103 Hfss Jobs - Page 5

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131812 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Manufacturing Engineer, Front End, CAD, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } SR SIMULATION ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Role Objective and Responsibilities: ROLE OBJECTIVE To perform FEA tasks and provide suitable design recommendations to validate the design virtually. RESPONSIBILITIES Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques – implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a mutli-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact of my activities on financial decision. Education/Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art o FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. o CAD tools- PTC Creo, Space Claim. o Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Ability to understand specification for validation as per US CAR / LV 214 / Similar Specification. Knowledge about the crimping technologies, Ultrasonic welding technologies, Laser welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 8-12 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131864 Alternative Locations: Function: Engineering & Technology Job Segment Lean Six Sigma, Testing, Manufacturing Engineer, Welding, CAD, Management, Technology, Engineering, Manufacturing Apply now »

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred