Principal Architect Isolated Gate Driver IC

Larsen & Toubro (L&T)

10 - 15 years

35 - 40 Lacs

bengaluru

Posted:-1 days ago| Platform:

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Skills Required

emi simulation diagnostics circuit designing thermal packaging emc matlab spi automotive

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Work from Office

Job Type

Full Time

Job Description

Principal Architect Isolated Gate Driver IC
Areas of Responsibilities
Lead architecture and design definition for isolated gate driver ICs used with SiC and GaN power switches, optimized for high switching speed, high CMTI, and robustness.
Architect complete driver solutions including:
High/low side output stages (with Miller clamp, active pull-up/down, configurable source/sink)
Isolation interface (capacitive, magnetic, or optical)
Integrated protections (UVLO, DESAT, SCP, soft turn-off, active clamp)
Diagnostic and telemetry features (SPI/I C interface, status flags)
Define system-level integration strategy for energy platforms, ensuring reliable performance across wide operating voltages, temperatures, and transient conditions.
Ensure design meets isolation standards (UL1577, VDE0884, IEC 60747-17) and supports high CMTI (>100 kV/ s) performance.
Collaborate with SiC/GaN FET designers, power module architects, and system teams to define drive strength, layout constraints, and thermal performance targets.
Guide the team on HV layout practices, creepage/clearance, EMI reduction, and packaging co-design.
Drive IP reuse, design scalability, and enable the gate driver IP to be leveraged across energy, automotive, and industrial portfolios.
Lead architecture reviews, mentoring, and documentation of system specifications and design decisions.
Contribute to long-term roadmap and technology strategy for wide-bandgap driver solutions across all business units

Technical Skills:

Expert in gate driver circuit design for wide-bandgap devices (SiC MOSFETs, GaN HEMTs).
Strong understanding of:
Level shifters, push-pull buffers, active clamps, and short-circuit protection
Isolation technologies and barrier design (capacitive/magnetic/optical)
High-side/low-side driver pairing and bootstrap techniques
Experience with protection and diagnostics: UVLO, DESAT, OCP, OTP, and integrated fault reporting.
Knowledge of high-voltage (>600 V) and high-frequency (>100 kHz 1 MHz) design constraints.
Tools: Cadence Virtuoso, Spectre, MATLAB, and simulation tools (e.g., PLECS, ADS, LTspice).
System-level co-design experience with SiC/GaN switches, power modules, and packaged solutions.

Strong foundation in EMI/EMC, thermal behavior, and safe operating area (SOA) management

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