181 Hfss Jobs - Page 3

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity Ltd. is a $16.5 billion global technology and manufacturing leader creating a safer, sustainable, productive, and connected future. For more than 75 years, our connectivity and sensor solutions, proven in the harshest environments, have enabled advancements in transportation, industrial applications, medical technology, energy, data communications, and the home. With 80,000 employees, including more than 7,500 engineers, working alongside customers in approximately 150 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com Role Objective and Responsibilities: ROLE OBJECTIVE To perform FEA tasks and provide suitable design recommendations to validate the design virtually. RESPONSIBILITIES Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques implicit and explicit approach, using Software tools like Ansys Work Bench, LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a mutli-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact of my activities on financial decision. Education/Knowledge: BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art o FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. o CAD tools- PTC Creo, Space Claim. o Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Ability to understand specification for validation as per US CAR / LV 214 / Similar Specification. Knowledge about the crimping technologies, Ultrasonic welding technologies, Laser welding technologies. Knowledge on technical paper publications & applying for patents. Critical Experience and Competencies: 8-12 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects. COMPETENCIES System and Product knowledgeThorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligenceA thorough understanding of market trends and technologies. Conceptual thinkingBeing able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracyAn underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skillsFluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder managementManage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people managementSupervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated.

The people here at Apple don’t just build products- they craft the kind of wonder that has revolutionized entire industries. It’s the diversity of those people and their ideas that encourages the innovation that runs through everything we do, from amazing technology to industry-leading environmental efforts. Imagine what you could do here. Join Apple, and help us leave the world better than we found it! A job at Apple is unlike any other you’ve had. You will be challenged. You will be inspired. And you’ll be proud! At Apple, phenomenal ideas have a way of becoming phenomenal products, services, and customer experiences very quickly. Bring passion and dedication to your job, and there's no telling what you could accomplish! In this role, you will design, optimize, and validate EMC solutions. You’ll collaborate with a multi-functional team to bring projects from concept to mass production while ensuring high quality and reliability. You will tackle challenging issues, research new solutions, and leverage your technical expertise to drive innovation. Description As an EMC engineer in Bangalore, India, you will work alongside EMC engineers at the US headquarters to design and implement EMC solutions on Apple products. The candidate will also act as a liaison with India-based contract manufacturers, vendors and third-party test labs to implement the best design practices and follow the highest quality test procedures. The candidate must have a thorough understanding of EMC design methodologies, testing of ITE products, and be highly skilled in EMC/ESD debug techniques. Responsibilities Review mechanical designs of enclosures, connectors, and cables for EMC compliance Review printed circuit board (PCB) schematics and layouts for emissions and immunity control Partner with vendors on defining component specifications and validation procedures to meet EMC requirements at the system level Prepare comprehensive test plans, supervise validation, and compile reports Troubleshoot electrical and mechanical sources of EMC failures and identify solutions that are agreeable to cross-functional partners Define validation requirements and train test engineers on data collection at factories and Apple labs Review and analyze data from multiple designs, present findings to peers, partners and management and recommend design changes Minimum Qualifications Bachelor's degree in Electrical Engineering and 5 years of practical experience Experience with layout and schematic review tools such as Allego, Mentor Graphics, and Altium Designer Experience with Radio Frequency (RF) and/or EMC measurement equipment Preferred Qualifications Master's or PhD in Electrical Engineering with a specialisation in electromagnetic fields and/or applications Extensive experience in one of the following fields: EMC, ESD, RF/Antenna, Signal Integrity and Power Integrity In-depth knowledge of worldwide EMC regulations, test methods, and standards, including EN55022, EN55032, IEC61000-3-3, IEC61000-4-2, IEC61000-4-3, IEC61000-4-4, IEC61000-4-5, IEC61000-4-6, IEC61000-4-11, and ETSI 301 489-7 Experience with Matlab and scripting for test automation and data analysis Experience with electromagnetic modeling and simulation tools such as CST, HFSS, ADS, and PowerSI Ability to build effective working relationships with other engineers and cross-functional partners Excellent communication and organizational skills Willing and able to support occasional international travel to other Apple sites, vendors, and contract manufacturers Familiarity with lab equipment and maintenance procedures, including calibration and verification of ESD guns, surge testers, receivers, oscilloscopes, SAs, VNAs, cables, amplifiers, LISNs, and CDNs Experience in product testing and validation at contract manufacturers and at ISO 17025 accredited labs Submit CV

Company Description MaxLinear is a fabless semiconductor company providing systems-on-chip (SoC) solutions for broadband, mobile and wireline infrastructure, data center, and industrial and multi-market applications. Our engineering excellence, innovation, and execution enable customers to achieve competitive advantages such as shorter design cycles, significant design flexibility, and low system-level costs. Utilizing low-cost CMOS process technology, our solutions integrate analog and digital functionalities delivering high performance, low manufacturing cost, and reduced power consumption. Our vision is to revolutionize the way the world connects and communicates. Role Description MaxLinear is seeking a Principal Signal & Power Integrity (SI/PI) Engineer to join our growing team. In this role, you will focus on the following: Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 800G/1.6Tbps DSPs and TIAs) for data center connectivity and storage for AI applications. Qualifications - Bachelor’s or Master’s degree in EE or related fields with 14 +years of SI/PI experience or PhD in EE or related fields with 8+ years of SI/PI experience Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors) Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI Understanding of S-parameters, Smith Chart, and frequency domain analysis Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers Expertise in time and frequency domain analysis using simulation tools like ADS, SPECTRE, etc. Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR, etc. Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams Self-motivated with ability to work effectively in both independent and team settings Strong communication, presentation, and documentation skills Excellent problem-solving skills; Ability to excel.

