58 Hfss Jobs - Page 2

Your Job We continue to grow our Engineering Staff and are looking for a talented Signal Integrity Design Engineer to join our team. If you are looking for a way to accelerate your career and be part of a great company, this may be the opportunity for you. In this role, you will have the opportunity to perform characterization of high-speed connectors/cables and systems, using high-speed digital and electromagnetic measurements for automotive in-vehicle networks. Our Team Concept Design and Development Complete PCB Electromagnetic simulations (Ansys HFSS) Provide Signal Integrity test board layout support for high speed applications Provide recommended connector pin-out configuration for optimized signal integrity performance Design Verification & Product Validation Provide testing BOM Lead procurement activities of all components required to complete testing Develop test plans (DVP&Rs) with a cross-functional team to validate design standards (USCAR-49, GMW3191, IEEE, Open Alliance, etc.) Assist in the development and implementation of all sample preparation and testing procedures & instructions required to ensure accurate and repeatable test data Oversee signal integrity testing of shielded and unshielded automotive interconnects systems. Update product technical documentation (such as Engineering, Application and Product Specs). Approve Test lab best practices for internal and external signal integrity lab usage. Prepare presentation material for internal and customer design reviews. Perform gap analysis between high-speed standards Production Support Support product engineers with internal & customer 8D resolution activities. Other Duties Some travel may be required. Performs other work-related duties as required by management. What You Will Do Experience in EM and CAD/CAE tools, such as Channel Designer, HFSS, CST, FDTD tools, MoM tools, Sigrity PowerSI, PAKSI-E, Power-grid, Agilent ADS and Mentor Hyperlynx Working knowledge of Altium, or equivalent PCB design software. Understanding of high speed data applications Working knowledge of transmission line theory, s-parameters, bit error rate testing, cross talk, characteristic impedance, eye diagrams, time domain analysis. Working Knowledge of multi-port network analyzers, BER testers, Eye pattern analyzers, digital sampling scopes and TDRs. Ability to apply signal integrity concepts to laboratory data for analysis and troubleshooting. Strong knowledge of high speed material properties and behavior during data transmission. Good analytical ability to resolve signal integrity issues and apply logical reasoning, test assumptions, observe results and make corrections. Exposure to lean/six sigma methodology and statistical data analysis. Who You Are (Basic Qualifications) Bachelor’s or Master’s degree in Electrical Engineering, with emphasis on Signal integrity or Electromagnetics Experience in high speed automotive connector testing. What Will Put You Ahead Integrity: Thinks about and does what is right, regardless of the consequences. Raises concerns or asks questions when something doesn’t seem right, even when it’s difficult Always keeps commitments. Entrepreneurship: Works on things that matter (and knows why they matter). Acts with a sense of urgency to capture opportunities or deal with problems. Envisions long-term implications of decisions. Knowledge & Change: Invites, values, and seriously considers different ideas, opinions, and points of view Disagrees (constructively) when it may lead to a better way Drives and leads change Humility & respect: Willingly admits mistakes, failures, and shortcoming Gives credit appropriately Provides timely, honest feedback even when it’s difficult At Koch companies, we are entrepreneurs. This means we openly challenge the status quo, find new ways to create value and get rewarded for our individual contributions. Any compensation range provided for a role is an estimate determined by available market data. The actual amount may be higher or lower than the range provided considering each candidate's knowledge, skills, abilities, and geographic location. If you have questions, please speak to your recruiter about the flexibility and detail of our compensation philosophy. Who We Are At Molex, we not only employ some of the most talented people from all over the world, we work to help cultivate tomorrow's breakthroughs. From our corporate headquarters in Lisle, IL to manufacturing floors around the world, the Molex team is dedicated to helping further the limits of technology. For more information: Visit the Molex website at www.molex.com Follow us at www.twitter.com/molexconnectors Watch our videos at www.youtube.com/molexconnectors At Koch, employees are empowered to do what they do best to make life better. Learn how our business philosophy helps employees unleash their potential while creating value for themselves and the company. Additionally, everyone has individual work and personal needs. We seek to enable the best work environment that helps you and the business work together to produce superior results. Show more Show less

