79 Innovus Jobs - Page 2

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: NUVIA is now part of Qualcomm. Our mission is to reimagine silicon and create computing platforms that will transform the industry. You will have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. Minimum Qualifications: "¢ Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. As CPU Physical Design CAD engineer, you will build and support the world"™s best implementation tools and flows. Your tools and flows will ensure our custom CPUs have industry-leading power, performance and area. Roles and Responsibilities Develop, integrate and release new features in our high-performance place-and-route CAD flow Architect and recommend methodology improvements to ensure our silicon has the best power, performance and area Maintain, support and debug implementation flows, and resolve project-specific issues Work closely with worldwide CPU physical design teams, and provide methodology guidance, tools/flows support and help achieve class-leading PPA. Work with EDA vendors to define roadmap and to resolve tool issues Preferred Qualifications: Bachelors/Masters degree in Electrical/Electronics Engineering or Computer Science Ten+ years of hands-on experience in place-and-route of high-performance chips - either in a design or CAD role High level of proficiency in Tcl as well as Python Experience with automation Experience with a wide variety of Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV Experience with advanced technology nodes (5nm or lower) Solid understanding of digital design, timing analysis and physical verification Strong user of industry-standard place-and-route tools such as Cadence Innovus Proven track record of managing and regressing place-and-route flows

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: NUVIA is now part of Qualcomm. Our mission is to reimagine silicon and create computing platforms that will transform the industry. You will have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. Minimum Qualifications: "¢ Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. As CPU Physical Design CAD engineer, you will build and support the world"™s best implementation tools and flows. Your tools and flows will ensure our custom CPUs have industry-leading power, performance and area. Roles and Responsibilities Develop, integrate and release new features in our high-performance place-and-route CAD flow Architect and recommend methodology improvements to ensure our silicon has the best power, performance and area Maintain, support and debug implementation flows, and resolve project-specific issues Work closely with worldwide CPU physical design teams, and provide methodology guidance, tools/flows support and help achieve class-leading PPA. Work with EDA vendors to define roadmap and to resolve tool issues Preferred Qualifications: Bachelors/Masters degree in Electrical/Electronics Engineering or Computer Science Ten+ years of hands-on experience in place-and-route of high-performance chips - either in a design or CAD role High level of proficiency in Tcl as well as Python Experience with automation Experience with a wide variety of Physical Design tasks - ranging all the way from place-and-route, analysis, timing sign-off and PDV Experience with advanced technology nodes (5nm or lower) Solid understanding of digital design, timing analysis and physical verification Strong user of industry-standard place-and-route tools such as Cadence Innovus Proven track record of managing and regressing place-and-route flows

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: "¢ Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. IPPDPhysical design engineer Physical Implementation activities for high performance Cores for 16/14/7/5nm or lower technologies, which includes all or some of the below. Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), Low Power verification, PDN, Timing Closure and / or power optimization Exposure to PD implementation of PPA critical cores. Exposure to timing convergence of high frequency data-path intensive Cores and advanced STA concepts. Able to handle Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes. Understanding of clocking architecture. Tcl/Python/Perl Scripting aware for small automation Strong problem-solving skills , good communication skills and good team player Collaborate with design, DFT and PNR teams and support issue resolutions wrt constraints validation, verification, STA, Physical design, etc.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: "¢ Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. General Summary PNR implementation for Qualcomm SoC's Good hands-on experience on Floorplanning, PNR and STA flows Good knowledge on Placement/Clock Tree Synthesis (CTS), optimization, etc Good understanding on signoff domains"“ LEC/CLP/PDN knowledge, etc Good knowledge on Unix/Linux "“ Perl/TCL fundamentals/scripting Principal Duties and responsibilities Complete ownership on PNR implementation (Floorplanning, Placement, CTS, post_route,etc) on latest nodes. Signoff knowledge is mandatory (STA,Power analysis,FV, low power verification, PV,etc) Quick learner with good analytical and problem solving skills Qualifications "¢ 5+ years Hardware Engineering experience or related work experience. "¢ 5+ years experience with PNR flow in latest tech nodes (e.g., 4nm/5nm/7nm/10nm