Role & responsibilities: Good Technical knowledge on RF/ Microwave, Mixed-signal, Digital, Analog Circuits & Sub- Systems, current prototype/ production/ process technology. Experience on design, development, testing, debugging & field trials of RF/Digital subsystems like Transmitters, Receivers, Frequency converters, Mixers, PLL Synthesizers, Amplifiers, Filters, passive components, etc. for strategic electronics requirements. Experience/ Programming knowledge on DDS, Direct conversion, Agile Transceiver ICs, Mixers, and Synthesizers. Experience in Board & Circuit design, simulation, testing, integration, validation, debugging and optimization of performance parameters like Power, Frequency, S parameters, Impedance matching, Modulation techniques, etc. with consideration of A&D Quality & EMI/EMC standards. Experience in RF/ Mixed signal schematic preparation, DRC check, power budget analysis, Net- list generation and verification, PCB layout, manufacturing & assembly. Understanding of scope of work, client inputs/requirements specifications, input analysis, architecture, component selection, ordering, preparation of Block diagram. Hand-on testing experience using microwave test equipment’s like network analyzer, spectrum analyzer, Signal generator, Oscilloscope, Noise source, etc. Very good skills for documentation, generation & execution skills of ATP, ATR, TDR, CMR, QMS Reports, Project management, planning & organizing. Quick learner, efficient team member, result oriented, good communication & interpersonal skills, integrity, persistence. Key Skills: Filters Spectrum Analyzer Analog Circuit Design RF/ Microwave RF Design EMI / EMC Amplifiers Network Analyzer Mixed Signal Design ADS HFSS Schematic PCB Layout. Preferred candidate profile: B.Tech/B.E. - Electronics/Telecommunication, Computers M.Tech - Electronics/Telecommunication, Computers Exp. 5 - 7 years Role - Design Engineer Industry Type - Defence & Aerospace Department - Research & Development

subsystems fromTo validate circuit designs, use RF design/simulation tools such as ADS, EMDS, ESOFF, and Microwave OfficeRole & responsibilities RF Design & Development: Design, simulate, and test RF front-end components including filters, diplexers, directional couplers, up/down converters, SSPAs, and antennas for Satcom and terrestrial communication systems. Develop and evaluate wireless communication systems as per defense and telecom standards. Simulation & Testing: Utilize RF design/simulation tools such as ADS, EMDS, ESOFF, and Microwave Office to validate circuit designs. Perform RF testing using industry-standard test equipment, ensuring compliance with performance specifications. System Integration & Lifecycle Management: Manage the complete lifecycle of RF subsystemsfrom requirements gathering to final implementation and delivery. Ensure design compliance with thermal, EMI/EMC standards, and environmental specifications. Defense Standards & Documentation: Ensure adherence to defense-specific standards such as MIL-STD-810, JSS 55555, and MIL-STD-704. Prepare and maintain technical documentation as per defense requirements and quality management systems. Collaboration & Technical Support: Coordinate with hardware, software, and testing teams to ensure smooth integration of RF modules into larger systems. Provide technical support during product testing, validation, and certification phases. Design Process and Quality Compliance: Follow structured design processes adhering to AS9100D and ISO 9001:2015 quality standards. Ensure timely updates and quality-driven outputs across all project stages. Communication and Reporting: Effectively communicate technical concepts and project updates to internal teams and external stakeholders. Contribute to proposal preparation and support technical evaluations for new projects.

Key Job Responsibilities Candidate will be responsible for:- Automotive Radar Sensors integration- Electromagnetic (EM) Simulations- Understanding new Radar Signal Processing- Electromagnetic modeling of RADAR sensors inside the Vehicle- Analyze Vehicle Integration effects of sensor packaging and identify solutions- Creating various meshed models for multiple observations- Training new team members- Project Tracking- Working in global interdisciplinary teams- Reports and presentation preparation of Simulation resultsEligibility Criteria Requirements:- Degree in Engineering/Technology or Postgraduate degree in Physics from reputed universities- FMCW, Radar Signal Losses- Sound knowledge of MATLAB/C++, SIMULINK/LABVIEW- Knowledge of analytical EM modeling and Experience on 3D EM simulation tools like FEKO, HFSS, CST etc.- Experience on antenna design, hardware development, and test- Experience with design for manufacturer of precision microwave assemblies that use high volume manufacturing technologies- Experience working in an interdisciplinary environment- Hands-on design experience through laboratory testing, system measurements, and troubleshooting skills Preferences:- German Language- Masters Degree in Electronics/Electrical Engineering + Experience of 2-10 Yrs- Experience of working on RADAR sensor design, simulation and measurement- Antenna software skills, Circuit design, RF components experience- Experience of working with/in OEM- Experience of working in International Environment- Knowledge of Radar Cross-section estimation/Radar Clutter Simulation/Multi-target multi sensor simulationQualifications - Internal Job Title : Radar RF Integration and Simulation EngineerJob Location : BangaloreKey Job ResponsibilitiesCandidate will be responsible for:- Automotive Radar Sensors integration- Electromagnetic (EM) Simulations- Understanding new Radar Signal Processing- Electromagnetic modeling of RADAR sensors inside the Vehicle- Analyze Vehicle Integration effects of sensor packaging and identify solutions- Creating various meshed models for multiple observations- Training new team members- Project Tracking- Working in global interdisciplinary teams- Reports and presentation preparation of Simulation resultsEligibility CriteriaRequirements:- Degree in Engineering/Technology or Postgraduate degree in Physics from reputed universities- FMCW, Radar Signal Losses- Sound knowledge of MATLAB/C++, SIMULINK/LABVIEW- Knowledge of analytical EM modeling and Experience on 3D EM simulation tools like FEKO, HFSS, CST etc.- Experience on antenna design, hardware development, and test- Experience with design for manufacturer of precision microwave assemblies that use high volume manufacturing technologies- Experience working in an interdisciplinary environment- Hands-on design experience through laboratory testing, system measurements, and troubleshooting skillsPreferences:- German Language- Masters Degree in Electronics/Electrical Engineering