The Group You’ll Be A Part Of In the Global Products Group, we are dedicated to excellence in the design and engineering of Lam's etch and deposition products. We drive innovation to ensure our cutting-edge solutions are helping to solve the biggest challenges in the semiconductor industry. The Impact You’ll Make Join Lam as an Electrical Engineer and you'll be at the forefront, designing and developing electronic solutions for advanced applications. Your role involves designing and analyzing equipment, conducting experimental tests, evaluating results to create reliable cutting-edge solutions. In this role, you will directly contribute to ___. What You’ll Do Design and develop electrical systems, sub-systems, and/or solutions, applying engineering methods to design. Contributes to research and development efforts by collecting and analyzing data to improve electrical system designs. Assists with development of functional specifications for electrical/ electro-mechanical systems and power distribution components. Collaborate with cross-functional engineering design teams to design and modify custom and OEM system components. Perform hands-on test and validation utilizing lab equipment to characterization of the performance of the electrical/ electro-mechanical systems. Prepare high-quality reports and technical presentations to clearly communicate design intent, analysis, and results to diverse audiences in design reviews. Minimum Qualifications Who We’re Looking For Bachelor’s degree in Electrical Engineering or related field with 2+ years of experience; or an advanced degree without previous professional experience; or equivalent work experience. Hands-on experience in electronic circuit design (analog, digital), signal and controls theory, development and associated electrical board design, troubleshooting and validation. Understanding of AC/DC Power distribution systems. System level understanding of Electrical architecture, system integration, and applications. Working knowledge in Printed Circuit Board (PCB) and low voltage circuit design for power and control applications. Knowledge in application of power and controls technologies for systems automation. Knowledgeable in CAD tools for circuit design and simulation (e.g., PCAD, ORCAD, ZUKEN, AutoCAD, Spice, ADS, HFSS). This is a graduate eligible role. Preferred Qualifications Familiar with design for serviceability, manufacturability, reliability. Skilled at troubleshooting systems with tools like network sniffers, protocol analyzers, and tool logs. Understanding of troubleshooting with problem-solving techniques such as 5-why, 8D, fishbones, etc. Excellent oral and written communication skills including technical presentations. Our Commitment We believe it is important for every person to feel valued, included, and empowered to achieve their full potential. By bringing unique individuals and viewpoints together, we achieve extraordinary results. Lam Research ("Lam" or the "Company") is an equal opportunity employer. Lam is committed to and reaffirms support of equal opportunity in employment and non-discrimination in employment policies, practices and procedures on the basis of race, religious creed, color, national origin, ancestry, physical disability, mental disability, medical condition, genetic information, marital status, sex (including pregnancy, childbirth and related medical conditions), gender, gender identity, gender expression, age, sexual orientation, or military and veteran status or any other category protected by applicable federal, state, or local laws. It is the Company's intention to comply with all applicable laws and regulations. Company policy prohibits unlawful discrimination against applicants or employees. Lam offers a variety of work location models based on the needs of each role. Our hybrid roles combine the benefits of on-site collaboration with colleagues and the flexibility to work remotely and fall into two categories – On-site Flex and Virtual Flex. ‘On-site Flex’ you’ll work 3+ days per week on-site at a Lam or customer/supplier location, with the opportunity to work remotely for the balance of the week. ‘Virtual Flex’ you’ll work 1-2 days per week on-site at a Lam or customer/supplier location, and remotely the rest of the time. Show more Show less

Transaparent RFID desing, HFSS software will be used. Show more Show less

Essential Responsibilities: Sound foundation in RF circuit design in PA and other circuit building blocks in III-V technologies GaAs/GAN (GaN preferable) Support hardware bring-up and characterization Participate in implementation design/layout reviews Contribute with innovative ideas for addressing design problems Required Qualifications: MTech with 4-6 years experience or PhDs with 0-4 years experience from top tier institutes Applicant should have proficient knowledge of RF circuit design and experience with EDA (Cadence, ADS) and EM simulators like CST, HFSS and EMX Experience in layout and parasitic extraction Circuit design, Reliability analysis, Statistical analysis of circuits, Thermal and packaging aspects Must have good technical verbal and written communication skills and ability to work with cross functional teams Be able to collaborate with technical design leads on multiple concurrent projects Preferred Qualifications: Good knowledge of GaN process technology and challenges with traps and pulsing techniques Understanding and experience of designing other RF circuit building blocks like LNA, PA, RF switches and SPSTs is a plus Good publication record and patents Dedication and the ability to work within a very dynamic interdisciplinary environment Ability to communicate as well as work efficiently in an international multi-disciplinary environment. Exceptional spoken and written Proficiency in English Strong analytical and problem-solving skills.

Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product solutions in the automotive, industrial, infrastructure and IoT markets. Our robust product portfolio includes world leading MCUs, SoCs, Analog and power products, plus Winning Combination solutions that curate these complementary products. We are a key supplier to the world’s leading manufacturers of electronics you rely on every day; you may not see our products, but they are all around you. Renesas employs roughly 21,000 people in more than 30 countries worldwide. As a global team, our employees actively embody the Renesas Culture, our guiding principles based on five key elements: Transparent, Agile, Global, Innovative, and Entrepreneurial. Renesas believes in, and has a commitment to, diversity and inclusion, with initiatives and a leadership team dedicated to its resources and values. At Renesas, we want to build a sustainable future where technology helps make our lives easier. Join us and build your future by being part of what’s next in electronics and the world. Job Description We are looking for an experienced leader for high performance SOCs/MCUs, for board and packaging group. Essential Functions Highly experienced in board and package design from block level to final board and package delivery. Should have the ability to work independently with little supervision and drive the team to define, develop and execute the product plan from specification to release. Must be a natural team player and strive towards fostering a highly creative and productive working environment Qualifications Minimum Requirements: MTech/BTech in EC/ EE/CS with hardware engineering experience of 4 to 15 years. Experience in Microcontroller and Microprocessor based complex design Experience in latest packaging Technologies and Manufacturing process Strong domain knowledge of system clocking, system modes, power management, debug Additional Preferred Qualifications Experience in IC packaging layout design, emphasizing advanced technologies like SiP (System-in-Package), flip-chip, and 3D packaging. Comprehensive knowledge of packaging design aspects, encompassing power distribution, thermal control, and signal fidelity. Thermal simulation experience is added advantage. Profound understanding of semiconductor manufacturing methodologies and packaging assembly processes. Board level System architecture and design includes memory or communication interfaces. SOC specifications and board level system specifications. Development and design of SOC power supply, system power supply specifications, and PMIC specifications. Interface specifications incorporating SOC-peripheral devices Experience with high-speed interface i.e. PCIe Gen3/4/5/, LPDDR 4/4x/5/5x, UFS, Ethernet, Flash memory Board level DC/AC simulations. Schematic, Layout and BOM generation using modern CAD tools Experience with SoC Bring-up activities Familiarity with PCB technologies, DFM, DFA, materials, stackup design, assembly rules and manufacturing process Experience with tools: Ansys HFSS or Cadence SI/PI, or other SI/PI, Cadence APD (Allegro Package Designer) for IC package layout design, SIwave, HSPICE, ADS, Q3D Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL Additional Information Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at www.renesas.com. Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas Electronics Corporation empowers a safer, smarter and more sustainable future where technology helps make our lives easier. The leading global provider of microcontrollers, Renesas combines our expertise in embedded processing, analog, power and connectivity to deliver complete semiconductor solutions. These Winning Combinations accelerate time to market for automotive, industrial, infrastructure and IoT applications, enabling billions of connected, intelligent devices that enhance the way people work and live. Learn more at www.renesas.com. Renesas’ mission, To Make Our Lives Easier, is underpinned by our company culture, TAGIE. TAGIE stands for Transparent, Agile, Global, Innovative and Entrepreneurial. Our goal is to embed this unique culture in everything we do to succeed as a company and create trust with our diverse colleagues, customers and stakeholders. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘ To Make Our Lives Easier .’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable, power-efficient solutions today that help people and communities thrive tomorrow, ‘ To Make Our Lives Easier .’ At Renesas, You Can Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things. Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure. Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day. Are you ready to own your success and make your mark? Join Renesas. Let’s Shape the Future together. Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement. Show more Show less

