Semiconductor Packaging – Mechanical Modeler

3 - 8 years

5 - 9 Lacs

Posted:2 days ago| Platform: Naukri logo

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Job Type

Full Time

Job Description

Your role and responsibilities

Overview:

Join IBM€™s elite product development team driving innovation across IBM Z, POWER Systems, Storage and Quantum. We are seeking a skilled mechanical modeler with a strong background in simulation, design, and hardware validation to support high-performance and high-reliability server solutions.

Role Summary:

As a Mechanical Modeler, you will design and optimize module and server hardware systems to meet stringent thermal and mechanical requirements. You€™ll collaborate across disciplines to ensure designs meet performance, reliability, safety, and manufacturability standards. This role involves simulation, lab testing, and providing actionable insights to guide engineering decisions.

Key Responsibilities:

  • Develop and simulate system-level hardware models using CAD and FEA tools.
  • Acquire or collaborate to obtain accurate material properties for modeling.
  • Analyze qualification test data and validate against simulation results.
  • Prepare detailed technical reports and presentations for stakeholders.
  • Provide design guidelines for components such as laminates, TIMs, coolers, chips, GPUs, HBMs, and load actuation hardware.
  • Influence design decisions to ensure robust packaging and system integration.
  • First-level packaging (chip, laminate, module) and module-to-socket integration.




Required education


Master's Degree




Preferred education


Doctorate Degree




Required technical and professional expertise


  • Master€™s/PhD in Mechanical Engineering.
  • 3+ years of experience in Finite-Element Modeling (FEM).
  • Proficiency in CAD (SolidWorks preferred) and FEM tools (ANSYS or Abaqus).
  • Ability to create scripts (APDL, Python) beyond GUI modifications.
  • Experience in design for manufacturability (DFM).
  • Hands-on lab experience.
  • Strong communication, problem-solving, and time management skills.
  • Ability to work independently and in cross-functional teams.
  • Familiarity with electronic packaging and heterogeneous integration.





Preferred technical and professional experience


  • 5+ years in mechanical modeling.
  • Experience in static structural FEA (stress, strain, warpage prediction).
  • Moisture diffusion and swelling simulation expertise.
  • Knowledge of server/computer architecture.
  • Experience with lab tools: tensile testers (Instron/MTS), DMA, TMA, TGA.
  • Applied statistics and DOE knowledge (Minitab, JMP).
  • Programming experience in Matlab, Python, LabView, or C++.


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