94 Innovus Jobs - Page 3

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Role * Physical Design Life cycle of chip development, especially Floorplanning and PnR * Hands on PD execution at block/SoC level along with PPA improvements * Strong understanding of the technology and PD Flow Methodology enablement. * Work with Physical design engineers to rollout robust, identify areas for flow improvement methodologies. (area/power/performance/convergence), develop plans and deploy/support them * Provide tool support and issue debugging services to physical design team engineers across various sites * Develop and maintain 3rd party tool integration and productivity enhancement routines * Understand advance tech PNR and STA concepts and methodologies and work closely with EDA vendors to deploy solutions. Skill Set * Strong programming experience & Proficiency in Python/Tcl/C++ * Understand physical design flows using Innovus/fc/icc2 tools * Knowledge of one of Encounter/Innovus or FC (or other equivalent PNR tool) is mandatory * Basic understanding of Timing/Formal verification/Physical verification/extraction are desired * Ability to ramp-up in new areas, be a good team player and excellent communication skills desired Experience 3-5 years of experience with the Place-and-route and timing closer and power analysis environment is required Niche Skills Handling support tools like Encounter/Innovus/edi/fc/Icc2 (or other equivalent PNR tool). One or more of the above is mandatory*

Physical Deisgn Lea LocationBangalore / Hyderabad / Pune Experience - 8+ YoE In-depth knowledge and hands-on experience on Netlist2GDSII Implementation i.e. Floor planning, Placement, CTS, Routing, STA, Power Integrity Analysis, Physical Verification. Should have experienceon Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl. Must have hands-on experience on Synopsys/Cadence tools. (Innovus, ICC2, Primetime, PT-PX, Calibre). Well versed with timing constraints, STA and timing closure. Should have experience on Physical Design Methodologies and submicron technology of 28nm and lower technology nodes. Should have experience on programming in Tcl/Tk/Perl Well versed with timing constraints, STA and timing closure. Do 1. Lead end to end VLSI components & hardware systems a. Design, analyze, develop, modify and evaluate the VLSI components and hardware systems b. Determine architecture and logic design verification through software developed for component and system simulation c. Analyze designs to establish operating data, conducts experimental tests and evaluates results to enable prototype and production VLSI solutions d. Conduct system evaluations and make appropriate recommendations to modify designs or repair equipment as needed e. Allocates modules for testing and verification and reviews data and project documentation f. Provides guidance on technical escalations and review regression testing data g. Prepares documentation containing information such as test case and product scripts for IP and publishes it to the client for feedback and review h. Ensures all project documentation is complete and uploaded as per technical specifications required by the client 2. Provide customer support & governance of VLSI components & hardware systems a. Identify and recommend system improvements to improve technical performance b. Inspect VLSI components & hardware systems to ensure compliance with all applicable regulations and safety standards c. Be the first point of contact to provide technical support to client and help debug specific, difficult in-service engineering problems d. Evaluate operational systems, prototypes and proposals and recommend repair or design modifications based on factors such as environment, service, cost, and system capabilities 3. Team Management a. Resourcing i. Forecast talent requirements as per the current and future business needs ii. Hire adequate and right resources for the team iii. Train direct reportees to make right recruitment and selection decisions b. Talent Management i. Ensure 100% compliance to Wipros standards of adequate onboarding and training for team members to enhance capability & effectiveness ii. Build an internal talent pool of HiPos and ensure their career progression within the organization iii. Promote diversity in leadership positions c. Performance Management i. Set goals for direct reportees, conduct timely performance reviews and appraisals, and give constructive feedback to direct reports. ii. Incase of performance issues, take necessary action with zero tolerance for will based performance issues iii. Ensure that organizational programs like Performance Nxt are well understood and that the team is taking the opportunities presented by such programs to their and their levels below d. Employee Satisfaction and Engagement i. Lead and drive engagement initiatives for the team ii. Track team satisfaction scores and identify initiatives to build engagement within the team iii. Proactively challenge the team with larger and enriching projects/ initiatives for the organization or team iv. Exercise employee recognition and appreciation Deliver No. Performance Parameter Measure 1. Verification Timeliness, Quality and coverage of verification, Compliance to UVM standards, Customer responsiveness 2. Project documentation and MIS 100% on time MIS & report generation Complete Project documentation (including scripts and test cases) 3. Team % trained on new skills, Team attrition %, Employee satisfaction score (ESAT) Mandatory Skills: VLSI Physical Place and Route. Experience5-8 Years.

Plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems. Collaborate with cross-functional teams to develop solutions and meet performance requirements. Hands-on Physical Design (PD) execution at block/SoC level with a focus on Power, Performance, Area (PPA) improvements. Strong understanding of technology and PD Flow Methodology enablement. Work with Physical Design engineers to roll out robust methodologies, identify areas for flow improvement (area/power/performance/convergence), develop plans, and deploy/support them. Provide tool support and issue debugging services to physical design team engineers across various sites. Develop and maintain 3rd party tool integration and productivity enhancement routines. Understand advanced technology Place & Route (PNR) and Static Timing Analysis (STA) concepts and methodologies, and work closely with EDA vendors to deploy solutions. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Skill Set: Strong programming experience & Proficiency in Python/Tcl/C++. Understanding of physical design flows using Innovus/fc/icc2 tools. Knowledge of one of Encounter/Innovus or FC (or other equivalent PNR tool) is mandatory. Basic understanding of Timing/Formal verification/Physical verification/extraction are desired. Ability to ramp-up in new areas, be a good team player, and excellent communication skills desired. Experience: 3-5 years of experience with the Place-and-route and timing closure and power analysis environment is required.

Job Specs : We are seeking a highly skilled and motivated ASIC Physical Design Experts to join the offshore development teams of our group companies. You will work with the rapidly expanding team which focuses on the research and development of ASIC Design IPs for Silicon Lifecycle Management, driving innovation and excellence in chip design and verification. You will work alongside a talented and dedicated group of engineers, all committed to pushing the boundaries of technology and delivering top-notch solutions to our customers. Work Location and Expertise: Bangalore : 4 Years 15 Years Beijing : 8 Years 10 Years Chennai : 3 Years 6 Years Vietnam : 8 Years 10 Years Taiwan : 8 Years 10 Years Desired Profile : Bachelor's / Master's degree in engineering from EEE / E&C / VLSI with 3+ Years of work expertise in ASIC Physical Design Expertise in managing, mentoring and training team of ASIC physical design engineers working across different time zones, this is mandatory for lead positions Expertise in ASIC PD. Expertise in digital physical design Expertise in working with 3nm & 5nm technology nodes Expertise in EDA synthesis, APR, STA tools and methodologies Expertise in one or more of the following tools ICC, ICC2, Innovus, Olympus Working knowledge of one or more of the following tools Primetime, Calibre, and Red hawk Expertise in working with multi modes and multi corners STA Working Knowledge of multiple power planes and multiple VT libraries Basic domain knowledge of EM, IR, RV analysis, Noise and Formal Equivalence Verification Good at scripting languages PERL, TCL, shell Worked on at least 2 tape ins of moderate to high speed designs with multiple power planes Debug, fix, and validate pre- and post-silicon IP/sub-system logic issues and bugs Expertise in one or more of the following circuit design fields is an advantage: clock tree optimization, Timing analysis, and Power optimization Expertise in making ECOs both Metal and logic level ecos Expertise in DRC and LVS cleanup of designs during sign off Expert level proficiency (Oral + Written) in Chinese language is mandatory incase Beijing, Taiwan and Vietnam are the preferred work locations Preferred resources with valid regional work permit.

Role & responsibilities Those who had a chance to work on CPU, GPU and / or NPU would be better on 3 or 5 nm Technology . Experience Levels would 4-8 years.

Technologies from 28nm, 20nm, 14nm, 10nm, 7 nm. Block level floorplanning, power planning and IR drop analysis. Timing closure Multimode multi corner optimization and closure. Clock tree synthesis and advanced clock tree implementation. Block level timing closure with sign off STA . Block level ECO implementation involving netlist level logical changes. Library performance analysis and fine tuning for implementation. Excellent debugging skills in implementation issues and ability to come up with creative solutions.