Desired Knowledge: Experience with Electromagnetic Emission and other Regulatory standards. - Simulation of electromagnetic systems using standard simulation software such as Ansys (Maxwell, Q3D, Circuit designer, Simplorer , SIwave, HFSS solvers) or other tools - Comsol or CST Studio. - Hands on experience in a lab environment to prove simulation results. - Provide oral and written reports to management and customers. Expertise and skills needed: BE in Electrical / Electronics Engineering / Power Electronics with a simulation background • Minimum of 3 years of experience EMI 3D modelling, and simulations - Hands on working experience with Ansys Maxwell, ANSYS HFSS tool. Knowledge of EMC simulation tools- Ansys SIWave, Ansys Electronics Desktop , Ansys Simplorer, Hyperlynx SI/PI. • Hands on experience working with EMI/EMC Simulations and working knowledge of RE, CE, RI, CI, ESD, EFT, Surge, Electromagnetic Compatibility (EMC), Electromagnetic Environmental Effects. • Hands on experience working on filter design and filter performance analysis in PCBA level as well as in Electromechanical system level. • Hands on Experience with test equipment VNA, Signal Generator, Spectrum Analyzer, EM probes. • Basic know how of implementation and integration of Hardware (PCBA), Mechanical housing, Firmware (Functions and configurations). • Good to have knowledge in thermal simulation tools. e.g: Icepack , FlowEFD • Sound knowledge of Basic Electronics and Electromagnetics. Mandatory Soft Skills needed: Good communication ability and technical leadership skills • Good presentation skills • Shall be a good team player Shall be highly motivated and ownership taker. Shall be proactive and self confident • Good Analytical and problem-solving skills. Tools to be known: Electromagnetic and EMI/EMC Simulations: ANSYS SIWave, ANSYS Electronics Desktop with Maxwell , HFSS, Q3D, Simplorer, EMIT (OR) CST, Cadence SIG Explorer etc. Good to have - Thermal Simulations : Icepack, FlowEFD. Core Responsibilities: Simulation models of PCBs on Electromechanical systems by understanding applications and relevant physics • Verification and validation of models w.r.t to measurements. • Able to perform EMI simulations and manage large complexity projects independently. • EMC Analysis engineer with good understanding of EMC concept and standards. • Responsible for EMC analysis, includes SI,PI Analysis, PCB level Filters simulations. Responsible for debugging and providing solutions for EMC related issue. • Support Electronics Engineer, Mechanical Engineer, PCB team for layout design with EMC improvement.

Antenna & Advanced Communication Engineer – Space Division Location: Ahmedabad Company: Stdaux As an Antenna & Advanced Communication Engineer, you will own the full design lifecycle of our space communication systems. You will work on RF antennas (phased arrays, reflectors, Wi-Fi) as well as contribute to cutting-edge developments in free-space optical communication (FSO) for satellite and ground-based links. This is a hands-on role with strong collaboration across cross-functional teams—from initial concept to real-world deployment. Key Responsibilities: Design and prototype RF antenna systems (phased arrays, reflectors, Wi-Fi antennas). Perform EM simulations using CST, HFSS, or similar tools. Develop optical link components (FSO terminals, beam steering modules, etc.). Collaborate with optics, electronics, and mechanical teams to integrate optical systems. Create Python-based tools to automate RF and optical test setups. Perform link budget analysis for both RF and optical systems. Support validation, field testing, and scaling to production. Basic Qualifications: Bachelor’s degree in Electrical, Electronics, Communication, or Photonics Engineering. 1+ years of experience in RF or optical communication systems (projects/internships acceptable). Experience with test equipment (VNAs, spectrum analyzers, optical power meters, etc.). Programming experience in Python, MATLAB, or similar. Preferred Qualifications: Master’s or PhD in RF, Antenna, or Optical Communication Engineering. Knowledge of free-space optical (FSO) communication or laser communication systems. Experience with phased array antennas, mmWave, or laser beam steering. Strong fundamentals in communication theory, signal propagation, and link analysis. Familiarity with optical components like collimators, lenses, and detectors. Additional Requirements: Based in Ahmedabad or willing to relocate. Flexibility to work extended hours for mission-critical testing or launches. Willingness to travel occasionally for field tests or site integration. Important Points: Work from Home not allowed in any condition. 6 Months compulsory probation period and you will be probationary employee. Work location can be changed as per the management decision. Show more Show less

Roles and Responsibilities Should be having hing level understanding for Design, develop and test various types of antennas for various applications Conduct research and evaluate the performance of novel antenna design CST/ HFSS/ MATLAB software skills are preferred Develop and maintain technical documentation, including test plans and reports Should have knowledge related to fabrication and testing of the designed antenna. Good communication and analytical problem solving capability. Desired Candidate Profile B.E. or B.Tech with minimum one year of work experience. M.E. or M.Tech fresher. Perks and Benefits Salary, monthly grocery and medical insurance.

