4 Failure Mechanisms Jobs

As an Integration Engineer, you will be responsible for managing the integration of 40-110nm BCD (BCD Lite) and HV (Display Driver) technologies from partner facilities. Your main objective will be to ensure the transfer of technologies while meeting performance, reliability, yield, schedule, and cost targets. Additionally, you will be required to support the initial ramp-up phase while upholding yield and quality metrics. Your role will also involve enhancing existing technologies by adding features like active devices and passives, as well as developing new technologies to improve performance and expand application range. You may also lead Wide Band Gap Power technologies as part of your responsibilities. In this position, you will be involved in the design and layout of test chips to facilitate device/technology optimization, reliability assessment, and SPICE model extraction. Moreover, you will be responsible for end-to-end project management, starting from the initial project justification to final qualification and yield ramp. Your duties will include achieving desired performance, quality, yield, schedule, and cost targets. As part of your role, you will build and lead a cross-functional team that spans across diverse geographies. Establishing strong customer relationships based on confidence in the technical capabilities of the company will also be essential. Competitor benchmarking and ownership of the technology roadmap will be within your purview. You will be expected to present to internal and customer senior executives and may require occasional travel for a few weeks per quarter. To qualify for this position, you should hold an M.S or PhD in Electrical Engineering, Materials Science, or a related field. A strong understanding of CMOS and Power device physics, process modules, yield improvement, failure mechanisms, and analytical techniques is essential. In-depth knowledge of power technology parameters and figures of merit, along with a proven track record in delivering technologies into volume manufacturing, will be advantageous. You should possess an understanding of EDMOS/LDMOS device design trade-offs using resurf and superjunction concepts. Familiarity with key modules, especially as they relate to power technologies, and different power device configurations will be beneficial. Demonstrated ability to lead cross-functional teams, meet project deadlines and cost targets, and work effectively across different cultures and geographies are essential qualities for this role. Being a good team player, having an innovative mindset, and maintaining a competitive outlook will be key to success in this position.,

You should have an M.S or PhD in Electrical Engineering, Materials Science or equivalent field. You must possess a strong understanding of CMOS and eNVM device physics, process modules, yield improvement, failure mechanisms, and analytical techniques (physical and electrical). A deep understanding of key eNVM technologies such as charge trap, floating gate, RRAM, MRAM, etc is essential. Experience in technology parameters and figures of merit like bit cell size, macro size, endurance, retention, power, latency, mask count, etc is required. You should have a proven track record in delivering these technologies into volume manufacturing and achieving competitive performance. The ability to lead cross-functional teams and ensure project completion within timeline and cost targets is necessary. Working across different cultures and geographies should be a strength along with being a good team player. Having an innovative and competitive mindset will be beneficial in this role.,

As a member of Tata Electronics, a subsidiary of Tata Sons Pvt. Ltd., you will be part of a pioneering initiative to establish India's first AI-enabled state-of-the-art Semiconductor Foundry. This cutting-edge facility is dedicated to producing chips for a variety of applications, including power management IC, display drivers, microcontrollers (MCU), and high-performance computing logic. These chips cater to the increasing demands of sectors such as automotive, computing, data storage, wireless communications, and artificial intelligence. Your role will involve integration responsibilities for the transfer of 28-90nm technologies from partner facilities, focusing on feature enhancements and performance improvements while meeting reliability, yield, schedule, and cost objectives. You will also be responsible for leading the R&D efforts for new nodes and technology variants, designing and laying out test chips for device/technology optimization, reliability assessment, and SPICE model extraction. Additionally, you will be tasked with end-to-end project management, from the initial project justification to final qualification and yield ramp. This includes ensuring the achievement of desired performance, quality/yield, schedule, and cost targets. You will lead a diverse, cross-functional team across multiple geographies, fostering strong customer relationships based on confidence in Tata Electronics" technical capabilities. To excel in this role, you should possess a Master's or Ph.D. in Electrical Engineering, Materials Science, or equivalent, with a strong understanding of device physics, process modules, yield improvement, failure mechanisms, and analytical techniques. Your proven track record in developing and transferring technologies into high-volume manufacturing, along with deep knowledge of CMOS, SRAM, and eNVM parameters, will be crucial. Your ability to lead cross-functional teams effectively and achieve project completion within timeline and cost constraints is essential. Furthermore, your innovative mindset, problem-solving skills, and adaptability to different cultures and geographies will be key to success in this role. With over 15 years of experience in the semiconductor industry and a track record of successfully developing new technologies for high-volume production, you are expected to drive innovation, collaboration, and continuous improvement within the organization. If you are a self-motivated individual with leadership skills, a thirst for knowledge, and a passion for driving change in a dynamic industry, we invite you to join our team at Tata Electronics and be part of our journey towards technological excellence and global leadership in semiconductor manufacturing.,

You will be leading the Wafer Electrical Test (E-Test) and Wafer Sort Test module team for a 300mm Wafer Fab. Your role will involve ensuring quality compliance across 28nm to 110nm nodes with technology transfer partners. Collaborating with SCM and suppliers to procure top-tier tools, probe-cards, and consumables will be a crucial aspect of your responsibilities. Managing a 24x7 production test floor team of engineers and technicians will be part of your daily tasks. You will define floorplans and ensure capacity with Facilities and Industrial Engineering teams. Driving process improvements, test time reduction, and debug algorithm efficiency will also be under your purview. Coordination with integration and customer teams on test chip layouts and probe-card design will be essential. Your role will involve ensuring operational excellence, meeting performance KPIs, conducting competitor benchmarking, and developing technology roadmaps. Presenting updates to internal and customer senior executives will also be part of your responsibilities. Travel will be required as needed. To excel in this role, you should possess proven ability to lead large 24x7 production teams and mentor high-performing professionals. Being self-driven, independent, and results-oriented is key to success. Strong cross-functional collaboration skills across global teams, inclusive leadership style, and adaptability to diverse cultural norms are essential attributes. You should be a curious, data-driven, and resilient problem-solver. Open, humble, and relationship-focused communication style is important. Being creative and agile in exploring new ideas and adapting to change will be beneficial. Qualifications required for this role include a Bachelor's degree in electrical engineering, Engineering Physics, Materials Science, or equivalent; a Masters degree is preferred. A strong understanding of device physics, process modules, yield improvement, failure mechanisms, and hands-on experience with Etest Program and/or equipment is necessary. Deep experience with Wafer Electrical and Sort Test programs and tools such as HP-Agilent, Keithley, Keysight, Advantest, and TEL Probers is expected. You should be able to write E-test programs, familiar with load boards, probecards, SMUs, equipment hardware, and software. Understanding the equipment supplier landscape and which tools are appropriate for different technologies is crucial. An innovation mindset is desired. The ideal candidate will have 12+ years of experience in the semiconductor industry and leading cross-functional projects and teams to achieve organizational objectives. A proven track record of successfully developing and testing new technologies into high volume production, as well as structured problem-solving skills using design of experiments, 8D, and bench tools, are preferred.,