Package and PCB Design Engineer

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Hi Connections,

We are hiring...

Job Title: Package & PCB Design Engineer

Location: Hyderabad / Bangalore / Hybrid

Department: Semiconductor Packaging & PCB Design

Employment Type: Full-Time

Job Summary

We are seeking an experienced Package & PCB Design Engineer to design advanced semiconductor packages and printed circuit boards for high-performance SoCs, ASICs, and AI accelerator products. The role involves working on package substrate design, PCB layout, high-speed signal routing, and collaborating closely with chip design, mechanical, and manufacturing teams to ensure electrical, thermal, and mechanical reliability.

Key Responsibilities

● Design chip packages (FCBGA, flip-chip, WLCSP, SiP, 2.5D/3D IC) meeting electrical, thermal, and mechanical requirements.

● Develop PCB layouts for evaluation boards, reference designs, and production systems.

● Perform high-speed signal integrity (SI) and power integrity (PI) simulations.

● Define and implement routing strategies for high-speed interfaces (PCIe, DDR, USB, MIPI, Ethernet).

● Collaborate with IC design teams to define package pinouts and ball maps.

● Work with mechanical engineers to ensure thermal dissipation and mechanical stability.

● Create Gerber files, fabrication drawings, and documentation for manufacturing.

● Interface with PCB/OSAT vendors for fabrication and assembly.

● Support prototype bring-up and debug of package/board-related issues.

● Ensure compliance with industry standards (IPC, JEDEC) and EMI/EMC regulations.

Required Skills & Qualifications

● Bachelor’s/Master’s degree in Electrical/Electronics/Mechanical Engineering.

● 3+ years of experience in semiconductor package and PCB design.

● Proficiency in package and PCB CAD tools: Cadence Allegro/OrCAD, Mentor Xpedition, Altium Designer, or similar.

● Strong understanding of signal integrity, power integrity, and thermal management.

● Knowledge of manufacturing processes for packages and PCBs.

● Experience with design for manufacturability (DFM) and design for test (DFT) in packaging.

● Familiarity with material selection for thermal/electrical performance.

Preferred Qualifications

● Experience with advanced packaging technologies (2.5D interposers, 3D stacking, chiplets).

● Knowledge of HDI PCB design for high-density interconnects.

● Familiarity with EDA co-design flows (chip-package-PCB integration).

● Experience in healthcare or AI hardware products with specific regulatory constraints.

● Hands-on experience with EM simulation tools (Ansys HFSS, Keysight ADS).

What We Offer

● Opportunity to work on cutting-edge chip packaging and PCB design for next-gen products.

● Collaboration with global semiconductor and AI hardware experts.

● Access to advanced tools and manufacturing partners.

● Competitive compensation, bonuses, and career development opportunities.

Interested guys, kindly share your updated profile to pavani@sandvcapitals.com or reach us on 7995292089.

Thank you.

Job Type: Full-time

Pay: ₹1,000,000.00 - ₹1,500,000.00 per year

Experience:

• PCB: 3 years (Required)

Work Location: In person