Designs a complete and complex Simulation framework, system, or product. Define simulationprocesses for technical platforms, system specifications, input/output and working parameters for hardware and/or software compatibility. Conceives system interfaces and business application prototypes. Identifies, analyzes and resolves system design weaknesses. Influences the shaping of future products by contributing to the framework (architecture) used across multiple products or systems. Roles and Responsibilities: ROLE OBJECTIVE To perform FEA tasks and provide suitable design recommendations to validate the design virtually RESPONSIBILITIES Validate concept designs using simulation techniques and determine design robustness, critical to function requirements. Deploy FEA Techniques implicit and explicit approach, using Software tools like Ansys Work Bench , LSDyna, Hypermesh, Simufact, Digimat etc Translate actual problem to Finite Element Analysis (FEA) model, interpret analysis results and select best solution which includes linear & non-linear analysis under different physics. Monitor and evaluate simulation software capabilities and industry trends. Deploy standardized process and work methodology. Train and develop capability of the team to be a mutli-skilled resource pool. Benchmark implement productivity improvement methods. Track monitor metrics for sustained performance covering quality & delivery. Collaborate with design & validation teams to enhance the design optimization. Understanding the influence/impact of my activities on financial decision. Education and Experiences: EDUCATION/KNOWLEDGE BE/ B.Tech (Mechanical/Electrical) M Tech (Mechanical/Electrical) (preferred) Knowledge of product, design processes and methodology. Proficiency in state-of-the-art o FEA- ANSYS WORKBENCH, LS-DYNA, HYPERMESH, SIMUFACT, MOLDEX3D, OPTISLANG, ICEPAK MAXWELL, Ansys HFSS System simulations such as MATLAB & SIMULINK. o CAD tools- PTC Creo, Space Claim. o Programming language - Python, Microsoft VB-script, Power IB. Proficiency in use of MS Office tools. Knowledge of associated manufacturing processes (molding, stamping, plating, crimping & assy). Ability to understand specification for validation as per US CAR / LV 214 / Similar Specification. Knowledge about the crimping technologies, Ultrasonic welding technologies, Laser welding technologies. Knowledge on technical paper publications & applying for patents CRITICAL EXPERIENCE 8-12 years of industry experience. Expertise in Ansys Workbench. Experience on connector products (Plastic and Sheet Metal parts). Knowledge on material science (Metals, Resins & hyper elastic material) and implement for simulation. Correlation of Test and simulation data / results. Expertise on CAE tools, Optimization techniques, and testing methods. Implementing of LEAN / 6 Sigma / Kaizen techniques to live projects COMPETENCIES System and Product knowledge: Thorough understanding of customer requirements, product and application needs, required for creating effective designs Market intelligence: A thorough understanding of market trends and technologies. Conceptual thinking: Being able to see a broad picture, understand problems by putting the pieces together and simplify complex issues. Concern for order, quality, and accuracy: An underlying drive to reduce uncertainty by continuous risk assessments, taking accurate decisions, and continuously improve processes. Communication skills: Fluent communication skills to be able to articulate well with customers and teams across different functions & locations. Internal stakeholder management: Manage requests, address customer requirements and work effectively with different cross functional teams. Interpersonal skills and people management: Supervise and manage a team by ensuring compliance with rules and processes at TE and keep them motivated.

Own antenna/array designs from topology selection and modeling to prototyping, tuning, chamber validation, and release to production. Translate system-level targets (coverage, link budget, EIRP/ERP limits, form-factor/cost) into antenna specifications. Build parametric EM models and correlate simulation to measurement; maintain analysis scripts and golden test procedures. Partner with ME/EE/NPI to drive manufacturability, yield, and root-cause investigations. Requirements: B.Sc. in Electrical Engineering (EM/RF focus); MSc/PhD preferred. 5+ years end-to-end antenna design (concept → EM simulation → prototype → validation → manufacturing handoff). Hands-on experience with two or more: patch arrays, horn arrays, parabolic reflectors, dipole/monopole arrays. Proficiency with full-wave EM solvers (CST preferred; HFSS/FEKO or similar acceptable). Strong MATLAB and/or Python for array synthesis, optimization, and data reduction. Lab proficiency: VNA (SOLT/TRL), OTA/anechoic measurements (gain/efficiency/patterns/ECC), fixture de-embedding. Solid grasp of array fundamentals: mutual coupling, scan loss, grating-lobe control, polarization/isolation. Practical RF PCB layout literacy (stack-up, feeds/matching, grounding/shielding) and DFM/tolerance awareness. Clear documentation and effective cross-functional communication. Nice to have- Phased-array design (active/passive networks, phase shifters, codebooks; Butler/Blass feeds). Wideband and dual-polarized elements; radome & mechanical co-design. RF test automation (Python/PyVISA/LabVIEW/C#) and data/report pipelines. Regulatory/OTA familiarity (FCC/CE, CTIA-style OTA), basic EMC considerations. Familiarity with wireless communication standards, especially Wi-Fi 6/7 (802.11ax/be) and implications on antenna design Understanding of MIMO systems, beamforming principles and implications on antenna design

Description: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Requirements: The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Job Responsibilities: Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 4+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models What We Offer: Exciting Projects: We focus on industries like High-Tech, communication, media, healthcare, retail and telecom. Our customer list is full of fantastic global brands and leaders who love what we build for them. Collaborative Environment: You Can expand your skills by collaborating with a diverse team of highly talented people in an open, laidback environment — or even abroad in one of our global centers or client facilities! Work-Life Balance: GlobalLogic prioritizes work-life balance, which is why we offer flexible work schedules, opportunities to work from home, and paid time off and holidays. Professional Development: Our dedicated Learning & Development team regularly organizes Communication skills training(GL Vantage, Toast Master),Stress Management program, professional certifications, and technical and soft skill trainings. Excellent Benefits: We provide our employees with competitive salaries, family medical insurance, Group Term Life Insurance, Group Personal Accident Insurance , NPS(National Pension Scheme ), Periodic health awareness program, extended maternity leave, annual performance bonuses, and referral bonuses. Fun Perks: We want you to love where you work, which is why we host sports events, cultural activities, offer food on subsidies rates, Corporate parties. Our vibrant offices also include dedicated GL Zones, rooftop decks and GL Club where you can drink coffee or tea with your colleagues over a game of table and offer discounts for popular stores and restaurants!

