444 Signal Integrity Jobs - Page 2

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment - able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Individual must be highly motivated, a quick learner, and able to work independently Competencies Location

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profie: Qualifications: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Education MTech/PHD Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Individual must be highly motivated, a quick learner, and able to work independently Competencies

Responsible for Multi Voltage domain STA environment setup, execution and timing closure Drive the pre-route timing checks and QoR clean up to eliminate SDC issues and ensure a quality handoff for STA checksEnsuring timing correlation between PnR STA and timely feedbacks to PD teamGenerating block level HS session and using Top context from SoC for Block-SoC Interface timing closure Generating timing ECO using Tweaker/PrimeClosure

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. Location

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. Location

Job Overview As a manager in the Signal Integrity team you will lead the SI engineers focusing on aspects of electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industrytargeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to drive development teams in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will assign resources to work on the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will be expected to coordinate to drive the advancement of simulation tools and capabilities, identifying potential areas of process improvement, and solving complex problems and ensuring product development success. Responsibilities: Align the technology roadmap with front end / customer, and implement accordingly Familiar with signal integrity design, simulation and validation activities through product development cycles Coordinate to define signal integrity design performance/functional requirements for new products by closely engaging with front teams / lead customers Guide the team to preform signal integrity simulations for multiple high-speed standards on each product, including determining the correct simulation methodology, as well as a good understanding of the criteria for each interface. Driving product development for business success Engaging in innovative simulation and test tool improvement and process enhancement Driving best practices and efficiency in connector design and component qualifications from a signal integrity standpoint. Being a mentor and teacher to other engineers across disciplines / BUs, writes and presents technical papers at internal and external conferences. Being an expert in analyzing competitive products and driving internal & competing IP positions Mandate Skills: Bachelors degree in electrical engineering or equivalent work experience; Masters degrees highly recommended Minium of 10 years of relevant work experience in electrical design, RF design, or PCB design, with 3+ years managerial experience in leading an electrical or SI engineering team Familiar with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Good analytical capabilities to interpret simulation and lab data to identify issues and provide guidance to team to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Strong background to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Ability to, and experience with, teaching and training peers in applying software tools and methodologies, and in the use of electrical test equipment, including VNAs and TDRs Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profie: Qualifications: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site.

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industrytargeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: Subject matter expert in signal integrity design, simulation and validation activities through product development cycles Establishing signal integrity design performance/functional requirements for new products Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Performing PCB design schematic and layout reviews Creating actionable recommendations based upon design reviews and simulation results Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement. Required Skills/ Experiences: Bachelors degree in Electrical Engineering or equivalent work experience 8 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Bachelors degree in Electrical Engineering or equivalent work experience 5 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently DESIRED S: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Competencies

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. DESIRED S Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Bachelors degree in Electrical Engineering. Should have total work experience of 3-5+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Competencies

Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profie Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies

The analyst will produce high-quality written content that communicates complex market dynamics clearly. Support insights with compelling visuals such as charts and graphs. The candidate will engage regularly with clients through calls, meetings, conferences, and events delivering tailored insights, explaining methodologies, and articulating value propositions. Responsibilities The analyst will conduct power modelling for power markets to deliver short-term market forecasts in client-facing reports. Key considerations in modelling may include, but are not limited to: Capacity build-up. Thermal fuel switching. Temperature-adjusted power demand. Power market mechanisms and price settlement methods. Carbon emission policy, cost, price and new technologies. Power and renewables policies, market trends and key players. Requirements A university degree in economics, business, public policy, or a related field. Familiarity with broader commodity markets, especially in the energy sector. Excellent English communication skills (reading/writing/speaking). Experience building forecasts or models. Knowledge of electricity markets in South and Southeast Asia. Experience with integrated cross-commodity analysis. Strong team players who can work across geographies and time zones. Proven ability to write clearly, visualize data effectively, and present complex analysis in high-level engagements and public forums. Having experience from a similar role is a plus.