Principal Physical Design Engineer Greater Bangalore -Hybrid/Hyderabad (Hybrid ) PrincipalPhysical Design Engineer Company Background We are a well-funded, stealth-mode startup based in Mountain View, CA, founded by senior technical and business executives hailing from category leaders in infrastructure semiconductors and hyperscale cloud services, and backed by top-tier investors with an immensely successful formula & track record on early-stage investments. We are a diverse team of expert chip/software/systems architects and developers who excel in hardware/software solution co-design. Our team has built, and delivered into production, technologies that process over half of the world's global data center traffic. Summary Join an ambitious and highly experienced team of silicon and hyperscale data center systems experts as a Physical Design Engineer. Our team is motivated by a singular mission: to revolutionize the performance and scalability of next-generation distributed computing infrastructure. You have the opportunity to build a groundbreaking new category of product, working alongside some of the industry's most talented hardware and software engineers to create truly disruptive infrastructure solutions that delight our customers. We are looking for talented, motivated engineers with experience in physically implementing large-scale networking and computing semiconductor products, and who are looking to grow in a fast paced, dynamic startup environment. We are looking for experienced physical design engineers who have the range to contribute across the full lifecycle of complex chip development, from CAD tool flow setup, early floorplan exploration in conjunction with microarchitecture development, through block partitioning, power planning, clock network design and construction, through P+R, timing closure, package design, PI/SI analysis, physical verification, and tapeout. Roles and Responsibilities Build and support the CAD tool flow for physical implementation in a cloud-first development environment. Work with architects and microarchitects on the chip-level floorplan and block partitioning. Evaluate tradeoffs in functional partitioning, block size, and interface complexity with other stakeholders. Define and construct the major physical structures, including the clock and reset architecture, the power delivery network, and interconnect topologies. Execute on block-level, cluster-level, and top-level physical implementation, from synthesis, floorplan and power plan, through P+R, through timing closure, physical verification, and tapeout. Interface with foundry and library partners on 3rd party IP and process technology issues, including updates to device models, IP integration requirements, and pre-tapeout signoff. Skills/Qualifications : Proven industry experience and successful track record in the physical implementation of large, high-performance network switching/routing fabrics (Ethernet, Infiniband, HPC), Network Interface Controllers, Smart-NICs, CPUs, or GPUs in the latest silicon process nodes. Deep experience with the latest CAD tools through the entire physical design workflow, e.g., Cadence Genus and Innovus, Synopsys ICC2/FusionCompiler, Tempus, PrimeTime SI, PrimeTime PX, StarRC, ICV, Calibre. Strong familiarity with various analysis tools such as Redhawk, Voltus. Experience with circuit analysis using HSPICE is a plus. Expert knowledge of SystemVerilog, as well as Perl, Python or other scripting languages. Minimum BSEE/CE + 15 years or MSEE/CE + 12 years experience. Proven track record of execution on products which have shipped in high-volume. Contact: Uday Mulya Technologies muday_bhaskar@yahoo.com "Mining The Knowledge Community"

Physical Design Engineer (4 to 12 Years) Physical Design/Floor Plan/STA/Synthesis/PnR Company: ACL Digital (Wafer space Semiconductor) Location [Bangalore] Experience: 4 t o 12 Years Openings: 5 Positions Preferred - Immediate to 45 Days (Notice Period) Job Description : Technical Skills: Should be able to handle Full chip PnR (timing/congestion/CTS issues), understanding of IO ring, package support, multi voltage design. Deep understanding of the concepts related to synthesis, place & route, CTS, timing convergence, IR/EM checks and signoff DRC/LVS closure Responsible for independent planning and execution of all aspects of physical design including floor planning, place and route, Clock Tree Synthesis, Clock Distribution, extraction, Timing closure, Power and Signal Integrity Analysis, Physical Verification, DFM Must have participated in all stages of the design (floor planning, placement, CTS, routing, physical verification, IREM) Well versed with the timing closure (STA), timing closure methodologies Good Understanding of DRC, LVS,ERC and PERC rule files for lower tech node layout verification Experience in lower tech node (7nm) Good automation skills in PERL, TCL and EDA tool-specific scripting Able to take complete ownership for Block/sub-system for complete execution cycle Out of box thinking to meet tighter PPA requirements Qualification: BE/BTECH/MTECH in EE/ECE with proven experience in ASIC Physical Design Detailed knowledge of EDA tools and flows, Fusion compiler based RTL2GDS flow is desired Experience:4+

Expert in floorplanning, P&R, CTS, STA, DRC/LVS. Proficient in Cadence/Synopsys tools, Perl/TCL scripting. Skilled in low-power techniques: voltage islands, power gating.