Description DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Requirements The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Job responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 4+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models What we offer Culture of caring. At GlobalLogic, we prioritize a culture of caring. Across every region and department, at every level, we consistently put people first. From day one, you’ll experience an inclusive culture of acceptance and belonging, where you’ll have the chance to build meaningful connections with collaborative teammates, supportive managers, and compassionate leaders. Learning and development. We are committed to your continuous learning and development. You’ll learn and grow daily in an environment with many opportunities to try new things, sharpen your skills, and advance your career at GlobalLogic. With our Career Navigator tool as just one example, GlobalLogic offers a rich array of programs, training curricula, and hands-on opportunities to grow personally and professionally. Interesting & meaningful work. GlobalLogic is known for engineering impact for and with clients around the world. As part of our team, you’ll have the chance to work on projects that matter. Each is a unique opportunity to engage your curiosity and creative problem-solving skills as you help clients reimagine what’s possible and bring new solutions to market. In the process, you’ll have the privilege of working on some of the most cutting-edge and impactful solutions shaping the world today. Balance and flexibility. We believe in the importance of balance and flexibility. With many functional career areas, roles, and work arrangements, you can explore ways of achieving the perfect balance between your work and life. Your life extends beyond the office, and we always do our best to help you integrate and balance the best of work and life, having fun along the way! High-trust organization. We are a high-trust organization where integrity is key. By joining GlobalLogic, you’re placing your trust in a safe, reliable, and ethical global company. Integrity and trust are a cornerstone of our value proposition to our employees and clients. You will find truthfulness, candor, and integrity in everything we do. About GlobalLogic GlobalLogic, a Hitachi Group Company, is a trusted digital engineering partner to the world’s largest and most forward-thinking companies. Since 2000, we’ve been at the forefront of the digital revolution – helping create some of the most innovative and widely used digital products and experiences. Today we continue to collaborate with clients in transforming businesses and redefining industries through intelligent products, platforms, and services.

Job Overview TE Connectivitys R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Individual must be highly motivated, a quick learner, and able to work independently Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork

We are seeking a highly motivated and technically proficient Technical Lead to manage and guide our efforts in supporting academic institutions in the adoption and effective use of Ansys simulation software . The ideal candidate will possess a deep understanding of simulation technologies and engineering principles, coupled with strong communication and leadership skills. Duties: Lead and mentor a team of technical engineers and application specialists in supporting academic institutions. Oversee day-to-day operations, allocate tasks, and ensure timely and high-quality support delivery. Develop and maintain strategic relationships with key academic stakeholders (faculty, department heads, lab administrators). Stay updated on the latest developments in simulation tools, particularly within the Ansys ecosystem, to guide the team and educational partners effectively. Work closely with faculty members to understand their curriculum, research needs, and recommend relevant Ansys tools and simulation methodologies. Conduct training sessions for faculty and lab instructors to enable them to independently use and teach Ansys products. Assist in integrating Ansys software into academic courses, labs, and research projects with tailored technical recommendations. Skills: Proven experience leading technical teams or projects in an academic or corporate setting. Excellent understanding of Finite Element Analysis, Electrical machines, Machine design Self-starter with excellent verbal, communication, and interpersonal skills. Strong proficiency in one or more Ansys simulation tools (Ansys Mechanical, Fluent, HFSS, Workbench, etc.). Solid understanding of Finite Element Analysis (FEA), Computational Fluid Dynamics (CFD), and Multiphysics simulations.

Technical Skills Required/ Mandatory: 1. B. Tech or M Tech in ECE or CSE or equivalent field & Minimum 3 years of relevant experience in Embedded Hardware Design. 2. Proficiency in electronic circuit design and analysis. 3. Design Analysis, Component selection and Analysis. 4. Expertise in schematic capture and PCB layout tools (e.g., Cadence, Altium). 5. Strong knowledge of digital and analog electronics. 6. Knowledge of high-speed PCB design techniques. Also, Multilayer PCBs and FPGA design. 7. Understanding of signal integrity and power integrity principles. 8. Test the prototypes and debug the issues. 9. Familiarity with microcontroller architectures and programming languages. 10. Competence in simulation and modeling tools (e.g., SPICE, MATLAB). 11. Proficiency in using lab equipment for testing and characterization. 12. Understanding of electromagnetic compatibility (EMC) and electromagnetic interference (EMI) considerations. 13. Knowledge of industry-standard communication protocols (e.g., UART, SPI, I2C, RS422, RS232, Parallel Interface and Ethernet 10/100 mbps). 14. Expertise in power supply design and regulation. 15. Proficiency in using hardware debugging tools (e.g., oscilloscope, logic analyzer). 16. Understanding of embedded systems and firmware development. 17. Knowledge of thermal management techniques. 18. Experience with design for manufacturing (DFM) and design for testability (DFT). 19. Understanding of reliability and failure analysis. 20. Knowledge of regulatory compliance requirements (e.g., FCC, CE). 21. Hardware Documentation. Optional Skills Required 1. Experience in Defense and Aerospace Industry 2. Hands-on knowledge in Simulation Tools like Hyperlynx, Ansys SIWAVE, HFSS or Cadence Sigrity. 3. Experience with FPGA and CPLD programming is an advantage. 4. Competence in hardware description languages (e.g., VHDL, Verilog) is a plus. 5. Familiarity with RF and wireless communication principles

