3 Bga Jobs

Position: Senior Soldering Technician - Micro Soldering Expert Company: Vanix Technologies Pvt. Ltd. Location: Hyderabad, Gachibowli Experience Required: 4-5 Years Joining Timeline: Immediate or within 15 days Employment Type: Full-Time Company Profile - Vanix Technologies Vanix Technologies is a deep-tech electronics startup building AI edge controllers, IoT solutions, and EVSE hardware for industrial and mission-critical applications. With a strong focus on FPGA/SoC-based hardware, battery telematics, smart EV chargers, and AI surveillance systems, Vanix is solving next-generation automation challenges through innovation in hardware design, firmware, and embedded systems. We operate from Hyderabad and IIT Ropar (Punjab), working closely with partners in EV, energy, education, and industrial automation sectors. Job Summary We are looking for a highly skilled Senior Soldering Technician who is proficient in micro soldering, including handling 0402, QFN, BGA, FPGAs, and complex microprocessor boards. The role demands expertise in industrial and mil-grade electronics rework, rework tools, and a strong understanding of IPC standards. The ideal candidate must also possess clear English communication skills, be detail-oriented, and ready to join immediately or within 15 days. Key Responsibilities 1. Perform precision soldering and de-soldering on fine-pitch components including 0402, QFN, BGA, and more 2. Carry out rework and repair of high-complexity PCBs involving FPGAs, microprocessors, and SoCs 3. Operate rework equipment such as hot air stations, BGA rework systems, and microscopes 4. Follow and enforce IPC-A-610 and other IPC standards for quality soldering practices 5. Perform visual inspections and microscope-based QC of all reworked or assembled PCBs 6. Maintain proper documentation of rework processes, inspection reports, and component handling Collaborate with the hardware engineering team during prototyping and production Provide guidance or training to junior technicians as needed Required Skills & Qualifications 1. 4-5 years of hands-on experience in micro soldering 2. Proven ability to solder/de-solder 0402, QFN, BGA, FPGAs, and microprocessor packages 3. Deep understanding of rework tools, including soldering stations, hot air rework, BGA rework systems, and magnification tools 4. Familiarity with IPC workmanship standards (e.g., IPC-A-610, IPC-7711/21) 5. Capable of reading schematics, assembly drawings, and component datasheets 6. Fluent in English communication (verbal and written) for coordination and documentation 7. Ability to perform detailed work under a microscope for extended durations 8. Comfortable working independently in prototyping and fast-paced R&D environments Preferred Qualifications 1. IPC certification (e.g., IPC-A-610 Specialist, IPC-7711/21 Rework & Repair) 2. Experience with defense, aerospace, or rugged industrial hardware 3. Background in startups or fast-paced electronics product companies How to Apply Email your resume and relevant work portfolio to info@vanix.in with the subject line: "Application - Senior Soldering Technician - Hyderabad"

Company : Communications Test Design India Pvt Ltd (CTDI) Location : Plot No. 15, Sector-6 | IMT Manesar, Gurugram, Haryana | IN 122051 Position Type : Full-time About CTDI : Communications Test Design India Pvt Ltd (CTDI) is a leading global provider of advanced technology solutions and support services, specializing in the telecommunications industry. We provide high-quality testing, repair, and engineering solutions for telecom equipment, serving leading brands worldwide. We are committed to fostering a dynamic work environment, ensuring both professional growth and technical expertise. Job Summary : CTDI is looking for an experienced professionals for the role of L2, L3 & L4 Repair Technician/Engineer, which aligns with a senior technician profile. Key Responsibilities: Diagnose and repair wireless cards (3G/4G/5G), ensuring optimal functionality. Read and interpret schematics and Printed Board Assembly (PBA) diagrams for effective troubleshooting. Perform Ball Grid Array (BGA) rework, including soldering and de-soldering of components. Utilize tools such as digital voltmeters, oscilloscopes, frequency counters, and power supplies for testing and diagnostics. Prepare schematics and testing procedures for PCBAs and modules, especially when technical information is unavailable. Operate PCs and use Microsoft Office applications for documentation and reporting. Read and write in English to ensure clear documentation and effective communication. Qualifications: Education : Diploma in Electronics Engineering. Experience : 2- 4 years in telecom equipment repair. Skills : Knowledge of electronics, diagnostic tools, and communication systems.

We are looking for a PCB (Printed Circuit Board) Design Engineer for designing and developing layouts for circuit boards used in electronic devices. They need to work closely with hardware engineers to translate electrical schematics into manufacturable PCB designs using CAD tools like Altium Designer, Eagle, or OrCAD. The role involves component placement, routing, signal integrity analysis, and ensuring design for manufacturability (DFM). Attention to detail, knowledge of industry standards, and the ability to troubleshoot and optimize designs are key to success in this role. Key Responsibilities: Schematic entry Component footprint/library creation Designing of High Speed PCBs to meet maximum performance Releasing of Gerber, BOM and documentation files Help resolve technical queries from PCB fabricators and contract manufacturers. Key Skills & Competencies: Knowledge of industry standards Knowledge of IPC-2221/2222/7351 Familiarity with different PCB CAD tools like PADS PCB, Allegro, Altium. Expedition, Board Station, CADStar, Protel (Optional Value added) Strong background with through hole, SMT, and BGA technologies using dual-sided assemblies, and multilayer boards Good understanding of PCB stack up requirements to finalize the same based on design complexity and design requirements Knowledge in Power supply layout [Switch mode, high power etc. Well versed in blind, buried laser micro via and technologies Experience in high speed bus routing, differential pairs and impedance control routing to meet signal integrity Should be able to work independently and deliver the work assignments. Good expertise in DFM, DFA and DFT Knowledge of various PCB design guidelines Good understanding of PCB manufacturing process and requirements Personal Attributes: High attention to detail and quality orientation. Strong organizational and time-management skills. Good communication skills to report issues and collaborate effectively.