eFlash FEOL Process Integration Lead

Tata Electronics Private Limited (TEPL) is a greenfield venture of the Tata Group with expertise in manufacturing precision components.

Tata Electronics (a wholly owned subsidiary of Tata Sons Pvt. Ltd.) is building India’s first AI-enabled state-of-the-art Semiconductor Foundry. This facility will produce chips for applications such as power management IC, display drivers, microcontrollers (MCU) and high-performance computing logic, addressing the growing demand in markets such as automotive, computing and data storage, wireless communications and artificial intelligence.

Tata Electronics is a subsidiary of the Tata group. The Tata Group operates in more than 100 countries across six continents, with the mission 'To improve the quality of life of the communities we serve globally, through long term stakeholder value creation based on leadership with Trust.

Job Summary:

Tata Semiconductor Manufacturing Pvt. Ltd. (TSMPL) is seeking an experienced embedded Flash (eFlash - NOR) FEOL Process Integration Lead to drive the development and optimization of embedded Flash technology across CMOS nodes from 130nm to 28nm, including BCD platforms. The role requires deep expertise in integrating eFlash into CMOS flows, including flash stack formation, etching, and performance characterization. Experience in modules such as RX, PC, SD, HK-MG, MOL, and BEOL is highly valued. Key responsibilities include setting up CMOS and eFlash flows, defining BKMs and inline measurement strategies, and ensuring robust integration. Strong knowledge of flash device architecture and FEOL integration is essential.

Qualifications:

• 5-15 years’ experience in the semiconductor industry with embedded Flash
• B.Tech, MS, or PhD in Physics, Electrical Engineering, or related field with strong CMOS device and process integration knowledge
• Experience in process/device integration, product, or process engineering
• In-depth understanding of semiconductor processing, device physics, and eFlash cell design and integration
• Familiarity with automotive-grade memory qualification (AEC-Q100)
• Knowledge of key process modules, yield enhancement, DFM, and process variation management

Responsibilities:

• Lead the development and qualification of eFlash for planar CMOS (130nm to 28nm including BCD)
• Lead the tool and unit process/module owners to optimize the processes for the eFlash cell and integration.
• Understand design rules, generation rules as well as tapeout process flow
• Understand the product design and layout to decide on product specific weak points and how they may affect eFlash
• Design and run all aspects of experiments to test hypotheses. Perform data analysis (DOE, Process window) and problem solving for ET, yield or process issues
• Understand and verify the process control window using characterization, yield and cycling results
• Guide the setup and collect inline and physical measurements on the prototype lots with the integrated eFlash. Prototyping activities (minesweeper, proto lots, skew splits etc) from tapeout to lot execution
• Ensure the initial success of mass production with specialized DoEs and other safe launch procedures
• Run customer sample silicon and determine the appropriate measurements to ensure the success of qualification and timely transition to mass production
• Integrate new processes, design test structures, create new process flow (STF, ECN, etc), define new ET & inline specs, during technology development
• Prolific in filing innovations & solutions as potential disclosures

Essential Attributes:

• Ability to work with cross functional teams
• Able to work independently, self-motivated with a strong drive to win.
• Team player with the ability to work across diverse cross-functional teams spread across the world.
• You’re inclusive, adapting your style to the situation and diverse global