Job
Description
About Us: Tata Semiconductor Assembly and Test is the first commercial OSAT (Outsourced Semiconductor Assembly and Test) facility in India. Within a year and a half of operations, we have the capability to manufacture Integrated System Packaging (ISP), Wire Bond and Flip Chip Technologies. We are conducting R&D on advanced packaging. This includes developing differentiated solutions for Chiplet heterogenous integration and wafer level packaging for HPC (High Performance Computing) applications. Responsibilities: Develop an advanced packaging roadmap that delivers compelling competitive advantage to our customers. Conduct cutting-edge research and develop differentiated solutions for advanced packaging technologies across equipment, materials and process technologies for various design architectures. Develop and optimize new packaging solutions that enhance performance, power, and form factor without compromising affordability. Key aspects are improved signal integrity, fine-tuned power delivery, thermal and mechanical performance that address the industry challenges Collaborate with cross-functional teams, including product design and development, process engineering, quality and reliability, test solutions, marketing, sales and customers to translate research findings into practical applications. Develop Intellectual Property (IP), strong participation in industry forums, and selective communications through journals and conference proceedings. Conduct competitive analysis and business intelligence in the domain of advanced packaging. Drive ecosystem development in India. Qualifications: Advanced degree (PhD preferred) in Material Science, Applied Engineering Physics/Chemistry, Electrical Engineering, Chemical Engineering, Structural Mechanics, Mechanical Engineering or other related disciplines and 3-8+ years of industry experience. Foundational understanding of Semiconductors, Nanotechnology, Macromolecules, adhesion, patterning, metallization, simulations and/or optics preferred Proven experience in conducting independent research and publishing in reputable journals. Excellent problem-solving skills, generating innovative solutions and experience in structured methodology for process development. Strong communication and presentation skills. Ability to work effectively in a collaborative, multidisciplinary team environment. Experience with advanced analytical characterization techniques. Desired Experience We need strong skills in research and architecture development. Some key areas below: Electrical Properties Mechanical Properties Thermal Properties Semiconductor Analytical Characterization Polymers Patterning Show more Show less