Principal Physical Design Engineer Greater Bangalore -Hybrid/Hyderabad (Hybrid ) PrincipalPhysical Design Engineer Company Background We are a well-funded, stealth-mode startup based in Mountain View, CA, founded by senior technical and business executives hailing from category leaders in infrastructure semiconductors and hyperscale cloud services, and backed by top-tier investors with an immensely successful formula & track record on early-stage investments. We are a diverse team of expert chip/software/systems architects and developers who excel in hardware/software solution co-design. Our team has built, and delivered into production, technologies that process over half of the world's global data center traffic. Summary Join an ambitious and highly experienced team of silicon and hyperscale data center systems experts as a Physical Design Engineer. Our team is motivated by a singular mission: to revolutionize the performance and scalability of next-generation distributed computing infrastructure. You have the opportunity to build a groundbreaking new category of product, working alongside some of the industry's most talented hardware and software engineers to create truly disruptive infrastructure solutions that delight our customers. We are looking for talented, motivated engineers with experience in physically implementing large-scale networking and computing semiconductor products, and who are looking to grow in a fast paced, dynamic startup environment. We are looking for experienced physical design engineers who have the range to contribute across the full lifecycle of complex chip development, from CAD tool flow setup, early floorplan exploration in conjunction with microarchitecture development, through block partitioning, power planning, clock network design and construction, through P+R, timing closure, package design, PI/SI analysis, physical verification, and tapeout. Roles and Responsibilities Build and support the CAD tool flow for physical implementation in a cloud-first development environment. Work with architects and microarchitects on the chip-level floorplan and block partitioning. Evaluate tradeoffs in functional partitioning, block size, and interface complexity with other stakeholders. Define and construct the major physical structures, including the clock and reset architecture, the power delivery network, and interconnect topologies. Execute on block-level, cluster-level, and top-level physical implementation, from synthesis, floorplan and power plan, through P+R, through timing closure, physical verification, and tapeout. Interface with foundry and library partners on 3rd party IP and process technology issues, including updates to device models, IP integration requirements, and pre-tapeout signoff. Skills/Qualifications : Proven industry experience and successful track record in the physical implementation of large, high-performance network switching/routing fabrics (Ethernet, Infiniband, HPC), Network Interface Controllers, Smart-NICs, CPUs, or GPUs in the latest silicon process nodes. Deep experience with the latest CAD tools through the entire physical design workflow, e.g., Cadence Genus and Innovus, Synopsys ICC2/FusionCompiler, Tempus, PrimeTime SI, PrimeTime PX, StarRC, ICV, Calibre. Strong familiarity with various analysis tools such as Redhawk, Voltus. Experience with circuit analysis using HSPICE is a plus. Expert knowledge of SystemVerilog, as well as Perl, Python or other scripting languages. Minimum BSEE/CE + 15 years or MSEE/CE + 12 years experience. Proven track record of execution on products which have shipped in high-volume. Contact: Uday Mulya Technologies muday_bhaskar@yahoo.com "Mining The Knowledge Community"

Founded in 2023,by Industry veterans HQ in California,US We are revolutionizing sustainable AI compute through intuitive software with composable silicon Staff Physical Design Engineer • Job Description o Be part of a diverse team working on the high performance designs. Youll lead the complex multimillion instance subsystems including high-speed blocks i.e. DDR, PCIe, AI Cores • Technical Requirements o 8-12 years of experience in Physical Design o Expert in PnR, sign off convergence including timing, physical and PDN verification o Experience in sub 5nm technology node with high performance designs o Experience in pushing performance by custom PnR techniques o Expert of STA and eco generation PnR steps o Expert in debugging and fixing flow, tool and design related issues independently o Experience in the solving physical integration design challenges o Expertise in industry standard tools like Innovus/ICC2/Fusion compiler/Primetime o Experience in contributing to physical design flows and methodologies o Expertise in automation scrips(TCL/PERL/Python)for various implementation steps o Experience in leading and mentoring a team o Ability to work cross-functionally with various teams • Academic Credentials o Qualification: Bachelors or Masters in Electronics/Electrical Engineering

Staff Power Delivery Network and Reliability Engineer Mulya Technologies Greater Bengaluru Area (Hybrid) Staff Power Delivery Network and Reliability Engineer Bangalore Founded in 2023,by Industry veterans HQ in California,US We are revolutionizing sustainable AI compute through intuitive software with composable silicon Power Delivery Network and Reliability Engineer Expertise in Power Grid design and in-depth knowledge of IR drop & EM(electromigration) concepts Knowledge of PDN tool algorithms and hands-on experience with industry-standard tools like Voltus and Redhawk/Redhawk-SC, Exposure to implementation tools like Innovus/ICC2 is a plus Contact: Uday Mulya Technologies muday_bhaskar@yahoo.com "Mining The Knowledge Community"

