Director - Physical Design

15 - 19 years

0 Lacs

Posted:1 day ago| Platform: Shine logo

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Work Mode

On-site

Job Type

Full Time

Job Description

As a Director of Physical Design at Tecquire Solutions Private Limited, you will play a crucial role in leading and growing the physical design team to implement complex SoC and ASIC designs effectively. Your responsibilities will include: - Leading and managing the entire Physical Design team across multiple projects and geographies. - Driving end-to-end physical implementation including RTL handoff, floorplanning, place & route, clock tree synthesis, static timing analysis, physical verification (DRC/LVS), and tape-out. - Owning project planning, resource allocation, schedule management, and risk mitigation across multiple physical design programs. - Collaborating with cross-functional teams such as RTL, DFT, Verification, Packaging, and Process Technology to ensure successful chip integration and delivery. - Defining and enforcing design methodologies, flows, and best practices to enhance quality, efficiency, and tape-out success. - Interfacing with EDA vendors to assess tools and enhance tool flow and performance. - Ensuring design goals are achieved for power, performance, area (PPA), and yield. - Hiring, mentoring, and developing a high-performing team of engineers and managers. - Contributing to technology planning and roadmap discussions aligned with product strategy. Qualifications Required: - Bachelors or Masters degree in Electrical Engineering, Computer Engineering, or related field (PhD preferred). - 15+ years of experience in VLSI/ASIC/SoC physical design, with at least 5-6 years in a leadership or director-level role. - Proven experience in leading full-chip physical design to successful tape-out at advanced process nodes (e.g., 7nm, 5nm, 3nm). Technical Skills: - Deep understanding of physical design flow and EDA tools (Cadence, Synopsys, Mentor, etc.). - Strong expertise in STA, low-power design, DFT integration, IR drop analysis, EM, and signal integrity. - Experience with hierarchical physical design methodologies and large SoC integration. - Knowledge of advanced packaging (e.g., chiplets, 2.5D/3D IC) is a plus. Leadership & Communication Skills: - Proven ability to lead large teams and manage complex multi-disciplinary projects. - Strong interpersonal and communication skills; able to influence across teams and executive stakeholders. - Track record of mentoring and developing high-performing teams. Preferred Qualifications: - Experience in working with foundries like TSMC, Samsung, Intel Foundry. - Familiarity with ISO 26262, functional safety, or security standards (for automotive or safety-critical applications). - Exposure to ML/AI acceleration, networking, or mobile SoC designs is an advantage. By joining Tecquire Solutions Private Limited, you will have the opportunity to shape next-generation semiconductor products in a collaborative and innovation-driven culture. Additionally, you can look forward to competitive compensation and stock options while working with cutting-edge technology alongside world-class engineering teams.,

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