Pad Ring Layout Engineer

6 - 11 years

11 - 15 Lacs

Posted:-1 days ago| Platform: Naukri logo

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Job Type

Full Time

Job Description

  • Extensive PAD Ring and Top/Chip level layout experience.
  • Good understanding of package/substrate design and package assembly rules related to flip chip designs, BGA, LFCSP etc.
  • Experience in IO Pads, ESD clamps and Analog Mixed Signal IP layout
  • Layout experience in the following technology nodes is a plus: 180, 40nm and 22nm GF

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Sourceright Technologies

Technology / Human Resources

Silicon Valley

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