Roles and Responsibilities Good experience in PD execution of multiple medium to High critical blocks/HMs from Netlist to GDSII Develop and qualify the methodology and implementation flow in advanced technologies like 14nm and below. Well versed with FC/Innovus tools and good understanding of place/cts/Route critical settings Develop expertise in ASIC Synthesis, Floor Planning, STA (Static Timing Analysis), and other relevant technologies. Good experience in Low power designs Conduct thorough analysis of designs to identify potential issues and implement solutions. Perform physical design activities including floor planning, PNR (Physical Netlist) creation, and timing closure using Innovus tools. Interested candidates can contact me at shubhanshi@incise.in

Experience with physical verification checks DRC, LVS, Antenna, ERC, PERC, ESD etc. Experience in PnR tools like ICC/Innovus with regards to physical convergence must. Good understanding of PD flows and overall backend tool flow would be beneficial. Understanding sign-off PDV tools like PDK Concepts, SVRF, Calibre and DRV. TCL/PERL Scripting is plus. Hands on experience :Innovus/Fusion Compiler , Tech lef is preferable. Interested candidates can share their resumes to shubhanshi@incise.in

Job Title: Physical Design Engineer PnR / STA Location: Bangalore Experience: 6 - 10 Years Notice Period: 015 Days (Immediate joiners preferred) Job Type: Full-Time | Onsite Job Description: We are looking for a skilled Physical Design Engineer with strong experience in Place & Route (PnR) and Static Timing Analysis (STA) to join our growing silicon engineering team. The ideal candidate will take ownership of block-level or full-chip implementation and timing closure for high-performance, low-power SoCs. Key Responsibilities: Drive RTL to GDSII flow for block-level or full-chip implementation Perform floorplanning, placement, clock tree synthesis (CTS), routing, and physical verification (LVS/DRC) Execute timing closure using PrimeTime (STA) and handle multi-mode, multi-corner (MMMC) analysis Develop and optimize power, performance, and area (PPA) Collaborate closely with RTL, DV, DFT, and backend teams to resolve implementation and timing issues Work on advanced node technologies (7nm/5nm/3nm) with signoff-quality methodologies Create scripts for flow automation and report generation Required Skills: Hands-on experience with industry-standard tools (Innovus, ICC2/Fusion Compiler, PrimeTime, RedHawk/Voltus) Strong knowledge of PnR flow , STA , RC extraction , and signal/power integrity Solid understanding of timing constraints (SDC) and timing exceptions Familiarity with low-power design techniques, multi-voltage domains, and UPF Experience with scripting languages: Tcl , Perl , Python Strong problem-solving skills and ability to work in a fast-paced team environment Preferred Qualifications: Bachelor’s/Master’s degree in Electronics, Electrical, or VLSI Engineering Tapeout experience on multiple SoC designs Exposure to hierarchical and flat design methodologies Why Join Us? Work on high-volume SoCs with leading semiconductor teams Exposure to cutting-edge EDA tools and latest technology nodes Transparent career growth path and technical mentorship Competitive compensation and work-life balance.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Knowledge in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Knowledge in Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Good knowledge of Tcl/Perl Scripting Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. 3- 6yrs years of experience in Physical Design/Implementation

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. * Hands on PD execution at block/SoC level along with PPA improvements * Strong understanding of the technology and PD Flow Methodology enablement. * Work with Physical design engineers to rollout robust, identify areas for flow improvement methodologies. (area/power/performance/convergence), develop plans and deploy/support them * Provide tool support and issue debugging services to physical design team engineers across various sites * Develop and maintain 3rd party tool integration and productivity enhancement routines * Understand advance tech PNR and STA concepts and methodologies and work closely with EDA vendors to deploy solutions. Skill Set * Strong programming experience & Proficiency in Python/Tcl/C++ * Understand physical design flows using Innovus/fc/icc2 tools * Knowledge of one of Encounter/Innovus or FC (or other equivalent PNR tool) is mandatory * Basic understanding of Timing/Formal verification/Physical verification/extraction are desired * Ability to ramp-up in new areas, be a good team player and excellent communication skills desired Experience 3-5 years of experience with the Place-and-route and timing closer and power analysis environment is required Niche Skills Handling support tools like Encounter/Innovus/edi/fc/Icc2 (or other equivalent PNR tool). One or more of the above is mandatory*

