Mechanical Thermal Analysis Engineer

Job Title: Thermal Analysis Engineer

Location: Remote (India Based)

Duration: 6 Months Contract

Position Overview

The Thermal Analysis Engineer will collaborate closely with the mechanical and electrical design teams to optimize component placement and SSD drive enclosures for enhanced thermal performance in mass production. The role involves conducting CFD-based thermal simulations, correlating analytical models with experimental measurements, and delivering validated thermal solutions and models for customer use.

Key Responsibilities

• Perform thermal analysis and simulations using CFD tools such as FloTherm and ANSYS-Fluent to assess and improve design performance.
• Work with design teams to provide thermal insights and design recommendations for component placement and enclosure optimization.
• Develop and execute experimental test plans for thermal validation and correlation of models with measurement data.
• Automate thermal analysis tasks using FloTherm scripting and MATLAB.
• Prepare and present technical reports, summaries, and presentations outlining analysis results and proposed solutions.
• Manage multiple design projects, ensuring high-quality deliverables within defined timelines.
• Support the release of thermal customer models and documentation.

Required Qualifications

• Bachelor’s or Master’s degree in Mechanical Engineering or Aerospace Engineering.
• 2–3 years of hands-on experience in:
• Heat transfer and thermal analysis of electronic components or systems.
• CFD simulation tools (ANSYS-Fluent, FloTherm) for design evaluation and optimization.
• Experience in experimental thermal measurement and model validation.
• Proficiency in MATLAB or other scripting/coding tools for automation.
• Strong communication skills—both written (technical reporting) and verbal (presentations, discussions).
• Highly self-motivated, organized, and able to work independently or collaboratively in a team setting.

Preferred Skills (Nice to Have)

• Experience with SSD or electronic packaging design.
• Exposure to thermal management of high-performance electronics.
• Familiarity with statistical analysis tools or data visualization platforms.