You will be responsible for leading the design and development of ECG sensing circuits, analog/digital interfaces, and wearable device components including BLE, ensuring high accuracy and low power consumption. Your role will involve creating and prototyping new hardware designs, conducting thorough testing and validation, and iterating designs based on performance data. Additionally, you will work closely with firmware/software engineers to ensure smooth integration of hardware with firmware, ensuring real-time ECG data acquisition, signal processing, and transmission. Designing power-efficient solutions for long-lasting battery life and ensuring the device operates efficiently with minimal power consumption will be a crucial aspect of your responsibilities. You will also need to ensure that all hardware designs comply with medical device standards (such as FDA, CE, and IEC) and industry regulations, leading regulatory testing to ensure compliance to the various applicable testing. Collaboration with other teams, mentorship of junior engineers, and support of the product lifecycle from concept to production will also be part of your role. Staying current with advancements in wearable technology, ECG sensing methods, and hardware design to bring cutting-edge solutions to the market, as well as providing technical guidance during the manufacturing process to ensure high-quality production standards are met and addressing any engineering issues that arise, are essential responsibilities. You will also use test and measurement apparatus to ensure that firmware functions per design requirements and strive for top-quality results, continuously looking for ways to improve and enhance system reliability, performance, security, and automation. To be successful in this role, you should have a Bachelor's degree or higher in Electrical Engineering, Electronics, or a related field, along with at least 5 years of experience in PCB design, with a specific focus on high-performance, low-power electronics in wearable or medical device applications. Proficiency with PCB design tools (e.g., Altium Designer, Cadence, KiCad) for schematic capture, layout, and simulation, deep understanding of signal integrity, electromagnetic compatibility (EMC), and methods for reducing noise in high-precision analog circuits (especially ECG signals) are required. Experience with Design for Manufacturability (DFM) and Design for Assembly (DFA) principles, strong knowledge of PCB fabrication processes, and familiarity with regulatory standards and certifications applicable to medical device hardware are also necessary. Strong written and verbal communication skills, experience working with wearable technology or ECG sensors, familiarity with 3D CAD tools, manufacturing process knowledge, power management circuit design experience, and embedded software development experience are desirable qualifications for this role.,

As an Analog Design Engineer at our company, you will utilize your 6+ years of experience to design and develop high-speed SerDes systems for CHIP to CHIP Communication interfaces. You will be responsible for creating and validating high-performance, low-power analog circuits, focusing on core analog building blocks such as RC circuits, Operational Amplifiers, Bandgap References, Comparators, and more. Your role will also involve architecting and implementing components like Phase-Locked Loops, Voltage/Current Controlled Oscillators, and Charge Pumps. Collaborating closely with layout, digital, and verification teams, you will design and simulate analog blocks in advanced CMOS nodes, ensuring attention to power, area, and performance. Additionally, you will participate in silicon bring-up, validation, and debug processes while documenting design specifications, simulation results, and test plans. To excel in this role, you should hold a Bachelors/Masters/PhD in Electrical Engineering or a related field, demonstrating a strong grasp of analog fundamentals and building blocks. Proficiency in analog simulation tools like Spectre, HSPICE, MATLAB, and Cadence Virtuoso is essential. Experience with mixed-signal verification, CMOS process, and high-speed SerDes systems (e.g., PCIe, USB, Ethernet) will be advantageous. Furthermore, any prior work on PAM4-based Tx/Rx designs, tapeout experience with high-speed analog/mixed-signal IP, or hands-on experience with lab testing and debug tools (e.g., oscilloscope, BERT, VNA) will be highly valued. Join our world-class engineering team to innovate in cutting-edge communication technologies, work on rewarding projects with industry impact, and enjoy competitive compensation, benefits, and career growth opportunities.,

BE/ B. Tech Electronics Experience 5- 7 years Required Skills Industry background: Industrial Product Design & Development involving Electronics circuit 2. Computer proficiency: OrCAD Schematic Capture, PCB layout tools Mentor Graphics, Allegro, Altium, MS Office 3. Mandatory Skills: OrCAD Schematic Capture, PCB layout tools Mentor Graphics, Allegro Job Description Design Creation: Develop and optimize PCB layouts and schematic diagrams using CAD (Computer-Aided Design) software, ensuring proper component placement, routing, and signal integrity. Design Validation: Perform design rule checks, validate designs using simulation tools, and resolve any design-related issues or defects. Collaboration: Work closely with cross-functional teams, including hardware and firmware engineers, to translate requirements into viable PCB designs. Manufacturing Support: Generate comprehensive design documentation, such as Bill of Materials (BOM) and manufacturing specifications, and support the transition from prototype to production. Documentation & Process Improvement: Maintain design documentation, recommend improvements to existing designs, and contribute to continuous improvement activities within the design process.

Job Description Summary Lead FPGA Engineer will be responsible for leading/executing complex FPGA design projects and solutions. You will work in a global environment with skilled team of engineers creating and improving a state-of-the-art platform for use in every kind of power generation application Job Description Essential Responsibilities Select the FPGA, CPLD family and chip suitable for the application. Develop FPGA design requirements based on system requirements document. Define FPGA interfaces with other circuitry along with hardware design engineer. Do FPGA programming, synthesis and simulation, timing analysis and optimization. Validate system along with the hardware and firmware design engineers to confirm about functionality, reliability, efficiency, compatibility and responsiveness. Work on FPGA-based solutions for interfacing real-time microprocessor systems to high speed Networks and I / O Actively drive design rigor and participate in relevant formal design reviews Contribute to board level reliability analysis and system FMEA Identify opportunities to modify/author DPs Identify cost-out opportunities and make technical proposals Lead/ Participate on teams assigned to address organizational initiatives. Qualifications/Requirements Bachelor / Masters in Electronics Engineering, Electronics & communication, Computer Engineering or equivalent. 8-10 years of experience in FPGA design, digital circuit design, system level analysis, Product Development life cycle including system and Sub-system Design Proven analytical and organizational ability Strong interpersonal and leadership skills Strong oral and written communication skills Effective problem identification and solution skills Desired Characteristics Hands on experience in Verilog, VHDL, FPGA development tools, including design, synthesis, simulation, timing analysis, optimization, packaging and debug Expertise in Signal Integrity and simulations Knowledge about different communication techniques Hands on experience in developing the interfaces between FPGA and other devices like microprocessors, ADCs, transceivers and so on. Strong experience of High-speed digital designs, Proficiency in ECAD suite of tools either from Mentor Graphics or Cadence would be an added advantage. Should have a good understanding of EMI/EMC concepts related to high speed designs and debug issues. Experience working with Industry protocols like MODBUS, FF,CAN, Ethernet Ability to coordinate several projects simultaneously. Experience in Agile methodology.

Project description This is a great opportunity to work as a part of highly regarded team to deliver leading edge solutions. Responsibilities Drive the development of cutting-edge memory-related firmware projects, contributing to the creation of innovative solutions Collaborate with a highly regarded team to bring innovation to memory-related firmware, ensuring solutions are at the forefront of industry advancements Tackle complex challenges by employing strong problem-solving skills, enhancing firmware to meet evolving performance and reliability standards Skills Must have 5-12 years' experience. Strong with C language programming Working knowledge of git/gerrit Good understanding of DDR4, DDR5, NVDIMM Good understanding of different DIMM types (UDIMM/SODIMM/RDIMM/LRDIMM/LPDDR) Good understanding of UMC features like ECC, SME, SEV, RAS etc Nice to have Understanding different vendor implementations and memory timing differences is a big plus

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: VLSI Design For Testability - DFT . Experience: 3-5 Years .

As a Sr. Signal & Power Integrity Engineer at AjnaLens in Thane (Maharashtra-India), you will be an integral part of the Electronics R&D team. We are seeking highly motivated individuals who thrive in a dynamic team environment. The ideal candidate will possess a diverse skill set and be driven to solve complex problems with simple solutions. Your primary focus will be on designing and simulating high-speed signal interfaces and power distribution networks for advanced SoC packages, interfaces such as USB 3.0, MIPI CSI-2, MIPI DSI-2, LPDDR3/LPDD4/LPDDR5, PCIe, and eMMC, as well as PCBs. Your daily tasks will include simulating, testing, and evaluating new designs to ensure compliance with Electronics specification requirements, as well as conducting Pre and Post layout SIPI analysis. A minimum of 5 years of experience in SI/PI Background and a Bachelor's or Master's Degree in Electronics/Electrical Engineering, Physics, or Mathematics are required. Hands-on experience in Thermal simulation would be advantageous. Key skills required for this role include a strong understanding of Signal Integrity and Power Integrity fundamental concepts, electromagnetic theory, transmission line theory, I/O design, timing budgets, jitter analysis, signal integrity, S-parameter modeling, and differential and single-ended interface technologies. You should also have experience in designing and simulating signal and power integrity solutions for high-speed system components, as well as analyzing high-speed single-ended or differential buses. Additionally, hands-on experience with electronic test equipment such as Oscilloscope, Power Supply, Functional generator, Logic analyzer, VNA, signal generator, and spectrum analyzer is necessary. Proficiency in simulation tools like Hyperlynx, Flowtherm, Sigrity, Ansys SIwave, and thermal simulation tools would be advantageous. In this role, you will be expected to make data-driven decisions, adapt quickly to new requirements, support in Pre-compliance tests, and contribute to the development of new technologies in AR/VR/MR products.,