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Minimum Qualifications Bachelor's/Masters degree in Electrical/Electronic Engineering from reputed institution 7+ years of experience in Physical Design/Implementation Minimum : Physical Implementation activities for high performance GPU Core, which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Strong expertise in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Experience of working as part of a larger team and working towards project milestones and deadlines; Handle technical deliverables with a small team of engineers. Strong problem-solving skills and good communication skills.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. We are looking for bright ASIC design engineers with excellent analytical and technical skills. This is an excellent opportunity to be part of a fast paced team responsible for delivering Snapdragon CPU design, flows for high performance SoCs in sub-10nm process for Mobile, Compute and IOT market space. Job Responsibilities Participate on a project involved in the development of ASICs, with emphasis in Place and Route Implementation, Timing Closure, Low Power, Power Analysis and Physical Verification. Create design of experiments and do detailed PPA comparison analysis to improve quality of results, tuning recipes and setting course for the projects going forward Work closely with RTL design, Synthesis, low power, Thermal, Power analysis and Power estimation teams to optimize Performance, Power and Area(PPA) Tabulate metrics results for analysis comparison Develop Place & Route recipes for optimal PPA Minimum Qualifications 2+ years of High Performance core Place & Route and ASIC design Implementation work experience Preferred Qualifications Minimum 3+ years of experience in PD Extensive experience in Place & Route with FC or Innovus is an absolute must Complete ASIC flow with low power, performance and area optimization techniques Experience with STA using Primetime and/or Tempus is required Proficient in constraint generation and validation Experience of multiple power domain implementation with complex UPF/CPF definition required Formal verification experience (Formality/Conformal) Perl/Tcl, Python, C++ skills are needed Strong problem solving and ASIC development/debugging skills Experience with CPU micro-architecture and their critical path Low power implementation techniques experience High speed CPU implementation Clock Tree Implementation Techniques for High Speed Design Implementation are required Exposure to Constraint management tool and Verilog coding experience

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. 5+ years of experience in static timing analysis, constraints and other physical implementation aspects. Solid understanding industry standard tools PT, Tempus, GENUS, Innovus, ICC etc. Solid grip on STA fixing aspects to solve extreme critical timing bottleneck paths. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 6+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 5+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. Additional Qualcomm Noida CPU team is hiring for developing high performance and power optimized custom CPU cores. Individuals to Handle hardening complex HMs from RTL to GDS [ Synthesis, PNR, Timing ]. We are excited to add folks with us for the most cutting-edge work. Here, individuals would have the opportunity to work with some of the most talented and passionate engineers in the world to create designs that push the envelope on performance, energy efficiency and scalability. We offer a fun, creative and flexible work environment, with a shared vision to build products to change the world. Desired experience: 12+ years of experience in Physical design, STA. Solid understanding industry standard tools for physical implementation [ Genus, Innovus, FC, PT, Tempus, Voltas and redhawk]. Solid grip from floorplan to PRO and timing signoff along with understanding of IR drop and physical verification aspect. Should have experienced about preparing complex ECOs for timing convergence [ across huge set of corners] through Tweaker / Tempus / Physical PT ECOs. Should be aware about the tricks for minimizing power. Experience in deep submicron process technology nodes is strongly preferred. Knowledge of high performance and low power implementation methods is preferred. Willing to push PPA to the best possible extent. Strong fundamentals. Expertise in Perl, TCL language

