Location: Bangalore Education: B.E./B.Tech. in Mechanical, M.E/ M.Tech. Mechanical Experience: 10+ Years Professional Skills: Minimum 10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Avionics/Telecom industry. Experience in milled, sheet metal and plastic enclosure designs. Knowledge in 19-inch rack, ATR, VPX, JSS55555, DO-160, VME and ATCA standards. 10-years’ experience in Solid works / any design and drafting tools Knowledge of Structural and Thermal analysis. Ability to manage 2-member team As a Mechanical Engineer- Electronics Packaging specialist, you will be responsible for developing portions of the lithography system and/or associated tooling related to the electronics infrastructure. The position requires highly motivated, extremely organized and self-driven individuals. As a Mechanical Engineer- Electronics Packaging Specialist will: Perform mechanical design and development associated with packaging electronic circuits including, assembly design, analysis, test, and manufacturing introduction support for both new and existing electronics design projects. Understand and mitigate possible failure mechanisms associated with materials, interconnects, and environmental loads to develop a reliable design. Communicate with a team of multi-disciplined engineers (Systems , Electrical, Mechanical, Manufacturing, New Product Logistics, and Product Information Management) for design and logistic release approval. Investigate and edit product structures, generate CAD models, 2D/3D drawings and be responsible for the final technical data package. Create, edit, review, and drive Engineering Changes to closure. Self-Checking and Peer-Checking department designs and change notifications Roles and Responsibility: Ability to take up mechanical design independently. Interact with customers and project team, capture input and design accordingly. Design the components to meet DFM and DFA and customer requirement. Should be a team player. Ability to manage 2-member team. Mandatory Skill Set: Minimum10 years’ experience in designing Air cooled and conduction cooled electromechanical Enclosures and Chassis for defense/Telecom industry. Proficiency in Solid works and AutoCAD. Good knowledge about BOM creation, material selection, Fastener selection, CNC machining and surface finish process. Vendor development activities. Desired Skill Set: Knowledge in Structural and Thermal analysis.