181 Hfss Jobs - Page 8

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } SR SIMULATION ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Role Objective and Responsibilities: ROLE OBJECTIVE To perform FEA tasks and provide suitable design recommendations to validate the design virtually. RESPONSIBILITIES Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques – implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a mutli-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact of my activities on financial decision. Education/Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art o FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. o CAD tools- PTC Creo, Space Claim. o Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Ability to understand specification for validation as per US CAR / LV 214 / Similar Specification. Knowledge about the crimping technologies, Ultrasonic welding technologies, Laser welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 8-12 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131864 Alternative Locations: Function: Engineering & Technology Job Segment Lean Six Sigma, Testing, Manufacturing Engineer, Welding, CAD, Management, Technology, Engineering, Manufacturing Apply now »

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred

Min1+ Yrs exp in RF& microwave engineering Exp in RF design tools(HFSS,CST,ADS,Ansys) Exp in circuit design & simulation tools MATLAB,Python,SPICE,RF PCB design,layout considerations,EMI/EMC mitigation Knowledge in communication standards & protocols

Job Overview As a Staff Product Development Engineer in the Signal Integrity Center of Excellence (SI COE), you will lead advanced signal integrity (SI) research, modeling, and validation for next-generation high-speed interconnects used in AI data centers, and high-performance computing (HPC). Your role involves independently conducting SI studies and design platforming, including geometry analysis and simulation-driven optimizations. You will be responsible for exploring new SI methodologies, conducting literature reviews, formulating research plans, programming, simulating, and testing to develop innovative solutionseven in ambiguous environments. You will collaborate closely with mechanical, manufacturing, materials, and operations teams to drive the adoption of cutting-edge SI technologies. As a subject matter expert, you will oversee the entire SI lifecycle, from initial analysis and modeling to design, simulation, prototype fabrication, and final validation. You will tackle complex design challenges, leveraging advanced simulation tools to optimize designs for manufacturability and performance Responsibilities Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged, and Near Package) through the product development cycle. Conducting SI COE analysis, including Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Modeling the connector with the consideration of manufacture impact and application impact. Providing solutions to the SI challenges. This includes identifying the problems, making research plans, developing new technologies, and training and sharing the findings with the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. What your background should look like Skills, Experience and Education Bachelors degree in Electrical Engineering or equivalent amount of experience. Minimum of 8+ years of work experience in a signal integrity engineering role. Minimum of 6+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR, and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problems. Strong understanding of printed circuit board design, fabrication, and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, Python, C++, VB, etc Excellent presentation, verbal, and written communication skills with an ability to clearly communicate technical concepts to diverse audiences Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies The individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/ Experience Doctor’s degree a PLUS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Signal conditioning techniques (equalization, amplification) Six Sigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies to design, development & manufacturing teams Direct customer design and support experience Design experience with data center compute equipment like servers, switches, routers, storage, antenna, RF front end, or similar systems.

Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com We are seeking a highly skilled and experienced Senior Product Development Engineer with a strong background in RF connector design. The ideal candidate will lead the design and development of high-performance RF connectors for a variety of applications. This role requires deep technical expertise, innovation, and cross-functional collaboration to bring cutting-edge products from concept to production. Key Responsibilities: Lead the mechanical design and development of RF connectors from concept through production. Create detailed 3D CAD models, drawings, and specifications using tools like SolidWorks, Creo, or similar. Perform tolerance analysis, thermal and mechanical simulations (FEA), and design optimization. Collaborate with electronics engineers to ensure RF performance requirements are met. Work closely with manufacturing, quality, and supply chain teams to ensure design for manufacturability (DFM) and cost-effectiveness. Drive prototype development, testing, and validation of new products. Support failure analysis and continuous improvement of existing products. Stay updated with industry trends, standards (e.g., MIL-STD, IEC), and emerging technologies in RF and connector design. Qualifications: Bachelors or Masters degree in mechanical engineering or related field. Minimum 3 years of hands-on experience in RF connector design. Proficiency in 3D CAD software (SolidWorks, Creo, etc.). Strong understanding of RF principles, materials, and mechanical tolerances. Experience with simulation tools (ANSYS) for mechanical and thermal analysis. Familiarity with industry standards for RF connectors (SMA, N-type, TNC, etc.). Excellent problem-solving, communication, and project management skills Preferred Qualifications: Experience in high-frequency (GHz range) connector design. Knowledge of electromagnetic simulation tools (HFSS, CST). Exposure to global product development and cross-cultural teams. Patent filings or publications in the field of RF/mechanical design.

SI-PI Engineer : 5+ Years of experience with Strong knowledge in Signal Integrity and Power Integrity fundamental concepts . Strong experience in PCB modelling is required. Performs Transmission line & Via modelling and carry out experiments to validate modelling outcomes and methodologies. Deep Understanding of S-parameter & its modelling concepts for Single ended and differential interfaces. Experience in simulating (FD/TD) memory interfaces for Board and Package is required (DDR4/LPDDR4/DDR5/LPDDR5) Experience in simulating (FD/TD) High Speed Serial IO interfaces for Board and Package is required (PCIe Gen3/4, USB3/3.1 and MIPI CSI/DSI Interfaces etc.) System level simulation for Read & Write cases for eMMC/NAND Flash/SDIO System level simulation for HDMI signals with connectors & cable including CMC for all PVT corners Good knowledge of Power Delivery Network, impedance profile analysis, IR Drop Analysis, and time domain Analysis. Power Integrity Experience in extracting the PDN model of PCB power rails and perform decoupling capacitor optimization, Loop inductance analysis. Should be able to analyze and review the layout files related to Signal integrity and Power Integrity problems. Should be able to provide practical solutions to PCB/Package design team based on simulation results and analysis. Strong knowledge in simulation tools specifically Hspice, Power SI, Power DC , ADS and other tools like Ansys SIwave, HFSS 3D,