Chip Design Engineer Dynpro India Pvt. ltd

5.0 - 12.0 years

0 Lacs

karnataka

On-site

You are looking for an IC Package Design Engineer with experience in Flip Chip package design. As an IC Package Design Engineer, your responsibilities will include: - Having experience with Cadence APD IC Package Design, specifically with Flip Chip package design. - Demonstrating a good understanding of package/substrate design and package assembly rules related to flip chip designs. - Being exposed to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D, etc., which would be an added advantage. - Showcasing expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Having hands-on expertise with PCB designs involving High-Sp...

Posted 2 days ago

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Title DynPro Chip Design Careers Dynpro India Pvt. ltd

5.0 - 12.0 years

0 Lacs

karnataka

On-site

You are hiring for the position of IC Package Design Engineer with experience in Flip Chip package design. As an ideal candidate, you should have 5 to 12 years of experience in Cadence APD IC Package Design. Your responsibilities will include: - Good understanding of package/substrate design and package assembly rules related to flip chip designs. - Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., will be an added advantage. - Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies. - Hands-on expertise with PCB designs involving High-Speed Parallel Bus interfaces including DDR, GDDR, and HSIO interfaces...

Posted 4 days ago

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