Key Responsibilities: 1. Teaching & Academics Deliver lectures to undergraduate, postgraduate, and doctoral students in core and advanced subjects such as: Analog and Digital Electronics VLSI Design Signal Processing Embedded Systems Wireless Communication IoT and RF Systems Prepare detailed lesson plans, lab manuals, and teaching materials. Conduct practical sessions and supervise project-based learning. 2. Research & Publications Lead research projects and collaborate on funded research (DST, AICTE, ISRO, DRDO, etc.). Publish high-impact research papers in reputed journals and conferences (SCI/Scopus-indexed). Guide M.Tech and Ph.D. scholars in cutting-edge research areas. 3. Curriculum Development Lead curriculum innovation and design of new electives or certification programs. Ensure alignment of academic programs with industry trends and regulatory bodies (AICTE, NBA, NAAC). Incorporate emerging technologies and interdisciplinary learning into the syllabus. 4. Academic Leadership & Mentorship Mentor junior faculty, assist in their professional development, and lead academic teams. Guide students in research projects, internships, and placements. Chair departmental meetings, committees, and academic review boards. 5. Industry & Institutional Collaboration Build and maintain relationships with industry partners for research, internships, and placements. Organize national/international conferences, workshops, FDPs, and technical symposia. Represent the department in academic councils and external boards. Qualifications & Experience: Educational Qualifications: Ph.D. in Electronics and Communication Engineering or a related discipline (mandatory) M.E./M.Tech and B.E./B.Tech in ECE or allied branches with first class Experience: Minimum 10 years of teaching/research/industry experience, including at least 5 years as an Associate Professor Strong publication record with at least 10 research publications in peer-reviewed journals Evidence of guiding Ph.D./PG scholars and securing funded research projects Skills & Competencies: Deep expertise in core and emerging areas of ECE Strong leadership, mentoring, and academic management skills Excellent communication, presentation, and interpersonal abilities Familiarity with academic accreditation processes (NBA, NAAC, NIRF) Proficiency in simulation and design tools like MATLAB, Xilinx, Multisim, HFSS, etc.

Requisition #: 16889 Ansys is now a part of Synopsys. Synopsys, Inc. (Nasdaq: SNPS) accelerates technology innovation from silicon to systems. Catalyzing the era of pervasive intelligence, we deliver design solutions, from electronic design automation to silicon IP, to system design and multiphysics simulation and analysis. We partner closely with our customers across a wide range of industries to maximize their R&D capability and productivity, powering innovation today that ignites the ingenuity of tomorrow. Learn more at www.synopsys.com. Summary / Role Purpose The Product Specialist (m/f/d) joins the Ansys Electronics Business Unit to conduct software testing of Ansys Electronics applications such as HFSS, SIwave, Q3D Extractor, Maxwell and Icepak on Cloud environment. This role helps to assess how well the product meets customers needs both in terms of functionality and usability and ensures that product requirements and quality standards are satisfied per the companys quality procedures. The individual works closely with other members of the product creation and field engineering team and communicates with technical specialists on product issues. In this position, the engineer contributes to the quality of tools that are used throughout the industry to develop electronics products in a wide range of industries. Key Duties And Responsibilities Test Ansys Electronics Products on Cloud and HPC (High Performance Computing) Environment Perform benchmark of projects on different HPC and Hardware configuration Develop/contribute to automation scripts Apply standard techniques and procedures and comply with the company&aposs overall development and testing processes Work in a variety of computing environments: Windows, Linux, AWS, Azure, Any programming or scripting language C++/Python/.. Work closely with product owners, documentation and development in an agile environment. Support the team in following the Ansys software development life cycle Analyze defect reports from customers Minimum Education/Certification Requirements And Experience BS in Engineering, Electronics and Communication, Electrical and Electronics or related field Preferred Qualifications And Skills Electromagnetic simulation experience (HFSS highly preferred) Experience with HPC (including GPU) and Cloud environment Familiarity with Python and automation scripts Basic understanding of software testing and verification processes Good communication and interpersonal skills Ability to learn quickly and to collaborate with others in a geographically distributed team Fluent English, both written and spoken Rewards And Benefits We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non-monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process. At Ansys, part of Synopsys, we want talented people of every background to feel valued and supported to do their best work. We consider all applicants for employment without regard to race, color, religion, national origin, gender, sexual orientation, age, military veteran status, or disability. Show more Show less

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable todays needs and tomorrows next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world were living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description We are seeking a Senior Manager, Hardware Development Engineering to join our innovative team in Bengaluru, India. In this role, you will lead and oversee the Signal Integrity, Power Integrity, electrical validation, driving technological advancements and ensuring the delivery of high-quality products. Lead and manage a team of SI/PI, Validation engineers, providing technical guidance and mentorship for Sandisk&aposs retail product group that covers products like USB, portable SSD, SD/uSD/Express cards etc Develop and implement SI/PI strategies aligned with organizational goals Collaborate with cross-functional teams to define product requirements and specifications Analyze and resolve complex technical issues in hardware design and development Manage project timelines, budgets, and resources effectively Stay up-to-date with emerging technologies and industry trends Present technical proposals and progress reports to senior management Foster a culture of innovation and continuous improvement within the team Qualifications Bachelor&aposs degree in Electrical Engineering, Computer Engineering, or related field; Master&aposs degree preferred 15+ years of experience in hardware development engineering, with 3+ years in a managerial role Proven track record in leading successful hardware development projects Strong expertise in extraction tools like HFSS, Hyperlynx etc and hands on experience with simulation tools like HSPICE, ADS etc Sound knowledge of SERDES interfaces, NAND/DRAM, optimizing power integrity etc. In-depth knowledge of hardware design principles and manufacturing processes Excellent project management skills; PMP certification is a plus Experience with product lifecycle management Strong analytical and problem-solving abilities Exceptional leadership and team management skills Excellent communication and interpersonal skills Domain expertise in consumer electronics, telecommunications, or industrial automation Ability to work effectively in a fast-paced, dynamic environment Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at [HIDDEN TEXT] to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying. Show more Show less