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm GPU team is actively seeking candidates for several physical design engineering positions. Graphics HW team in Bangalore is part of a worldwide team responsible for developing and delivering GPU solutions which are setting the benchmark in mobile computing industry.Team is involved in Architecture, Design, Verification, implementation and Productization of GPU IP COREs that go into Qualcomm Snapdragon SOC Products used in Smartphone, Compute, Automotive, AR/VR and other low power devices. Qualcomm has strong portfolio of GPU COREs and engineers get an opportunity to work with world class engineering team that leads industry through innovation and disciplined execution. As a Graphics physical design engineer, you will innovate, develop, and implement GPU cores using state-of-the-art tools and technologies. You will be part of a team responsible for the complete Physical Design Flow and deliveries of complex, high-speed, low power GPU COREs. Tasks also involve the development and enablement of low power implementation methods, customized P&R to achieve area reduction and performance goals. Additional responsibilities in this role involves good understanding of functional, test (DFT) mode constraints for place and route, floorplanning, power planning, IR drop analysis, placement, multi-mode & multi-corner (MMMC) clock tree synthesis, routing, timing optimization and closure, RC extraction, signal integrity, cross talk noise and delay analysis, debugging timing violations for multi-mode and multi-corner designs, implementing timing fixes, rolling in functional ECOs, debugging and fixing violations and formal verification. The individual also should have deep knowledge on scripting and software languages including PERL/TCL, Linux/Unix shell and C. This individual will design, verify and delivers complex Physical Design solutions from netlist and timing constraints to the final product. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Minimum Qualifications Bachelor's/Masters degree in Electrical/Electronic Engineering from reputed institution 8+ years of experience in Physical Design/Implementation Minimum Physical Implementation activities for high performance GPU Core, which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Strong expertise in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Experience of working as part of a larger team and working towards project milestones and deadlines; Handle technical deliverables with a small team of engineers. Strong problem-solving skills and good communication skills.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Responsibilities Participate on a project involved in the development of ASICs, with emphasis in Place and Route Implementation, Timing Closure, Low Power, Power Analysis and Physical Verification. Create design of experiments and do detailed PPA comparison analysis to improve quality of results, tuning recipes and setting course for the projects going forward Work closely with RTL design, Synthesis, low power, Thermal, Power analysis and Power estimation teams to optimize Performance, Power and Area(PPA) Tabulate metrics results for analysis comparison Develop Place & Route recipes for optimal PPA Minimum Qualifications 4+ years of High Performance core Place & Route and ASIC design Implementation work experience Preferred Qualifications Minimum 4+ years of experience in PD Extensive experience in Place & Route with FC or Innovus is an absolute must Complete ASIC flow with low power, performance and area optimization techniques Experience with STA using Primetime and/or Tempus is required Proficient in constraint generation and validation Experience of multiple power domain implementation with complex UPF/CPF definition required Formal verification experience (Formality/Conformal) Perl/Tcl, Python, C++ skills are needed Strong problem solving and ASIC development/debugging skills Experience with CPU micro-architecture and their critical path Low power implementation techniques experience High speed CPU implementation Clock Tree Implementation Techniques for High Speed Design Implementation are required Exposure to Constraint management tool and Verilog coding experience

