R&D – Image Sensor Head (Semiconductor)

About The Business

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.’

Responsibilities

1. Lead team to develop and transfer to production CMOS Image Sensor technologies on a variety of nodes from 28nm-180nm
2. Work with Business/Product team to create financial/business justification for projects
3. Manage Project phase gates
4. Build and lead a high functioning team of diverse talents
5. Optimize the technology for a variety of parameters esp. Quantum Efficiency across wavelengths from 400-800nm, Pixel Size, Cross-talk, Dark current
6. Both BSI and FSI technologies will be required
7. Global and Rolling shutter capability will also be necessary
8. Design and Layout of test
   chips to aid in device/technology optimization, rel assessment and SPICE model extraction
9. Will assist in SPICE model and design kit creation
10. Core CMOS transistor performance will be maintained to enable 3T/4T pixels and array designs
11. Work with designers to spec arrays that are competitive
12. Interface closely with customers at all phases of the technology development cycle
13. Present to customers, peers and executives
14. Travel will be required

Essential Attributes

• Ability to manage semiconductor technology projects
• Able to work independently, self-motivated with a strong drive to win.
• Ability to work across diverse cross-functional teams spread across the world.
• Good communicator with inclusive style
• An avid learner, you approach challenges with curiosity and resilience, seeking data to help build understanding.
• You’re a collaborative team player, building relationships, humbly offering support and openly welcoming approaches.
• Innovative and creative, you proactively explore new ideas and adapt quickly to change.

Qualifications

1. M.S or PhD in Electrical Engineering, Materials Science or equivalent
2. Strong understanding of CMOS and eNVM

   device physics

   ,

   process modules

   , yield improvement, failure mechanisms, analytical techniques (physical and electrical)
3. Proven leadership qualities in creating, managing and motivating a strong technical team and assisting in their development and career growth
4. Deep understanding of CMOS Image Sensor technologies and process modules
5. Understanding of CIS technology parameters and figures of merit
6. Proven track record in delivering these technologies into volume manufacturing
7. Familiarity with color filter coatings
8. Ability to work in cross-functional teams and achieve project completion within timeline and cost targets
9. Ability to work across different cultures and geographies
10. Good team player
11. Innovation and competitive mindset

Desired Experience Level

1. 15+ years experience in the semiconductor industry, specifically in the image sensor field
2. Proven track record of successfully developing new technologies into high volume production
3. Proven problem solving skills using design of experiments and analytical tools