Description Amazon Lab126 is an inventive research and development company that designs and engineers high-profile devices like the Kindle family of products. Lab126 began in 2004 as a subsidiary of Amazon.com, Inc. Since then, we have worked to produce best-selling e-readers and tablets, as well as new inventions like Echo line of products, Fire TV and Fire phone. What will you help us create? Key job responsibilities As a Signal Integrity Engineer, you will be part of Validation team that is exploring new hardware designs to improve our devices. In this role, you will be responsible for Signal Integrity aspects, compliance, and interoperability of package substrate, PCB, Cable solutions and system-level SI for interfaces like PCIe, DDR, Clocks etc. You will also be responsible for contributing to package and platform design guideline development. Role You will work closely with multi-disciplinary groups including Board Design, System Architects, IP developers, and Design Engineering, to verify and deliver complex, high volume SoCs that enable development of world-class hardware devices. In this role, you will be: Responsible for defining the design guidelines for internal and external design teams and delivering reference simulation docs for customers Performing modeling of package substrate/PCB channels elements in 3D/2D EM simulation tools. Working with silicon designers, platform designers, package designers, electrical validation teams, etc. to support interconnect and interface performance requirements. Reviewing and evaluating package and board design and providing review feedback. Responsible for providing power delivery solutions across platform, package and SOC level Definition of worst-case currents and voltage drop scenarios, MIM/decoupling allocation, grid choices and analysis, droop control, SOC ESD compliance, On-die droop detectors, usage of on-die delivery solutions like VR, LDO, and Power gates. Basic Qualifications Bachelors in Electrical or Computer Engineering/Computer Science 6+ years in working on validation of ASIC/SoC products High speed serial interface analog building blocks, protocol, specifications and test methods Familiarity with Simulation tools (ADS, HFSS, PowerSI, PowerDC, Hyperlynx) to execute SI-PI simulations is required. Experience with performing measurement, and correlating measurements to simulations. Experience with modeling and simulation of high-speed interface interconnects/channel. Excellent analytical and problem solving skills Preferred Qualifications Masters in Electrical or Computer Engineering/Computer Science Understanding of Power & signal integrity concepts such as differential impedance, jitter, insertion loss, return loss, termination, etc. Scripting experience in any programming language (C++, Python, PERL, MATLAB) to develop automation scripts is a plus. Experience in Analog IP Characterization (SerDes, PLL, DDR) is desirable. Good understanding of High-Speed Analog/Digital Circuits, VLSI, semiconductor physics Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner. Company - ADCI - BLR 14 SEZ Job ID: A3042301

Company Description Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. Job Description We are seeking a Senior Manager, Hardware Development Engineering to join our innovative team in Bengaluru, India. In this role, you will lead and oversee the Signal Integrity, Power Integrity, electrical validation, driving technological advancements and ensuring the delivery of high-quality products. Lead and manage a team of SI/PI, Validation engineers, providing technical guidance and mentorship for Sandisk's retail product group that covers products like USB, portable SSD, SD/uSD/Express cards etc Develop and implement SI/PI strategies aligned with organizational goals Collaborate with cross-functional teams to define product requirements and specifications Analyze and resolve complex technical issues in hardware design and development Manage project timelines, budgets, and resources effectively Stay up-to-date with emerging technologies and industry trends Present technical proposals and progress reports to senior management Foster a culture of innovation and continuous improvement within the team Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering, or related field; Master's degree preferred 15+ years of experience in hardware development engineering, with 3+ years in a managerial role Proven track record in leading successful hardware development projects Strong expertise in extraction tools like HFSS, Hyperlynx etc and hands on experience with simulation tools like HSPICE, ADS etc Sound knowledge of SERDES interfaces, NAND/DRAM, optimizing power integrity etc. In-depth knowledge of hardware design principles and manufacturing processes Excellent project management skills; PMP certification is a plus Experience with product lifecycle management Strong analytical and problem-solving abilities Exceptional leadership and team management skills Excellent communication and interpersonal skills Domain expertise in consumer electronics, telecommunications, or industrial automation Ability to work effectively in a fast-paced, dynamic environment Additional Information Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution. Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.

#Connections #Hiring #Experience # Hi Connections, We are hiring... Job Title: Package & PCB Design Engineer Location: Hyderabad / Bangalore / Hybrid Department: Semiconductor Packaging & PCB Design Employment Type: Full-Time Job Summary We are seeking an experienced Package & PCB Design Engineer to design advanced semiconductor packages and printed circuit boards for high-performance SoCs, ASICs, and AI accelerator products. The role involves working on package substrate design, PCB layout, high-speed signal routing, and collaborating closely with chip design, mechanical, and manufacturing teams to ensure electrical, thermal, and mechanical reliability. Key Responsibilities ● Design chip packages (FCBGA, flip-chip, WLCSP, SiP, 2.5D/3D IC) meeting electrical, thermal, and mechanical requirements. ● Develop PCB layouts for evaluation boards, reference designs, and production systems. ● Perform high-speed signal integrity (SI) and power integrity (PI) simulations. ● Define and implement routing strategies for high-speed interfaces (PCIe, DDR, USB, MIPI, Ethernet). ● Collaborate with IC design teams to define package pinouts and ball maps. ● Work with mechanical engineers to ensure thermal dissipation and mechanical stability. ● Create Gerber files, fabrication drawings, and documentation for manufacturing. ● Interface with PCB/OSAT vendors for fabrication and assembly. ● Support prototype bring-up and debug of package/board-related issues. ● Ensure compliance with industry standards (IPC, JEDEC) and EMI/EMC regulations. Required Skills & Qualifications ● Bachelor’s/Master’s degree in Electrical/Electronics/Mechanical Engineering. ● 3+ years of experience in semiconductor package and PCB design. ● Proficiency in package and PCB CAD tools: Cadence Allegro/OrCAD, Mentor Xpedition, Altium Designer, or similar. ● Strong understanding of signal integrity, power integrity, and thermal management. ● Knowledge of manufacturing processes for packages and PCBs. ● Experience with design for manufacturability (DFM) and design for test (DFT) in packaging. ● Familiarity with material selection for thermal/electrical performance. Preferred Qualifications ● Experience with advanced packaging technologies (2.5D interposers, 3D stacking, chiplets). ● Knowledge of HDI PCB design for high-density interconnects. ● Familiarity with EDA co-design flows (chip-package-PCB integration). ● Experience in healthcare or AI hardware products with specific regulatory constraints. ● Hands-on experience with EM simulation tools (Ansys HFSS, Keysight ADS). What We Offer ● Opportunity to work on cutting-edge chip packaging and PCB design for next-gen products. ● Collaboration with global semiconductor and AI hardware experts. ● Access to advanced tools and manufacturing partners. ● Competitive compensation, bonuses, and career development opportunities. Interested guys, kindly share your updated profile to pavani@sandvcapitals.com or reach us on 7995292089. Thank you. Job Type: Full-time Pay: ₹1,000,000.00 - ₹1,500,000.00 per year Experience: PCB: 3 years (Required) Work Location: In person