Company Qualcomm India Private Limited Job Area Engineering Group, Engineering Group > Hardware Engineering General Summary As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The Following Experience Is a Plus DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers. 3074902 Show more Show less

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Signal Integrity Research and Development (SI R&D) group supports all current and future product development, including DRAM, LPDRAM, NAND, NOR, 3DXP, DIMM modules and SSDs within the consumer, server, mobile, networking, graphics, automobile and embedded businesses. The SI R&D group works on analysis of end to end systems solutions including, but not limited to circuit level IO and Power Distribution, integrated circuit (IC) packages, printed circuit boards (PCBs) and measurements to ensure good Signal Integrity (SI) and power integrity (PI) performance for Micron’s memory solutions. The group owns all steps of the signal and power integrity support process including die IO and package model generation, product performance analysis, system-level SI evaluation, measurement, correlation, and customer support. The group also supports future specification development within several industry standards groups including but not limited to JEDEC, ONFI, and IBIS. The group working environment is technically challenging, team-oriented, collaborative and customer-centric. Within the larger SI R&D group, as an Engineer in the Signal Integrity team at Micron, you will be responsible for Working on various aspects of SI and PI for high speed interfaces, including modeling (silicon, package and board level signal and power delivery network, as necessary for the project), time and frequency domain analysis for SI and PI electrical performance evaluation of Micron products and correlation to measurement for the various products. Ensuring that processes for various methodologies are executed effectively and accurately. Collaborating with TMs within the global SIRD group for development and continued optimization of methodologies for modeling and analysis as needed. Representing the SI R&D team in technical cross functional collaborative groups, and integrating with package design, silicon design, product engineering, and marketing departments to ensure overall product performance. Occasionally Supporting FAE, applications engineers with models for service to external customer as needed Occasionally Supporting path-finding activities through modeling support Qualifications Successful candidates for this position will have: Bachelors or Masters in Electrical/Electronics Engineering wtih 8-15 years of industry experience Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience. Strong SI/PI/EMI theory and application, modeling, analysis, simulation Signal and Power Integrity Background Experience with, and intermediate working knowledge of E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc.. Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface technologies. Deep understanding of timing budgets and jitter analysis Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques. Experience in design and analysis of high-speed single-ended or differential buses Familiarity with, and fundamental understanding of lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc. Familiarity with statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial Desirable Memory industry experience Ambitious candidate should enjoy leading and taking ownership of assigned projects, exhibit good written and verbal interpersonal skills, and have the ability to work well in a team with varied strengths. Successful Candidates For This Position Will Be Pro-active – Candidate will be expected to identify gaps and opportunities and address them with minimal supervision. Collaborator – Candidate will be expected to work with various teams globally; and support both internal as well as external customers Communicator – Candidate should be able to clearly convey necessary details of complex issues and corresponding solutions in both written and verbal formats. We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law. This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices. About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more, please visit micron.com/careers All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status. To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. Show more Show less

