AI Engineer

9 years

20 - 35 Lacs

Posted:2 months ago| Platform: Linkedin logo

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Work Mode

On-site

Job Type

Full Time

Job Description

  • This position involves developing advanced image processing algorithms for wafer inspection.
  • Deep understanding and application knowledge of machine learning and computer vision; familiarity with major deep-learning architectures such as CNN, GAN, Transformer.
  • Strong hands-on coding ability in either Python or C++; experience with Linux is preferred.
  • Familiarity with major DL frameworks such as TensorFlow or PyTorch.
  • Strong teamwork with excellent written and verbal communication skills.
  • Experience in unsupervised machine learning, handling large data, and anomaly detection is a bonus.
  • Experience deploying ML/DL algorithm solutions end-to-end is preferred.

Minimum Qualifications

  • New graduates in Ph.D., Dual Degree, Masters, or Bachelors programs are eligible (preferred fields: EE, CS, Mathematics).
  • Working knowledge of machine vision.
  • Knowledge of deep learning with experience in TensorFlow, Theano, PyTorch, etc.
  • Experience in one or more of the following DL techniques: GANs, Auto Encoders, Semantic Segmentation.
  • Ability to formulate problems into mathematical equations.

Must-Haves

  • Total experience not more than 9 years.
  • B.Tech/M.Sc.: Minimum 4+ years OR M.Tech/MS: Minimum 3+ years OR PhD: 0 years (degree from Tier 1 college).
  • Degree only from Tier 1 Colleges (IIT/IIIT/IISC/NIT/VIT) or Tier 1 State Colleges (PSG/CEG).
  • Candidates must be from product-based companies.
  • Minimum 4 years’ experience in:
    • Artificial Intelligence
    • Machine Learning
    • Deep Learning
  • Minimum 2 years’ experience in Computer Vision/Image Processing.
  • Candidate must show stability (at least 2 years in an organization).
  • Relocation to Chennai is mandatory.

Nice to Haves

  • B.Tech/M.Tech in CSE/IT/ECE/DS is preferred.
  • Candidates from semiconductor companies (any college) can be considered.

Additional Guidelines

  • 3 technical and 2 non-technical interview rounds.
  • Hybrid work mode.
Skills: learning,machine learning,computer vision,deep learning,image processing

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