Hi Mirafra Technologies #Hiring #Physical Design Engineers/ Sr. Engineers SKills Mandatory : # PnR, #floorplanning, #Innovus #placement Experience: 3-5+ years Notice Period - 0 to 30 days Location - #Bangalore Interested candidates can email their updated resumes at kajalmehta @mirafra.com || call / Whatsapp : 9898020056 Role & responsibilities Preferred candidate profile Perks and benefits

Physical Design Engineer Location: Bangalore, Hyderabad, Noida Skills/Experience: Hands-on experience in complex SOC/sub-systems implementation using Innovus & Fusion Compiler. Proficient in top-down floorplan and Power Grid methodologies. Experience in signoff convergence, block-level Timing Signoff, ECO generation, and Power signoff. Successful track records of taping out complex IPs & SoCs at 16/10/7/5 nm Power user of Cadence implementation tools, such as Genus, Innovus, Quantus, Tempus, PVS, Voltus . Automation and programming-minded, coding experience in Tcl/Tk/Perl. Experience (years) : 3+ Year Education Qualification: B-TECH/M-TECH in Electrical/Electronics/Computer Science Engineering or Equivalent

Microcircuits technology is looking for DFT Engineers to join our dynamic team and embark on a rewarding career journey. Research and draft blueprints, engineering plans, and graphics. Develop test prototypes. Identify solutions to improve production efficiency. Use design software to develop models and drawings of new products. Maintain existing engineering records and designs. Assess all engineering prototypes to determine issues or risks. Estimate cost limits and budgets for new designs. Supervise the manufacturing process of all designs. Coordinate with other engineers, management, and the creative department.

BE / BTech / ME / MTech in ECE with 4+ years of relevant experience in ASIC PD. Expertise in digital physical design Expertise in EDA synthesis, APR, STA tools and methodologies Expertise in one or more of the following tools ICC, ICC2, Innovus, Olympus Working knowledge of one or more of the following tools Primetime, Calibre, and Red hawk Hands on experience of working with multi modes and multi corners STA Working Knowledge of multiple power planes and multiple VT libraries Basic domain knowledge of EM, IR, RV analysis, Noise and Formal Equivalence Verification Good at scripting languages PERL, TCL, shell Worked on at least 2 tape ins of moderate to high speed designs with multiple power planes Debug, fix, and validate pre- and post-silicon IP/sub-system logic issues and bugs Experience in one or more of the following circuit design fields is an advantage: clock tree optimization, Timing analysis, and Power optimization Experience in making ECOs both Metal and logic level ecos Experience DRC and LVS cleanup of designs during sign off Exposure to lower node technologies 16nm or below preferred

Key Responsibilities: Floor planning: Develop and optimize floorplans for ASIC designs, ensuring optimal placement of cores, macros, and I/O cells while considering performance and manufacturability. Place & Route (P&R): Perform place-and-route tasks, optimizing for timing, power, and area, ensuring congestion-free routing and maximizing PPA (Performance, Power, Area). Static Timing Analysis (STA): Carry out static timing analysis to identify violations and work on techniques for timing closure such as resizing, retiming, or re-optimization. Power Analysis & Optimization: Perform power analysis, targeting low-power designs using techniques such as clock gating, power gating, and low-power state optimization. Signal Integrity & Noise Analysis: Perform signal integrity analysis to avoid noise and crosstalk in the design. Design Rule Check (DRC) and Layout vs. Schematic (LVS): Run DRC and LVS checks to ensure the layout adheres to manufacturing rules and matches the schematic. RC Extraction: Perform parasitic extraction and analyze RC effects to ensure the design functions at the required operating frequencies. Verification: Participate in the final sign-off processes for physical design and support tape-out efforts, ensuring all design specifications are met. Collaboration: Work closely with design, verification, and CAD teams to troubleshoot and resolve any design-related issues. Documentation: Maintain clear documentation throughout the physical design flow for ease of understanding and for future reference. Qualifications: Education: Bachelors/Masters degree in Electronics/Electrical Engineering or a relevant degree. Experience: Minimum 4-14 years of experience in ASIC physical design. Proficiency in place and route (P&R), static timing analysis (STA), power analysis , and DRC/LVS checks. Experience with tools like Cadence,Innovus , Synopsys IC Compiler , or Mentor Graphics for physical design. Knowledge of advanced process nodes (e.g., 7nm, 5nm) is a plus. Technical Skills: Proficiency in digital design concepts and semiconductor process flows. Strong knowledge of timing optimization techniques and power optimization strategies. Familiarity with parasitic extraction and signal integrity analysis. Ability to script in languages like Tcl , Python , or Perl to automat tasks. Preferred Skills: Experience with 3D IC design or FinFET technologies. Familiarity with full-chip tape-out procedures. Exposure to machine learning techniques in physical design optimization will be added advantage. Perks and benefits According to company norms