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact As a Staff Signal Integrity Engineer with Marvell, you’ll be a member of the Custom Compute & Storage - CCS BU. You’ll be part of the Signal integrity Team designing high performance hardware for the industry leading CCS-BU SoC products targeted for Datacenter, Storage and AI applications. Marvell Custom Compute & Storage - CCS BU has been at the forefront of developing and delivering leading-edge, high-performance data processing silicon platforms. By delivering a stream of technical innovations through a diverse set of fast‐growing product lines, Marvell technology is powering the next‐generation data processing and workload acceleration platforms for the Carrier, Cloud/Enterprise and Automotive Compute market segments. The team focusses on the Custom ASIC business, Cloud AI solutions & Enterprise/Career solutions including the CXL product line. What You Can Expect Engage with Hardware Engineering, Package Design and SoC Design Teams to define the SI/PI requirements and dependencies with support. Perform pre-layout simulations and generate layout guidelines and checklists. Review schematics for the hardware and analyse the feasibility of hardware. Review design and guide PCB layout team for placement and layout for first-time-right design. Perform SI/PI simulation for the hardware and deliver error free reports. Measure fabricated PCBs and perform correlation between simulation and measured results. What We're Looking For Bachelor’s degree in Electrical Engineering and 4 - 8 years of related professional experience or Master’s/PhD in Electrical Engineering with 1-3 years of experience. Strong fundamentals in EM, transmission lines and microwave theory Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity, PowerSI. Experience on any of the schematic and layout tools - Cadence Allegro, Mentor Expedition, Orcad Ability to manage hardware development involving various cross functional teams like HW Design, PCB layout, Hardware assembly, IC packaging teams, Analog and Digital designers, marketing and PCB Fab vendors. Ability to automate the SI, PI and Packaging activities using scripting tools like Python, TCL. Power plane design, modeling and analysis using tools like PowerSI, Power DC, SIwave Working knowledge of circuit analysis tools: ADS, HSpice Frequency domain and time domain knowledge of high speed signaling Familiarity with PCB technologies, DFM, DFA, materials, stackup design rules and assembly rules Prior hands-on experience of reviewing Hardware Schematics and PCB layout on industry standard tools. Understanding, debugging and simulations of hardware design Experience with VNA and TDR measurements for PCB characterization would be a plus. Track record of new product introduction from concept, through development and production is a plus. Knowledge of the thermal analysis of the PCB hardware is a plus. Experience with channel simulations using MATLAB or ADS or other tools is a plus. Strong communication, presentation, and documentation skills Additional Compensation And Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Show more Show less

Senior Simulation Engineer Our Mission SPAN is enabling electrification for all We are a mission-driven company designing, building, and deploying products that electrify the built environment, reduce carbon emissions, and slow the effects of climate change. Decarbonization is the process to reduce or remove greenhouse gas emissions, especially carbon dioxide, from entering our atmosphere. Electrification is the process of replacing fossil fuel appliances that run on gas or oil with all-electric upgrades for a cleaner way to power our lives. At SPAN, we believe in: Enabling homes and vehicles powered by clean energy Making electrification upgrades possible Building more resilient homes with reliable backup Designing a flexible and distributed electrical grid The Role Join the SPAN engineering team as a Senior Simulation Engineer. In this role, you will leverage your expertise in Computational Fluid Dynamics (CFD) and Finite Element Analysis (FEA) to conduct high-quality simulations that drive design decisions and enhance product performance. Familiarity with HFSS for antenna and cable harness applications is a valuable bonus. You will take ownership of simulation activities, working closely with a US-based engineering mentor for technical guidance. The ability to manage simulation tasks across different time zones, specifically between teams in India and the west coast of the USA, is critical. This role demands strong communication and coordination skills, as well as a commitment to continuous improvement. Responsibilities: Independently execute CFD and FEA simulations to provide actionable insights that inform and optimize product designs. Use engineering analysis to drive design decisions on thermal interface materials, electronics and electronic cooling systems, and passive and active cooling methods Design and build thermal experiment test setups, collect experimental data, and leverage experimental and fleet wide data analytics to improve simulation accuracy Collaborate with your engineering mentor to analyze simulation results, recommending design changes to enhance performance and reliability. Coordinate simulation tasks across teams, ensuring effective communication and timely updates between disparate time zones. Document methodologies and findings with clarity, promoting knowledge sharing and contributing to team learning. Actively participate in design reviews, providing insights from simulations to shape project directions and goals. Seek opportunities for professional development through feedback and collaboration with peers. Potential Projects: Analyzing the performance and efficiency of new energy-efficient electrical systems. Conducting simulations to evaluate antenna designs and cable harness configurations. Collaborating with cross-functional teams to integrate simulation findings into physical prototypes and testing. About You Required Qualifications You'd be a great fit for this role if you: Hold a BS or MS in Mechanical Engineering, Electrical Engineering, or a related field. Have 5+ years of hands-on experience in simulations, specifically focusing on CFD and FEA methodologies. Demonstrate a solid understanding of HFSS simulations for RF applications, particularly in antennas and cable harnesses. Exhibit excellent communication skills for coordinating simulation activities across different time zones. Show strong analytical problem-solving skills and the ability to manage multiple projects effectively, taking ownership of simulation outcomes. Advanced knowledge of heat transfer, thermodynamics, linear and non-linear structural analysis, continuum mechanics, and advanced material models Bonus Qualifications Wed love it if you also have: Experience in electro-mechanical design and analysis. Knowledge of international safety and regulatory standards such as UL, NEC, IEC, and ISO. Familiarity with renewable energy technologies and their integration into electrical systems. Life at SPAN Our Bengaluru team plays a pivotal role in SPANs continued growth and expansion. Together, were driving engineering , product development , and operational excellence to shape the future of home energy solutions. As part of our team in India, youll have the opportunity to collaborate closely with our teams in the US and across the globe. This international collaboration fosters innovation, learning, and growth, while helping us achieve our bold mission of electrifying homes and advancing clean energy solutions worldwide. Our in-office culture offers the chance for dynamic interactions and hands-on teamwork, making SPAN a truly collaborative environment where every team members contribution matters. Our climate-focused culture is driven by a team of forward-thinkers, engineers, and problem-solvers who push boundaries every day. Do mission-driven work: Every role at SPAN directly advances clean energy adoption. Bring powerful ideas to life: We encourage diverse ideas and perspectives to drive stronger products. Nurture an innovation-first mindset: We encourage big thinking and bold action. Deliver exceptional customer value: We value hard work, and the ability to deliver exceptional customer value. Benefits at SPAN India Generous paid leave Comprehensive Insurance & Health Benefits Centrally located office in Bengaluru with easy access to public transit, dining, and city amenities Interested in joining our team? Apply today and well be in touch with the next steps!

