Posted:3 weeks ago|
Platform:
On-site
Full Time
Our Client is a leading a state-of-the-art OSAT (Outsourced Semiconductor Assembly and Test) facility. The facility specialize in advanced and legacy packaging services with a focus on display driver ICs (DDICs), wafer-level packaging (WLP), bumping for DDICs, wafer dicing/attach, and final test/assembly. The incumbent will lead all aspects of procurement, logistics, materials planning, vendor partnerships, and spare-parts strategy to enable world-class operations.
Bradford Consultants LLP
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