About Mistral: Mistral offers RF design services for aerospace and defense applications. Our engineering team adopts a highly-disciplined development approach starting with a comprehensive requirement document followed by a feasibility study to reduce identified risks. This leads to circuit design, simulation, modeling, and prototyping. A comprehensive test plan for RF design is developed and used to ensure that the resulting design meets the requirement specification. Why Mistral? 1. Core Technology Company 2. Flexibility to Work Across Domains 3. Great Learning Opportunity on newer Technologies 4. Flexibility to learn…Freedom to execute…Opportunity to grow 5. Can Gain Expertise – Complete Product Cycle 6. Process Oriented 7. Open Culture, Easy Accessibility to Seniors & Management Key Skills:- Solid understanding of and experience in RF hardware and system design Experience and understanding in RF component characteristics and behavior: PLL, DDS, LNA, Mixer, PA , Filter, Coupler, switch etc. Experience and understanding in Power management components : LDO, Switching Regulator etc. Schematic Creation in OrCAD Capture RF PCB layout and routing Good knowledge of RF measurement techniques such as Harmonics,IP3, Noise Figure, Jitter, Phase noise and Lock time. Able to work hands on with Lab equipment like Oscilloscope, Spectrum analyzer, Vector network analyser and Signal Generator knowledge of Communication protocols like RS422, RS232, RS485, ethernet, SPI, I2C etc. Experience on RF tools : ADS, HFSS etc. Work on high speed ADC and DAC Experience in RADAR subsystem design Experience - 12 to 20 years

Position: Jr.Antenna Test Engineer Main job Location: Hyderabad Timings: 09:00 AM –6:30 PM (Monday - Saturday) Package: 2 LPA – 3 LPA Working Mode: 12-months Contract Key Responsibilities 1. Assist in the setup and execution of antenna tests using Vector Network Analyzers (VNAs) , spectrum analyzers, and field strength meters. 2. Perform basic measurements such as S-parameters (S11, S21) , gain, directivity, and radiation pattern verification. 3. Support anechoic chamber testing , open-range measurements, and antenna alignment procedures. 4. Collect, analyze, and document test results using MATLAB, Excel, or custom tools. 5. Participate in test planning, data logging, and report preparation for internal and customer validation. 6. Ensure calibration and proper handling of RF equipment and measurement setups. 7. Coordinate with design engineers to troubleshoot antenna performance issues . Required Skills & Qualifications 8. B.E/B.Tech in Electronics, Electrical, Communication, or RF Engineering . 9. Basic understanding of antenna theory , impedance matching, gain, polarization, and beamwidth. 10. Familiarity with RF test equipment such as VNAs, spectrum analyzers, signal generators (academic or project-based exposure acceptable). 11. Ability to work in lab environments and handle sensitive RF hardware carefully. 12. Good analytical and documentation skills. 13. Strong interest in RF testing, wireless systems, and hands-on engineering . Preferred (Not Mandatory) Internship or academic project involving antenna measurements or RF testing . Exposure to HFSS, CST, or MATLAB for antenna simulation or data visualization. Basic knowledge of EMC testing , shielding, and measurement error analysis. Minimum Service Agreement: 2 Months Training + 12 months Contract Job Type: Fresher Pay: ₹11,317.02 - ₹23,819.70 per month Benefits: Cell phone reimbursement Work Location: In person

Job Description We are looking for a highly skilled RF Engineer with hands-on experience in designing high-speed digital and RF boards, especially around FPGAs, RF front-ends. You will play a critical role in the development of mission-critical electronic systems for satellite and communication hardware, working closely with system architects, RF engineers, and embedded teams. Key Responsibilities: Design, develop, and optimize RF subsystems for satellite communication and high-frequency applications (e.g., S-band, X-band). Select and integrate RF components, such as mixers, filters, LNAs, PAs, and antennas, into satellite platforms or SDR systems. Collaborate with Embedded, PCB, and mechanical teams to ensure RF chain compatibility and thermal/EMI/EMC compliance. Perform RF simulations, impedance matching, and layout guidelines in collaboration with PCB designers. Conduct RF testing, tuning, and validation using VNA, spectrum analyzers, signal generators, and other RF test equipment. Generate test procedures, calibration documentation, and technical reports for RF system validation and qualification. Required Skills & Experience: 3+ years of hands-on experience in RF hardware design, integration, and testing. Proficiency in using RF test and measurement equipment (e.g., VNA, spectrum analyzers, power meters, signal generators). Deep understanding of RF fundamentals: impedance matching, S-parameters, noise figure, gain, and non-linear behavior. Experience with: S-band, X-band, or similar RF systems Software-Defined Radio platforms Design and simulation tools (e.g., CST, ADS, HFSS, or Keysight PathWave) Familiarity with PCB layout guidelines for RF systems: controlled impedance, isolation, and grounding best practices. Preferred Qualifications: Experience with satellite communication systems or aerospace-grade RF hardware. Hands-on development with GNU Radio Companion, flowgraph creation, and custom block development. Exposure to FPGA-based systems and digital-RF interfacing. Knowledge of EMI/EMC mitigation and RF shielding techniques. Familiarity with thermal and power integrity analysis for RF front-ends. Experience with industry standards (e.g., IPC, ECSS, MIL-STD). Soft Skills: Strong documentation and technical reporting abilities. Comfortable working in cross-functional teams (hardware, software, mechanical, systems). Detail-oriented, hands-on, and capable of iterative testing and troubleshooting. Additional Requirements: Passion for space, satellites, and ground segment technologies. Self-driven and willing to learn continuously. Willingness to relocate as per the needs of the mission or organization. Not sure if you meet every requirement? If you’re passionate about RF systems and have hands-on experience—even if you don’t meet every single qualification listed—we strongly encourage you to apply. We value talent, learning ability, and real-world experience just as much as titles or checklists

