Customer Service Engineer

Technical Requirements:

• Experience working in Semiconductor manufacturing industry
• Hands-on experience with semiconductor equipment such as:

Wire bonders, Die Bonder, Pick and Place machine..

• Proven Ability to perform equipment installation, commissioning, calibration, qualification & validation.
• Knowledge of tool troubleshooting, root-cause analysis, predictive and preventive maintenance.
• Familiar with process parameters optimization and recipe setting.
• Exposure to Cleanroom protocols and ESD safety handling procedures.
• Ability to interpret technical drawings, schematics, electrical & mechanical layouts.
• Proficient in using standard office software tools including Google suite and MS Office
• Experience using 3D CAD will be an added advantage.

Behavioral Requirements:

• Should be an active and collaborative team player
• Requires a positive learning attitude with strong self-learning capabilities.
• Expected to stay motivated independently.
• Maintains Good cooperation with Cross functional team
• Must take ownership and actively work to achieve the target

Responsibilities:

• Perform machine and process setup of Wire Bonders, pick and place machines
• Able to perform machine troubleshooting.
• Performs mechanical alignment when necessary
• Ensure that the equipment is installed at customer's place on schedule
• Work with Cross-functional teams to resolve function, safety, quality and productivity-related issue and improvements.
• Available to travel overseas whenever needed for training or commissioning.

Qualifications:

• 1-2 years of work experience in Wire bonders or Pick and Place machines
• Graduate degree in Electronics / Electrical / Mechatronics