DMA, and memory controllers (DDR4/HBM) to handle high-bandwidth 3D point cloud data.
  • Verification:

    Experience with UVM/OVM or hardware-in-the-loop (HIL) testing to ensure "first-time-right" silicon logic.

3. Software & Optimization

  • Primary Languages:

    High proficiency in

    Modern C++ (14/17/20)

    for performance-critical systems and

    Python

    for algorithm modeling.
  • Vision Libraries:

    Strong experience with

    OpenCV

    ,

    PCL (Point Cloud Library)

    , and Eigen.
  • Acceleration:

    Familiarity with

    SIMD

    instructions or

    CUDA

    (for benchmarking FPGA performance against GPU equivalents).

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