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. 8 to 12 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 2 to 5 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Knowledge in Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Good knowledge of Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3- 6yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. 5 to 7 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Strong expertise in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Experience of working as part of a larger team and working towards project milestones and deadlines; Handle technical deliverables with a small team of engineers. Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3- 6yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Experience :6+ years(A Must) Implementation with emphasis on Physical Verification & Hard macro/core finishing activities. Must have led and been primarily responsible for physical verification checks , fixing and sign-off. Excellent understanding of Physical Verification flow with in-depth experience in analyzing and debugging DRC, ERC, LVS, DFM, Antenna, PERC, and Rule deck issues. (Mostly Working on Calibre tool) Deep understanding of ESD, latch-up etc. Own and execute PV activities at the Top/Block level. Work closely with PD team in addressing their PV issues and suggest solutions to them. Work with CAD team in refining the existing flows/methodologies and to resolve the issues. Experience in IO, Bump planning and RDL routing Strategy is a plus. Develop and implement timing and logic ECOs is a plus Innovus/FC level DRC fixing is a plus Python, PERL/TCL knowledge is a plus. Ability to plan and work independently and coordinate with cross-functional teams Has ability to close sign off DRC based on PNR markers is plus Skill Set: Experience with physical verification checks DRC, LVS, Antenna, ERC, PERC, ESD etc. Experience in PnR tools like ICC/Innovus with regards to physical convergence must. Understanding sign-off PDV tools like PDK Concepts, SVRF, Calibre and ICV. Good overall understanding of the Custom IC design flow. Good understanding of layouts and overall backend tool flow would be beneficial. Understanding sign-off PDV tools like PDK Concepts, SVRF, Calibre and ICV. TCL/PERL Scripting is plus. Hands on experience :Innovus/Fusion Compiler , Tech lef is preferable. People management /Floorplanning/Power Planning/PDN experience is BIG Plus

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3 to 5 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Role * Familiar with Physical Design Life cycle of chip development, especially Floorplanning and PnR * Hands on PD execution at block/SoC level along with PPA improvements * Strong understanding of the technology and PD Flow Methodology enablement. * Work with Physical design engineers to rollout robust, identify areas for flow improvement methodologies. (area/power/performance/convergence), develop plans and deploy/support them* Provide tool support and issue debugging services to physical design team engineers across various sites* Develop and maintain 3rd party tool integration and productivity enhancement routines * Understand advance tech PNR and STA concepts and methodologies and work closely with EDA vendors to deploy solutions. Skill Set * Strong programming experience & Proficiency in Python/Tcl/C++ * Understand physical design flows using Innovus/fc/icc2 tools* Knowledge of one of Encounter/Innovus or FC (or other equivalent PNR tool) is mandatory* Basic understanding of Timing/Formal verification/Physical verification/extraction are desired* Ability to ramp-up in new areas, be a good team player and excellent communication skills desired Experience 3-5 years of experience with the Place-and-route and timing closer and power analysis environment is required Niche Skills Handling support tools like Encounter/Innovus/edi/fc/Icc2 (or other equivalent PNR tool). One or more of the above is mandatory*

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 1 to 3 years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Roles and Responsibilities Good experience in PD execution of multiple medium to High critical blocks/HMs from Netlist to GDSII Develop and qualify the methodology and implementation flow in advanced technologies like 14nm and below. Well versed with FC/Innovus tools and good understanding of place/cts/Route critical settings Develop expertise in ASIC Synthesis, Floor Planning, STA (Static Timing Analysis), and other relevant technologies. Good experience in Low power designs Conduct thorough analysis of designs to identify potential issues and implement solutions. Perform physical design activities including floor planning, PNR (Physical Netlist) creation, and timing closure using Innovus tools. Interested candidates can contact me at shubhanshi@incise.in