As a Pad Ring Layout specialist, you will be responsible for the following: - Possessing extensive experience in PAD Ring and Top/Chip level layout. - Demonstrating a good understanding of package/substrate design and package assembly rules, particularly related to flip chip designs, BGA, LFCSP, etc. - Having hands-on experience in IO Pads, ESD clamps, and Analog Mixed Signal IP layout. - Experience in layout design across various technology nodes such as 180nm, 40nm, and 22nm GF is considered a definite advantage. No additional details about the company were mentioned in the job description.,

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Pad Ring Layout Engineer