59 Cadence Allegro Jobs - Page 3

Job Area: Engineering Services Group, Engineering Services Group > CAD Component Qualcomm Overview: Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age - and this is where you come in. General Summary: Role The successful candidate will operate as a senior member of the CAD department library team. Responsibilities include to create and update component CAD schematic symbols and footprint geometry. The senior librarian will interface with internal staff, PWB designers, department managers, component engineers, CAD tool administrators, and outside subcontractors in the fast-paced execution of a variety of circuit board projects. Growth potential includes a permanent position with managerial responsibility. Preferred Qualifications: Bachelor's Associate degree in Electrical/Electronics, Computer Science, Mathematics, or related field. 4+ years of experience in CAD library and or PWB design. Working knowledge in the use of EDA tools, preferably Siemens/Mentor Xpedition and/or Cadence Allegro. Working knowledge of Agile or other PLM tools. Working knowledge of AutoCAD / 3D tools. Basic understanding of Design for Manufacturing/Assembly (DFM/DFA) and utilization of this understanding to create CAD library parts. Basic understanding and Interpretation of Datasheets and engineering drawings Ability to work with internal and external teams. Principal Duties and Responsibilities: Analyzes component specifications and determines how best to create CAD libraries that meet customer requirements. Develops CAD library symbols/parts from datasheets and specifications, often with input from others on the team. Actively stays informed of new/emerging technologies, especially important as packages become smaller with higher pin count and finer pitch Basic understanding / working knowledge of MS Office tools Works with others cross-functionally to expedite issues and provide solutions. With guidance from others, looks for opportunities for improvement in processes in place. Level of Responsibility: Works under close supervision. Responsible for own work. Decision-making is limited. Impact of decisions is readily apparent. Errors made typically only impact timeline (i.e., require additional time to correct). Requires verbal and written communication skills to convey basic, routine factual information about day-to-day activities to others who are fully knowledgeable in the subject area. Most tasks require multiple steps which can be performed in various orders; some planning and prioritization must occur to complete the tasks effectively; mistakes may result in some rework. Some creativity may be required to troubleshoot technical problems or deal with novel circumstances. Deductive problem solving is required to solve moderately complex problems; most problems have defined processes of diagnosis/detection; some limited data analysis may be required. Applicants :Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail myhr.support@qualcomm.com or call Qualcomm's toll-free number found here . Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Dear Candidate, We are hiring for a Senior PCB Design Engineer for our esteemed organization in Hyderabad location. Job Description : Experience: 6+ years of work experience. Role & responsibilities: Learn and apply IPC / Company PCB policies and practices, and design processes Design schematic symbols and foot print symbols based on the data sheets / standards Verifications of foot prints with respect to IPC standards. Generate mechanical data and co-coordinating with Mech team for 3-D modelling and interface checks Interact with hardware design teams for better output Updates schematics and layouts based on the new features / updates Generation of output files (Net lists, Gerber) Getting feedbacks from various relevant groups for feedback / improvements Preparation of Panel Gerber Understanding of SMT process limitations. Preferred candidate profile: Good experience of PCB design. Experience with OrCAD / CADENCE design tools (Latest versions). Good understanding of Allegro. Basic knowledge of the design for test (DFT) and manufacturing (DFM) Ability to perform routine PCB design work requiring application of standard engineering techniques, procedures, and criteria in carrying out tasks. Able to make preliminary selections or adaptations of engineering alternatives. Knowledge on IPC standards PLEAS MAIL YOUR UPDATED PROFILE TO " careers@visiontek.co.in " with following details. Total & Relevant Experience: Current CTC: Expected CTC: Current Location: Notice Period: Regards, Bhargavi HR.

Design, development & testing of high-speed digital & mixed signal designs having FPGAs & microcontroller Component selection Schematic development Board Assembly Instructions Board Bring up & complete interface testing Debugging Required Candidate profile 2+ years of exp as Deign Engineer Hardware Should've used Altium, Cadence, USB, PCIe Gen 1.0, 1G Ethernet, I2C, SPI, UART. BE-Electrical and Electronics Preferably from Manufacturing companies