TechShlok is expanding its design team and looking to add a PCB Design Engineer to the R&D unit to accelerate the development across multiple projects. As a PCB Design Engineer at TechShlok, your main responsibility will be to perform end-to-end PCB layout, including component placement, routing, and generating manufacturing files. You will design multi-layer boards (4 layers and above) with adherence to industry standards, signal integrity, and EMI/EMC best practices. It is essential to ensure optimal routing of high-speed signals (e.g., DDR, PCIe, USB, high-speed LVDS) and differential pairs. You will also be responsible for generating comprehensive documentation, including Gerber files, assembly drawings, and BOMs. Collaboration with cross-functional teams (electrical, mechanical, and test engineers) is crucial to align design requirements and constraints. Effective communication with fabrication and assembly vendors to address DFM (Design for Manufacturability) and DFT (Design for Test) issues is required. During your first 30 days at TechShlok, you will complete onboarding, learn team workflows, and familiarize yourself with PCB design tools, libraries, and version control. You will review existing designs, standards, and DFM/DFT guidelines, and assist in simple board modifications under senior guidance. In the next 30 days (Day 31-60), you will take on a small-to-medium complexity PCB design project, participate in design reviews, refine routing and stack-up skills, and engage with manufacturing partners for DFM insights. You will also focus on enhancing workflow efficiency and documentation methods. During the final 30 days (Day 61-90), you will independently handle a complex 4-layer board design project, collaborate with QA/testing to ensure reliability and testability, recommend improvements in processes and design tools, and contribute to the technical strategy while mentoring junior team members. The ideal candidate for this role should have a Bachelor's degree in Electronics Engineering or a related field, 3 to 5 years of experience in PCB designing, proficiency in tools like Kicad, Eagle, or Altium, and a strong understanding of PCB stack-up design, impedance control, and high-speed routing constraints. Familiarity with IPC standards and best practices for PCB fabrication and assembly, excellent written and verbal communication skills, and the ability to collaborate effectively in a cross-functional team setting are essential. Experience working with various PCB materials and advanced technologies, familiarity with power distribution network analysis and thermal management techniques, and exposure to simulation tools for signal integrity and EMI/EMC considerations are considered good-to-have skills.,

We are seeking a Hardware / PCB Design Engineer to lead the design and development of cutting-edge electronic systems. This position involves a blend of system-level hardware engineering and PCB layout expertise to ensure smooth integration of components and optimal performance. In the realm of Hardware Engineering, your responsibilities will include defining system architecture to guarantee compatibility among different components. You will be tasked with selecting and incorporating microprocessors, memory, sensors, and power systems to fulfill performance and efficiency criteria. Your role will also involve fine-tuning designs for power consumption, thermal management, and overall reliability. As a PCB Design Engineer, you will be expected to transform hardware schematics into effective PCB layouts utilizing industry-standard CAD tools. Ensuring signal integrity, electromagnetic compatibility (EMC), and manufacturability for sturdy electronic products will be crucial tasks. Collaboration with hardware engineers for testing, validation, and production enhancement will also be part of your role. Location: Rourkela, Odisha (Onsite) Requirements: - BE/B.Tech in Electronics or related field To apply, please email: sanjeetm@teezash.com Contact: 7008538682,

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: VLSI Board Design .Experience: 3-5 Years .>

Job Requirements Mandatory skills: • Electronics Hands in Digital designs in terms of Cortex M, A series, Memories :Flash, DDR AND/OR Knowledge of analog design including control Electronics • Hands-on experience in Schematics design tool like Concept HDL or Equivalent. • Working Knowledge on products like Wireless Socket, plug or Gateways with short range wireless • Experience with cross functional teams like Mechanical design Layout, Costing, BoM etc. • Knowledge on EMI/EMC and Test standards like IEC, UL, Demko, VDE etc • Hands on experience in using Measurement tools like Power Generator, Scopes etc • Knowledge on DC/DC converter,AC/DC converter • Knowledge sustainability - Electronics • Knowledge on Simulation and Signal Integrity is plus Nice to have skills: • Exposure to Agile development methodologies - Scrum, etc • Able to understand Firmware/Software release and requirement Qualifications - External Qualifications BE / B.Tech / M.tech/ MSc(Electronics Communication, Electrical 5 to 8 years of experience in Embedded Electronic

Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project Mandatory Skills: VLSI Design For Testability - DFT . Experience: 1-3 Years .