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Job Summary: As a Staff/Senior Staff SoC Physical Verification Engineer, you will be responsible for leading and executing full-chip and block-level physical verification (PV) for advanced SoC designs. You will collaborate with cross-functional teams to ensure design integrity, manufacturability, and compliance with foundry rules across multiple technology nodes (e.g., 7nm, 5nm, 3nm). Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Key Responsibilities: Own and drive physical verification (LVS, DRC, ERC, PERC, Antenna, DFM) at block and top levels. Collaborate with Physical Design (PD), RTL, and CAD teams to resolve PV issues and ensure sign-off quality. Analyze and debug PV violations using tools like Calibre, ICV, and IC Validator. Work on ESD routing, bump/RDL planning, and padring integration. Develop and refine PV flows and methodologies in collaboration with CAD teams. Mentor junior engineers and lead PV closure for complex SoC programs. Interface with foundries for rule deck updates and tapeout readiness. Required Skills & Qualifications: B.E./B.Tech or M.E./M.Tech in Electronics, VLSI, or related field. 7"“14 years of hands-on experience in SoC physical verification. Strong expertise in Calibre, ICV, ICC2, Fusion Compiler, and Innovus. Deep understanding of DRC, LVS, ERC, PERC, Antenna, and density checks. Experience with advanced nodes (7nm and below) and FinFET technologies. Familiarity with scripting (TCL, Perl, Python) for automation and debugging. Exposure to ESD, latch-up, IR drop, and EM analysis. Excellent problem-solving, communication, and leadership skills. Preferred Qualifications: Experience with Intel, TSMC, or Samsung foundry rule decks. Knowledge of RTL-to-GDSII flow and ECO implementation. Prior experience in customer-facing or cross-site collaboration roles.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Qualcomm GPU team is actively seeking candidates for several physical design engineering positions. Graphics HW team in Bangalore is part of a worldwide team responsible for developing and delivering GPU solutions which are setting the benchmark in mobile computing industry.Team is involved in Architecture, Design, Verification, implementation and Productization of GPU IP COREs that go into Qualcomm Snapdragon SOC Products used in Smartphone, Compute, Automotive, AR/VR and other low power devices. Qualcomm has strong portfolio of GPU COREs and engineers get an opportunity to work with world class engineering team that leads industry through innovation and disciplined execution. As a Graphics physical design engineer, you will innovate, develop, and implement GPU cores using state-of-the-art tools and technologies. You will be part of a team responsible for the complete Physical Design Flow and deliveries of complex, high-speed, low power GPU COREs. Tasks also involve the development and enablement of low power implementation methods, customized P&R to achieve area reduction and performance goals. Additional responsibilities in this role involves good understanding of functional, test (DFT) mode constraints for place and route, floorplanning, power planning, IR drop analysis, placement, multi-mode & multi-corner (MMMC) clock tree synthesis, routing, timing optimization and closure, RC extraction, signal integrity, cross talk noise and delay analysis, debugging timing violations for multi-mode and multi-corner designs, implementing timing fixes, rolling in functional ECOs, debugging and fixing violations and formal verification. The individual also should have deep knowledge on scripting and software languages including PERL/TCL, Linux/Unix shell and C. This individual will design, verify and delivers complex Physical Design solutions from netlist and timing constraints to the final product. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Minimum Qualifications Bachelor's/Masters degree in Electrical/Electronic Engineering from reputed institution 12+ years of experience in Physical Design/Implementation Minimum Physical Implementation activities for high performance GPU Core, which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Strong expertise in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl/Perl Scripting Experience of working as part of a larger team and working towards project milestones and deadlines; Handle technical deliverables with a small team of engineers. Strong problem-solving skills and good communication skills.

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: Physical Implementation activities for Sub systems "which includes Floor-planning, Place and Route, CTS, Formal verification, Physical Verification (DRC/LVS), PDN, Timing Closure and power optimization. Should have good exposure to PD implementation of PPA critical Cores and making right PPA trade-off decisions. Strong expertise in timing convergence of high frequency data-path intensive Cores and advanced STA concepts Well versed with the Block level PnR convergence with Synopsys ICC2/ Cadence Innovus and timing convergence in PTSI/Tempus in latest technology nodes Good understanding of clocking architecture. Should be able work in close collaboration with design, DFT and PNR teams and resolve issues wrt constraints validation, verification, STA, Physical design, etc. Well versed with Tcl /Perl Scripting Experience of working as part of a larger team and working towards project milestones and deadlines; Handle technical deliverables with a small team of engineers. Strong problem-solving skills and good communication skills. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. Bachelor's/ Masters degree in Electrical /Electronic Engineering from reputed institution 2-10 years of experience in Physical Design/Implementation

Who We Are Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips- the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world- like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries of"science and engineering to make possible"the next generations of technology, join us to Make Possible® a Better Future. What We Offer Location: Bangalore,IND At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. Were committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits . Youll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers."We empower our team to push the boundaries of what is possible"”while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied. Applied Materials is the leader in materials engineering solutions to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. Our innovations make possible„¢ the technology shaping the future. To achieve this, we employ some of the best, brightest, and most talented people in the world who work together as part of a winning team. Key Responsibilities Expertise in PDK enablement and library validation/automation. Hands-on experience with LVS/Parasitic extraction/standard cell characterization flows and methodologies Design/System level experience with DTCO and PPA analysis Hands-on expertise in TCL, Python, make and shell scripting Broad understanding of system design (product architecture, packaging, SRAM, DRAM, etc.) is a plus Strong understanding of the RTL2GDS concepts and methodology and experience with Synopsys/Cadence physical design tools (Fusion Compiler/Innovus) Knowledge of standard cell architecture and design tradeoffs with respect to PPA Proactively identify and act on new trends or developments in future technology nodes Ability to implement solutions and troubleshoot complex problems with limited or no supervision in area of expertise Creative thinking and ability to look ahead and anticipating future technology innovations/issues Ability to collaborate with internal stakeholders, customers and vendors Collaborate/participate in discussions to solve interdisciplinary technical issues in a cross-functional team environment Mandatory - PDK, DRC, LVS, Python, Physical Design Functional Knowledge Demonstrates depth and/or breadth of expertise in own specialized discipline or field Business Expertise Interprets internal/external business challenges and recommends best practices to improve products, processes or services Leadership May lead functional teams or projects with moderate resource requirements, risk, and/or complexity Problem Solving Leads others to solve complex problems; uses sophisticated analytical thought to exercise judgment and identify innovative solutions Impact Impacts the achievement of customer, operational, project or service objectives; work is guided by functional policies interpersonal Skills Communicates difficult concepts and negotiates with others to adopt a different point of view Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