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } PRINCIPAL R&D/PRODUCT DVL ENGINEER Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelor’s degree in electrical or electronicsengineering, master’s degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIR’s, CTLE’s) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131404 Alternative Locations: Function: Engineering & Technology Job Segment Six Sigma, R&D Engineer, Electrical, Electronics Engineer, Hardware Engineer, Management, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } STAFF R&D/PRODUCT DVL ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Product Dvl Engineer in the Signal Integrity team you will focus on the electrical design, simulation, and verification-validation testing of high speed products in the connector and/or cable assembly, radio system industry—targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of signal integrity for product and system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the signal integrity performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: Subject matter expert in signal integrity design, simulation and validation activities through product development cycles Establishing signal integrity design performance/functional requirements for new products Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Performing PCB design schematic and layout reviews Creating actionable recommendations based upon design reviews and simulation results Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement. Required Skills/ Experiences: Bachelor’s degree in Electrical Engineering or equivalent work experience 8 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 134422 Alternative Locations: Function: Engineering & Technology Job Segment R&D Engineer, Fabrication, Manufacturing Engineer, Electrical Engineering, Front End, Engineering, Manufacturing, Technology Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Sr Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Bachelor’s degree in Electrical Engineering or equivalent work experience 5 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently DESIRED SKILLS: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 132207 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Electrical Engineering, Drafting, Manufacturing Engineer, Front End, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Sr Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Bachelor’s degree in Electrical Engineering. Should have total work experience of 3-5+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131811 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Electrical Engineering, Manufacturing Engineer, Front End, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } SR R&D/PRODUCT DVL ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview The Sr. R&D/Product Development Engineer will be responsible for Design & Development of RF circuits/modules for RFoF (Radio Frequency Over Fiber) products for Aerospace, Defense & Marine Market requirements. The Sr Engineer will work closely with global and local cross functional teams to develop products by translating a customer requirements into a product requirement, work through the development cycle including testing, approval and release into Production. Responsibilities Design and analysis of RF and/or Mixed Signal hardware, define RF link architecture Conduct detailed electrical design, supporting prototype and final hardware build & test Carry out component selection, schematic capture and PCB layout of parts Lead RF hardware projects from design to test to delivery through proper design methodology. Ensure on time delivery and first time right approach in all the project deliverables. Work with local and global counterpart / stake holder for ensuring quality deliverable and project execution. Interface with system, mechanical, software, and other engineers for ensuring design and task completion Work closely with third party vendor / supplier to define the technical requirements for the product and project execution. Mentor the new team members on design and development of RF product design Required Skills Education/ Knowledge: BE/BTech with specialization in Electronics & Communications Engineering Min 10 years of experience in RF Microwave board design and development Critical experience: Experience with RF Microwave design for aerospace & defense applications Handson with LNA and RF PA design and functional testing RF link loss analysis for transceivers and RADAR applications Experience with ADS or Microwave Office, Cadence, Sonnet and HFSS software applications Familiarity with standard test equipment such as oscilloscopes, power meters, logic analyzers, signal/spectrum analyzers, etc. Familiarity with EMI/EMC requirements, qualification processes and electronics documentation Knowledge of RF module applications such as RADAR, Satcom, C5ISER, EW Familiarity with optical transceivers will be an added advantage COMPETENCIES Technical capabilitiesExpert functional/domain knowledge Strong Technical Aptitude with Willingness to learn new Technologies quickly. Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 134427 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Aerospace Engineering, R&D Engineer, Electronics Engineer, Electrical, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } STAFF SIMULATION ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 8,000 engineers, working alongside customers in approximately 140 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Roles and Responsibilities: ROLE OBJECTIVE Executes complex simulations to optimize design and manufacturing. Develops complex Multiphysics simulation methods. RESPONSIBILITIES Leading the development and implementation of complex simulation models to optimize manufacturing designs or processes. Directing cross-functional teams to address and resolve intricate design and manufacturing issues. Analyzing complex simulation results to identify areas for improvement and driving design or process changes. Ensuring the maintenance and updating of simulation models to achieve optimal accuracy and relevance. Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques – implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact activities on financial decision. Education and Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. CAD tools- PTC Creo, Space Claim. Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Knowledge about the Soldering, crimping & welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 14-18 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131861 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Lean Six Sigma, Manufacturing Engineer, Drafting, Welding, Technology, Management, Engineering, Manufacturing Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131812 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Manufacturing Engineer, Front End, CAD, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } SR SIMULATION ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Role Objective and Responsibilities: ROLE OBJECTIVE To perform FEA tasks and provide suitable design recommendations to validate the design virtually. RESPONSIBILITIES Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques – implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a mutli-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact of my activities on financial decision. Education/Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art o FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. o CAD tools- PTC Creo, Space Claim. o Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Ability to understand specification for validation as per US CAR / LV 214 / Similar Specification. Knowledge about the crimping technologies, Ultrasonic welding technologies, Laser welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 8-12 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131864 Alternative Locations: Function: Engineering & Technology Job Segment Lean Six Sigma, Testing, Manufacturing Engineer, Welding, CAD, Management, Technology, Engineering, Manufacturing Apply now »

