Diffusion Process Engineer

Summary

The Diffusion Process Engineer develops, optimizes, and sustains key semiconductor processes including Diffusion, Rapid Thermal Processing (RTP), Thermal Oxide Growth, Annealing, Atomic Layer Deposition (ALD), Gate Oxide formation, and Silicide processes. The engineer has hands-on experience with furnace systems, RTP tools, and annealing equipment, and demonstrates strong problem-solving skills and a collaborative mindset to drive yield improvement and process stability in a high-volume manufacturing environment.

Key Responsibilities

• Process Development & Optimization: Develop and optimize relevant processes for metals, dielectrics, or barrier layers to meet device performance and reliability targets.

• Production Support: Monitor daily line performance, analyze excursions, and implement corrective actions to ensure process stability and yield improvement.

• Equipment Ownership: Collaborate with equipment engineers and vendors to maintain tool uptime, qualify new hardware, and improve equipment capability.

• Data Analysis & DOE Execution: Conduct structured experiments (DOE), analyze process data using statistical tools (JMP, Minitab, or Python-based scripts), and present findings to cross-functional teams.

• Cross-Functional Collaboration: Work closely with integration, lithography, and metrology teams to ensure robust process integration across multiple technology nodes.

• Technology Transfer: Support technology transfer from R&D to production fabs, including process documentation, recipe release, and training for sustaining teams.

• Continuous Improvement: Lead cost reduction, throughput improvement, and defect reduction projects using structured problem-solving methodologies (FMEA, 8D, DMAIC).

Qualifications

o Education: Bachelor’s, Master’s, or Ph.D. in Materials Science, Physics, Chemical Engineering, Electrical Engineering, or related field.

o Experience: 2–8 years of hands-on experience in Diffusion process engineering within a semiconductor foundry or IDM environment.

o Hands-on experience with diffusion furnace systems for APCVD/LPCVD processes, including deposition and annealing of nitrides and oxides, as well as Rapid Thermal Processing (RTP).

o Strong familiarity with statistical process control (SPC), fault detection & classification (FDC), and process characterization techniques (ellipsometry, XRR, TEM, SEM, XPS).

o Understanding of integration challenges related to BEOL/FEOL Diffusion layers.

Preferred Skills:

o Experience in high-volume manufacturing (HVM) and yield ramp.

o Knowledge of automation systems, MES, and data analysis scripting.

o Strong analytical, documentation, and presentation skills.

o Ability to work in a cleanroom and interface across multiple teams in a fast-paced fab environment.