We Are: At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation. You Are: You are an experienced and initiative-taking individual with a strong technical background in Physical design, physical verification at IP/block/full chip level implementation/methodology. You thrive in collaborative environments and possess a passion for creating innovative technology. Your expertise lies in working with advanced Finfet and GAA process challenges, and you have a proactive analytical approach with a keen eye for detail. Your dedication to delivering high-quality results is complemented by excellent communication and people skills, allowing you to effectively collaborate with both internal teams and external customers. Driven by a desire to innovate, you are eager to contribute to the success of our cutting-edge technology products. What Youll Be Doing: * Conceptualizing, designing, and productizing state-of-the-art RTL to GDS implementation for SLM monitors realized through ASIC design flow. * Designing on-chip Process, Voltage, Temperature, glitch, and Droop monitors for monitoring silicon biometrics. * Physical verification, DRC, LVS, PERC, ERC, ESD, EM and Antenna cleaning. *Co-work with Place & Route team to resolve full chip/IP/block level layout integration issues to drive Physical Verification *Coordinates with internal IP owners on IP related issues. *Coordinates with Manufacturing Team on DRC related issues. * Creating new flows/methodologies and updating existing ones through collaboration with architects and circuit design engineering teams. The Impact You Will Have: * Accelerating the integration of next-generation intelligent in-chip sensors and analytics into technology products. * Optimizing performance, power, area, schedule, and yield of semiconductor lifecycle stages. * Enhancing the reliability and differentiation of products in the market with reduced risk. * Driving innovation in Physical verification and signoff design methodologies and tools. * Contributing to the development of industry-leading SLM monitors and silicon biometrics solutions. * Collaborating with cross-functional teams to ensure the successful deployment of advanced technologies. What You’ll Need: BS/B.Tech or MS/M.Tech degree in Electrical Engineering with 5+ years of relevant industry experience. Strong Physical verification and signoff experience. Experience in DRC, LVS, DFM, ANT, ERC, ESD, EM and PERC cleaning is mandatory. Proficiency with Digital design tool from any EDA vendor, preferably from Synopsys tools like FC & ICV Sound understanding of Physical design, Physical verification and signoff concepts. Work with various implementation team to drive full-chip/block level/IP level Physical Verification Sign-off closure in (DRC, LVS, ANT, ERC, ESD, PERC, EM) for tape-out. Experience with design methodologies like developing custom scripts and enhancing flows for better execution. Experience in scripting with TCL/PERL is required. Proven track record of successful physical verification closure & tape-outs in advanced nodes (14nm, 10nm, 7nm, 5nm,3nm,2nm etc...) Exposure to Floorplan & PnR flows and tools such as ICC2/FC/Innovus are added advantage. Good understanding of reliability physics including EM, ESD, crosstalk, shielding, latchup and deep sun-micron challenges. Who You Are: * Proactive and detail-oriented with excellent problem-solving skills. * Adept at working independently and providing physical verification and signoff solutions. * Excellent communicator and team player, capable of collaborating effectively with diverse teams. * Innovative thinker with a passion for technology and continuous improvement. * Committed to delivering high-quality results and achieving project goals.