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. What your background should look like: Job Overview As a Hardware Engineer for TE Connectivity you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Responsibilities: Subject matter expert in high speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelors degree in Electrical Engineering, Masters degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Experience with signal conditioning techniques (equalization, amplification, FIRs, CTLEs) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork

Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Bachelors degree in Electrical Engineering or equivalent work experience 5 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently DESIRED SKILLS: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques

TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Roles & Responsibility: Expert in signal integrity design, simulation, and validation activities through product development cycles. Establishing signal integrity design performance/functional requirements for new products. Performing signal integrity simulations for multiple high-speed standards on each product. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. Creating actionable recommendations based upon design reviews and simulation results. Guiding connector design and component qualifications from a signal integrity standpoint. Making data driven decisions about the product functionality and areas for improvement. Physical verification and testing of boards and Troubleshooting. Evaluate the signal integrity of cables and other components. Evaluate S parameters and characteristic impedance in TDR. Validate the simulation results against closely equivalent international standards, experimental results, or analytical solution as available. Create analysis reports, reference manual and lessons learnt documents. Execute simulations in a quick turnaround time and in sync with the Product Development milestone requirements. Open to learning new skills, tools/software in the simulation domain. Desired candidate profile: Around 5-7 years of research/industrial simulation experience in medical, automobile, aerospace, or any product company. Good knowledge of simulation tools like ANSYS HFSS & PCB design software like Altium. Sound knowledge of Electrical Engineering fundamentals. Ability to come up with new solutions based on analysis and modify designs for evaluation. Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system. Signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools). A solid understanding of electromagnetic theory and electrical circuit behavior

TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise include: materials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork