Job Area: Engineering Group, Engineering Group > Mechanical Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging. Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables. Minimum Qualifications: Bachelor's degree in Mechanical Engineering or related field. Location Bangalore, India Job Overview The successful candidate will operate as a member of Corporate Engineering department. Responsibilities include working with US and India teams to conceptualize and design high performance electronic assemblies for Mobile, Modem, Compute, Auto, IOT etc. Specific tasks include daily use of Creo solid modeling software, concept layouts, defining rigid and flexible circuit board outline and mounting constraints, electronic file transfers to/from circuit board CAD designers, shielding/gasket design, design of mechanical parts and system assemblies, creating detailed mechanical drawings, specifying dimensional tolerances and tolerance stackups, creating BOMs for assemblies, working with internal teams for optimal selection of batteries, displays, and audio components, working with internal machine shop for prototypes, and working with external suppliers for design collaboration and fabrication, including injection molded tooling. Candidate with knowledge on basics of thermal analysis and simulations will have preference. The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants. Minimum Qualifications 2 to 6 years actively involved in mechanical engineering, Thermal Engineering and design of high-density electronics packaging. 2 to 6 years experience in a mechanical design engineering role designing electronics products / systems. Solid modeling experience utilizing Creo, Simulation experience in Flotherm or ANSYS icepak. Preferred Qualifications Expected to possess a strong understanding of mechanical engineering, thermal engineering and design fundamentals. Experience with defining outline, mounting, and I/O constraints of electronic circuit boards. Demonstrated ability for tolerance analysis and specification, including GD&T fundamentals. Demonstrated success in working with HW, component engineering, and other cross functional teams. Demonstrated success in working with HW and thermal analysis teams for appropriate thermal mitigation techniques. Solid understanding of design fundamentals for CNC, injection molded and stamped metal parts. Demonstrated ability working with supplier base for successful design collaboration and volume production. Strong experience with Creo solid model assembly, part, and drawing creation and Data storage. Experience with top-down skeleton model structuring and master model design techniques within Creo. Experience with IDF/EMN file exchange between mechanical and HW teams. Understands project goals and individual contribution toward those goals. Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides. Interact and collaborate with other internal mechanical engineers for optimal product development processes and schedule execution. Possess excellent verbal and written communication skills Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members. Education Bachelor Degree, Mechanical Engineering required