In your new role you will: As an Analog Mixed-Signal Verification / Validation Engineer for power products Work with design, application, and systems teams to generate test requirements and define test methodologies. Plan and participate in future technologies and projects. Designing of the boards required for testing Power ICs consideringpower and signal integrity aspects. Measurement of datasheet parameters for Power IC s(Controllers,drivers, current sensors) Debug issues related to IC functioning and parametric failures, androot causing the issues with help of design team. Usage of different type of instruments used in LAB (DMM,Oscilloscopes, Power Supplies, AFG etc) Drive innovation in the form of new advancements (test methods/tools,test automation, test infrastructure) Development of Python Scripts for Test Automation. Collating measurements data and analysing it to find anomalies,trends and identify potential issues in design. Work with Test/Product teams in debugging and correlating the resultsbetween the ATE and Bench platforms. You are best equipped for this task if you have: A Master s /bachelor s degree in Electrical/Electronic Engineering or equivalent field of studies. Relevant 5 years of experience in Analog and Power products Verfication / Validation Good Analytical skills and understanding of Analog Circuits Experience in board layout designing in Altium/Cadence allegro. Experience in development of scripts in Python for Test automation will be plus. Excellent problem-solving and communication skills. Ability to work effectively in a collaborative team environment. Detail-oriented with a commitment to quality and precision with fluency in English #WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant s experience and skills. Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process. Click here for more information about Diversity Inclusion at Infineon.

Job Area: Engineering Services Group, Engineering Services Group > PWB Design General Summary: The successful candidate will operate as a member of the Corporate Engineering unit, PWB CAD department, and will be able to provide PWB design solutions for a variety of design types. For example:Product Test Engineering (PTE) designs - (UFLEX/IFLEX Probe cards, 93K DIB, Bench boards and Daughter Cards, Socketed and Solder down, HTOL, etc.) with multiple DUT sites up to 32X. Emulator designs - large/high density digital designs having high layer counts (24-34 layers) and containing several FPGA's (>1500 pins) along with very high-speed digital signals. Reference handset designs - 'form factor accurate' (FFA) circuit boards. These boards require mastery in digital processors, RF and radio circuits as well as power control devices. Experience with micro-vias (stacked), sequential lamination stack-ups and design rules using .5mm pitch and smaller packages. Responsibilities include working with US and India teams to provide PWB design solutions for high performance electronic assemblies for Mobile, Modem and IOT. Specific tasks include daily use of PWB CAD design software to perform placement and routing activities to meet mechanical and electrical design constraints and requirements. Exchange of electronic file transfers to/from mechanical and electrical engineers to ensure compliance to fit, form and function as well as power and signal integrity requirements. Creating fabrication and assembly drawings and working with internal teams and external suppliers to support PWB fabrication and assembly. The candidate will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Leadership skills are expected on all projects to help direct, capture and interface with outside consultants.The candidate is expected to have proficiency on Mentor Xpedition, Mentor PADS and Cadence Allegro PWB design software and is expected to have multiple years of experience in developing PWB design solutions for a variety of design types and working with internal teams and external suppliers to support PWB fabrication and assembly. Additional Information About The Role : 3+ years actively involved in PWB design for high-density electronics packaging.3+ years experience in a PWB design role designing consumer-grade mobile phones utilizing latest generation processor chips.Design for Manufacture (DFM) analysis experience utilizing Valor and/or CAM350 tools. Additional About The Role : Design experience:RF, Analog, High-speed digital circuits - DDR2, 3 & 4, HDMI, PCIe, SATA, MIPI, USB 2,3.x, GigE, ATE Platforms:93K, uFlex and iFlex.Expected to possess a strong understanding and demonstrated application of PWB design principles, practices and standards.Able to perform complex and difficult PWB design tasks requiring extensive skill and knowledge of fabrication and assembly process capabilities and limitations.Develops solutions to a variety of complex problems and proposes PWB design trade-offs to the engineering design team for resolution and implementation.Determine PWB design trade-offs necessary to meet design requirements and produce high quality cost effective PWBs that meet schedule objectives.Understands the requirements driving PWB technology and process trends and their application to Qualcomm designs.Maintain technical coordination with Engineering and Manufacturing. Resolve PWB design issues with fabrication and assembly vendors.Participate and provide input into process improvement, PWB and DFM checklists and guidelines.Participates in determining objectives of assignment and plans, schedules and arranges own activities in accomplishing objectives.Experience working with on-board EMI shielding cans.Experience with IDF/EMN file exchange between mechanical and HW teams.Understands project goals and individual contribution toward those goals.Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides.Interact and collaborate with other internal PWB designers for optimal product development processes and schedule execution.Effectively multitasks and meets aggressive schedules in a dynamic environment.Prepare and deliver design reviews to project team.Possess excellent verbal and written communication skills.Leadership skills to help direct, prioritize, and clearly set project tasks per schedule. Communicate milestones and directions to outside team members. Minimum Qualifications: ....

Your Role An ECAD engineer (Librarian) guides Aptivs automotive OEM customers in having the best in class electronics by delivering quality component library to carry out PCB designs for wide range of products. Key responsibilities: Operational maintenance of the component library database including schematic symbols and geometry cells. Create, modify, review, and approve schematic symbols and cells. Improve and incorporate design for manufacturing Co-operation with local and remote engineering teams. On-time execution of assigned tasks in compliance with ASUX quality standards. Follow Electrical Design Process. Company image building and promotion. Continuous development of professional qualifications. Secure confidential information and companys property. Your Background Working towards a Bachelors/Masters in Electrical & Electronics/Electronics & Communication Engineering 5-8 years of experience in the PCB component librarian role Hands on experience in ECAD tools preferably Mentor graphics Xpedition tool flow Good English skills (both spoken and written) Communication skills Problem Solving Skills. Good To Have: Familiarity with Automotive PCB design exposure Knowledge on High speed simulations Knowledge on Electronic circuit design Why join us? You can grow at Aptiv. Whether you are working towards a promotion, stepping into leadership, considering a lateral career move, or simply expanding your network – you can do it here. Aptiv provides an inclusive work environment where all individuals can grow and develop, regardless of gender, ethnicity or beliefs. You can have an impact . Safety is a core Aptiv value; we want a safer world for us and our children, one with: Zero fatalities, Zero injuries, Zero accidents. You have support . Our team is our most valuable asset. We ensure you have the resources and support you need to take care of your family and your physical and mental health with a competitive health insurance package.

Project Role : Application Lead Project Role Description : Lead the effort to design, build and configure applications, acting as the primary point of contact. Must have skills : Informatica Intelligent Cloud Services Good to have skills : Allegro skill Minimum 5 year(s) of experience is required Educational Qualification : Any Summary :As an Application Lead for Software Development, you will be responsible for leading the effort to design, build, and configure applications using Informatica Intelligent Cloud Services. Your typical day will involve collaborating with cross-functional teams, ensuring timely delivery of projects, and providing technical guidance to team members. Roles & Responsibilities: Lead the design, development, and implementation of applications using Informatica Intelligent Cloud Services. Act as the primary point of contact for the project, ensuring timely delivery of projects and providing technical guidance to team members. Collaborate with cross-functional teams to identify and resolve technical issues, ensuring the smooth functioning of applications. Ensure adherence to coding standards, best practices, and security guidelines while developing applications. Provide technical leadership and mentorship to team members, ensuring their professional growth and development. Professional & Technical Skills: Must To Have Skills:Strong experience in Informatica Intelligent Cloud Services. Good To Have Skills:Experience in other cloud-based integration platforms such as Dell Boomi, MuleSoft, or Azure Logic Apps. Experience in designing, developing, and implementing complex integration solutions. Strong understanding of RESTful APIs, SOAP APIs, and other integration protocols. Experience in working with databases such as Oracle, SQL Server, or MySQL. Experience in working with Agile methodologies and tools such as JIRA or Confluence. Additional Information: The candidate should have a minimum of 5 years of experience in Informatica Intelligent Cloud Services. The ideal candidate will possess a strong educational background in computer science or a related field, along with a proven track record of delivering impactful integration solutions. This position is based at our Mumbai office. Qualification Any

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. Job Function Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm hardware and software. Individual will contribute to the dynamic Customer engineering team for end product designs. Individual will be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in definition of product as appropriate. Work closely with Qualcomm customers to design and enable HW PCBs across different applications. About The Role : As a member of Qualcomm Customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in Mobile, PC, IoT, Automotive and consumer electronics markets. Experience in designing industry Standard form factor modules like SMARC, COM Express, COM HPC, Single Sided LGA, OSM etc Proficient in schematic capture tools like OrCAD and Siemens Mentor Graphics Designer. Proficient in PCB layout tools like Cadence Allegro and Siemens Mentor Graphics Expedition. Proficient in Power Distribution Network (PDN) methodologies and schemes. Proficient in routing topologies for PC-DDR, DDR, and termination schemes. Proficient in routing schemes of high-speed interfaces like USB 3, PCIe 3+, Ethernet (1 Gbps or higher) and other SERDES interfaces Knowledge of high-speed simulation tools like Ansys Q3D, Cadence Sigrity, and Sentinel is necessary Candidates should have excellent communication skills (oral and written), to handle external customers across the geographies Hands on knowledge of running PDN (power distribution network) simulations of a PCB is desired Experience in analog, power, digital, and RF PCB layout aspects. Hands-on experience with multilayer PCBs (at least 12 layers, at least 10 cm x 10 cm, with a processor or FPGA having > 500 pins and pitch smaller than 0.5 mm) and upto 2.00mm thickness. Knowledge of PCB layout tools like Altium Designer and Mentor PADS is a plus. Knowledge of thermal impacts and mechanical constraints on a PCB. Experience in documenting PCB guidelines, checklists, and rules. Candidate should have 5-8 years of relevant experience. Past expertise in interacting with multiple teams in HW, domain skills in Digital/High Speed/SoC is desirable. Candidates should be proficient in reviewing schematics & PCB layout of customer designs, in accordance with Qualcomm and general electrical guidelines and checks Hands-on with electrical test & measurement equipments like oscilloscopes, power supplies, multimeters, data loggers are a plus Exposure to general purpose prototyping platforms like Arduino, Raspberry Pi are a plus Preferred Qualifications Sound understanding of HW and PCB design. Strong understanding of signal integrity and electromagnetic compatibility (EMC) principles. Experience with Design for Manufacturability (DFM) and Design for Testability (DFT) practices. Familiarity with IPC standards for PCB design and manufacturing. Ability to perform design reviews and provide constructive feedback. Excellent problem-solving skills and attention to detail. Effective communication skills for collaborating with cross-functional teams. Ability to manage multiple projects and meet deadlines. Keywords PCB Board Design, Modules, PCB CAD, SMPS, LDO, Antenna, SMARC, COM Express, COM HPC, Single Sided LGA, OSM, HPCMini Educational Requirements Required: Bachelor's, Electronics and/or Electrical Engineering Applicants : Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. To all Staffing and Recruiting Agencies : Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. If you would like more information about this role, please contact Qualcomm Careers.

Responsibilities The India System design team is responsible to own and deliver System design milestones for IBM POWER, Storage and mainframe platforms. The team collaborates with Global System design & development teams and stakeholders. As the manager, you will be leading adiverse team of technical leaders,experienced semiconductor Package designers, PCB Designers, Power supply Designer, Firmware Engineers and Program Managers for the development and design of futureServers & storage products. Also, would be responsible for delivering the India specific milestones for IBM System design and move global collaboration forward. As Engineering Manager, the responsibilities include Program Management oversight for current and future Power and z Systems, which includes oDesign, development and supporting product engineering specifications of Semiconductor Packaging, PCB Design & Power Supply Design oInterface and negotiation with internal and external partners to gather design inputs, establish ground-rules, enable design quality (first time design right) and schedule, creating/supporting project and qualification schedules, milestones, resource/financial-sizing oCollaborate with Global team to ensure key project priorities are aligned. oEnd to End responsibility of product delivery and release by applying, Design Thinking & Agile practices in system design and motivate the team in applying these practices and delivering great user experience and quality products for IBM's Enterprise Servers. People Management:Act as a dedicated people manager, prioritizing team growth, career development, and well-being. This includes: oConducting regular career development conversations to help team members set and achieve their professional goals. oPromoting a positive, inclusive work environment that encourages collaboration, innovation, and team cohesion. oEnsuring continuous skill development, keeping team members up-to-date on the latest technologies and best practices. Employee Engagement:Develop strategies to keep the team engaged and motivated, fostering a culture of feedback, recognition, and appreciation. Performance Management:Regularly assess and support team performance, addressing areas for growth and recognizing achievements. Guide the team through goal-setting, performance reviews, and feedback Ensure Business Compliance and Integrity is maintained across the team Collaborate with peers and stakeholders to share/apply best practices to increase efficiency Required education Bachelor's Degree Preferred education Master's Degree Required technical and professional expertise Bachelor of Engineering in Mechanical/Electrical & Electronics or equivalent program Around 15 years of engineering experience & with 5+ years of People Management Work experience/Knowledge on Semiconductor Packaging design, PCB Design, Electrical/Thermal Analysis, Power Supply Design & their associated tools like Cadence Allegro, Mentor Graphics, Ansys etc. Good interpersonal skills & communication Adopted Agile, Devops and Design Thinking methodologies at work Experience working in Global Team environment Preferred technical and professional experience Basic understanding of server and computer architecture Exposure to Development of Computer Enterprise Server Systems