Role & responsibilities Physical Design Engineer (PD/STA/Synthesis) Must-Haves: •Tools: Cadence Innovus, Synopsys ICC2/Fusion Compiler, PrimeTime for STA •Flow Experience: •Floorplanning •Power planning •Placement •Clock Tree Synthesis (CTS) •Routing •Physical Verification (DRC/LVS) •Timing Closure •Knowledge of: •Low-power design (UPF/CPF) •ECOs •IR Drop, EM Analysis •STA constraints and timing analysis Nice-to-Haves: •Experience with block-level and/or full-chip PD •Familiarity with scripting (Tcl, Perl, Python)

Greeting with HCL Tech! We were looking somebody who is having experience in Physical design Experience: 4 to 10 Years Location: Kochi JD#1 : 4-6years Tapeout experience in block level PnR implementation including synthesis for medium to complex blocks Good to have experience in TSMC/Intel lower technology node(16/14nm or below) Experience in independently analyzing/resolving congestion, timing issues and basic understanding of clock tree build Basic Timing understanding to independently analyze timing paths Experience in ICC2/Innovus/DC tools, Fusion compiler being added advantage Basic equivalency check understanding. Good to have Conformal LEC experience. Should have understanding of basic shell scripting, tool based TCL scripting to automate redundant tasks JD#2 : 6-10years Tapeout experience in full chip floorplan/full chip partitioning flow. Experience in die-size estimation spread sheet IP based and synthesis based Experience in IO/Bump planning & placement, custom analog/PG planning and route implementation Experience in ICC2/Innovus/DC tools, Fusion compiler being added advantage Experience in RDL routing Experience in interfacing with cross functional teams and block PnR teams Good understanding of basic shell scripting, tool based TCL scripting to automate all custom activities Experience in version control systems Experience in managing/mentoring small teams

Key Responsibilities: Floor planning: Develop and optimize floorplans for ASIC designs, ensuring optimal placement of cores, macros, and I/O cells while considering performance and manufacturability. Place & Route (P&R): Perform place-and-route tasks, optimizing for timing, power, and area, ensuring congestion-free routing and maximizing PPA (Performance, Power, Area). Static Timing Analysis (STA): Carry out static timing analysis to identify violations and work on techniques for timing closure such as resizing, retiming, or re-optimization. Power Analysis & Optimization: Perform power analysis, targeting low-power designs using techniques such as clock gating, power gating, and low-power state optimization. Signal Integrity & Noise Analysis: Perform signal integrity analysis to avoid noise and crosstalk in the design. Design Rule Check (DRC) and Layout vs. Schematic (LVS): Run DRC and LVS checks to ensure the layout adheres to manufacturing rules and matches the schematic. RC Extraction: Perform parasitic extraction and analyze RC effects to ensure the design functions at the required operating frequencies. Verification: Participate in the final sign-off processes for physical design and support tape-out efforts, ensuring all design specifications are met. Collaboration: Work closely with design, verification, and CAD teams to troubleshoot and resolve any design-related issues. Documentation: Maintain clear documentation throughout the physical design flow for ease of understanding and for future reference. Qualifications: Education: Bachelors/Masters degree in Electronics/Electrical Engineering or a relevant degree. Experience: Minimum 3-14 years of experience in ASIC physical design. Proficiency in place and route (P&R), static timing analysis (STA), power analysis , and DRC/LVS checks. Experience with tools like Cadence Innovus , Synopsys IC Compiler , or Mentor Graphics for physical design. Knowledge of advanced process nodes (e.g., 7nm, 5nm) is a plus. Technical Skills: Proficiency in digital design concepts and semiconductor process flows. Strong knowledge of timing optimization techniques and power optimization strategies. Familiarity with parasitic extraction and signal integrity analysis. Ability to script in languages like Tcl , Python , or Perl to automate tasks. Preferred Skills: Experience with 3D IC design or FinFET technologies. Familiarity with full-chip tape-out procedures. Exposure to machine learning techniques in physical design optimization will be added advantage. Personal Attributes: Strong problem-solving and analytical skills. Detail-oriented, with a focus on accuracy and optimization. Excellent communication and collaboration skills, capable of working in a cross-functional team. Ability to manage multiple tasks in a fast-paced environment.