CAD Packaging - MECH Semiconductor Domain

Walkin Drive for CAD Packaging - MECH Semiconductor Domain on 12th July 2025 in Bangalore ITPL

Venue Date:12th July 2025 Saturday

Venue Timing: 9.30 AM -2 PM

Venue Location:

HCLTech ,

Contact Person : Hemalatha/Kalaivani (kalaivani.t@hcltech.com/ hemalatha_a@hcltech.com)

Key Responsibilities:

• Education: Bachelor’s degree in engineering (preferably Mechanical, Manufacturing, or Industrial).

• Experience: Minimum of 5 years in packaging engineering, sourcing, and supplier management

Primary Responsibilities:

• Drawing Standards:

• Utilize client drawing standards, such as ASME Y14.5, for geometric dimensioning and tolerancing (GD&T) to ensure clear and consistent engineering drawings

• Packaging Experience:

• Leverage past experience in packaging design and implementation to develop innovative packaging solutions

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• Foam Thickness Calculation:

• Perform foam thickness calculations to ensure adequate protection of products during transport.

• Packaging Standards:

• Adhere to packaging standards, including ASTM and ISO, to ensure product safety and compliance

• Commodity Code for Packaging:

• Utilize appropriate commodity codes for packaging materials to ensure compliance with customs and trade regulations

• Material Selection:

• Select different materials for various packaging objectives, such as corrugated cardboard for shipping boxes, plastic for lightweight packaging, and metal for durability

• Pallet Material:

• Choose suitable pallet materials, including wood, plastic, metal, and cardboard, based on the specific requirements of the shipment

• Types of Corrugated Sheets:

• Use different types of corrugated sheets, such as single wall, double wall, and triple wall, based on the strength and protection needed

• Regional Pallet Sizes:

• Understand and apply knowledge of how pallet sizes vary by region to ensure compatibility with international shipping standards