Namaskaram! AjnaLens is looking for a passionate RF Hardware Engineer to join our team at Thane (Maharashtra – India) . We are seeking someone with 5+ years of hands-on experience in RF hardware design and development . If you have built high-performance RF circuits and worked on wireless systems like Bluetooth, Wi-Fi, LTE/5G, and GNSS, we want to hear from you! This role involves working closely with cross-functional teams — including antenna, digital, and mechanical engineers — to develop robust RF solutions for our next-generation products. We’re also proud to share that Lenskart is now our strategic investor , a milestone that reflects the impact, potential, and purpose of the path we’re walking. Join us as we co-create the future of conscious technology. Read more here: The smartphone era is peaking. The next computing revolution is here. Top 3 Daily Tasks: Design and develop RF circuits including LNAs, PAs, mixers, filters, baluns, and matching networks. Conduct RF performance tuning, simulation, and validation across wireless systems (Wi-Fi, BLE, LTE/5G, GNSS). Collaborate with cross-functional teams for RF integration, layout review, and interference mitigation. Minimum Work Experience Required: 5+ years of hands-on experience in RF hardware design and development. Prior experience with wireless protocols like Bluetooth, Wi-Fi, LTE/5G, and GNSS. Experience in RF lab testing using VNAs, spectrum analyzers, and other RF instruments. Top 5 Skills You Should Possess: Strong understanding of RF fundamentals, impedance matching, and transmission line theory. Proficiency in simulation tools like ADS, HFSS, CST, or EMPro. Hands-on experience with PCB tools like Altium or Cadence Allegro, with a focus on high-frequency signal integrity. Exposure to EMC/EMI compliance and certification processes (FCC, CE, ETSI). Excellent debugging, documentation, and communication skills. What You’ll Be Expected to Do: Design, simulate, and validate RF subsystems for next-gen wearable or immersive tech products. Work with antenna and mechanical teams to co-design RF solutions and resolve interference issues. Perform root-cause analysis for RF-related field and deployment issues. Document all technical work including schematics, test plans, simulation results, and certification documentation. Nice to Have: Experience with mmWave, BLE, phased arrays, or beamforming technologies. Familiarity with MIMO systems and RF front-end module integration. Prior work on high-volume consumer electronics, IoT, or AR/VR products.

The Dhirubhai Ambani Institute of Information and Communication Technology (DA-IICT) in Gandhinagar is seeking a Postdoctoral Fellow in RF/Microwave technology to join their team. Founded in 2001 by the visionary Industrialist Shri Dhirubhai Hirachand Ambani, the institute is dedicated to fostering a knowledge-led society and intellectual competitiveness for global leadership. DA-IICT offers a variety of undergraduate, postgraduate, and doctoral programs and cultivates partnerships with industry and research institutions to drive academic growth and innovation. As a Postdoctoral Fellow at DA-IICT, your responsibilities will include conducting research, performing data analysis, teaching, and supervising laboratory work within the realm of RF/Microwave technology. You will collaborate closely with faculty and peers to contribute to the ongoing advancement of knowledge in this field. To qualify for this role, you should possess experience in Metasurface Design, strong analytical and problem-solving skills, and hold a Ph.D. in an RF-Microwave related field. Additionally, familiarity with tools such as CST, HFSS, and Python will be beneficial in fulfilling the requirements of this position.,

Namaskaram! We are seeking a highly skilled and experienced RF Hardware Engineer to join our innovative hardware team. As an RF expert, you will be responsible for the end-to-end design, development, testing, and validation of RF systems and components for our next-generation products. You will work closely with cross-functional teams including antenna, digital, and mechanical engineers to ensure high-performance, robust RF solutions. We're also proud to share that Lenskart is now our strategic investor , a milestone that reflects the impact, potential, and purpose of the path we're walking. Join us as we co-create the future of conscious technology. Read more here: The smartphone era is peaking. The next computing revolution is here. Key Responsibilities: Design and develop RF circuits including LNA, PA, mixers, filters, baluns, and matching networks Perform RF simulations using tools like ADS, HFSS, CST, and EMPro Schematic capture and review PCB layout for RF modules with attention to high-frequency signal integrity and EMC Conduct RF performance tuning, calibration, and optimization for Wi-Fi, Bluetooth, LTE/5G, GNSS, and custom wireless systems Execute lab testing, characterization, and validation using VNA, spectrum analyzers, signal generators, and network analyzers Collaborate with antenna and mechanical teams for RF integration, co-design, and mitigation of interference and defence issues Ensure compliance with regulatory standards (FCC, CE, ETSI, etc.) and support certification testing Drive root-cause analysis and resolution of RF-related issues during design, NPI, and field deployment stages Document design specifications, test plans, reports, and design reviews Qualifications: Bachelor's or Master's degree in Electrical Engineering, Electronics, or a related field 5+ years of hands-on experience in RF hardware design and development Strong knowledge of RF fundamentals, transmission line theory, impedance matching, and wireless communication systems Proficient in simulation tools (e.g., Keysight ADS, Ansys HFSS/CST) and PCB design tools (e.g., Altium, Cadence Allegro) Experienced in lab instrumentation and RF measurements Solid understanding of wireless protocols: Bluetooth, Wi-Fi, LTE, 5G, GNSS, etc Strong debugging skills and experience with EMC/EMI mitigation Excellent communication and documentation skills Experience with high-volume consumer electronics is a plus Nice to Have: Experience with WiFi, BLE, mmWave and phased array systems Familiarity with MIMO, beamforming, and RF front-end module integration Prior work in wearable, IoT, or AR/VR products