56 Allegro Jobs

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 4+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 3+ years of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. Job Function Qualcomm is looking for candidates to support its customers in designing solutions using Qualcomm Hardware and Software. The Individual will contribute to the dynamic HW Applications engineering team for end product designs. The Individual will also be responsible for supporting Qualcomm's growing portfolio of platforms/applications and the job involves working closely with internal partners in Product definition as appropriate. The PMIC- H/W application Engineer will be responsible for supporting Qualcomms growing portfolio mobile phone platforms. The job involves working closely with partners and customers of Qualcomm to define the specifications of the mobile phone handset products, part selection, system design, design reviews, support while doing system debug, partner deliverables etc. As a member of Qualcomm customer engineering team, the individual will be responsible for successful integration of Qualcomm solution into customer end products in mobile, PC, and consumer electronics markets. Individual will be responsible to work closely with cross function teams in Qualcomm, including design engineering, systems engineering, characterization team, ATE test team, SW team, product marketing, program management and peers in customer engineering organization across multiple regions. Individual will be responsible to create chipset documentation, reference schematics, training material, application notes for worldwide customer support. Individual will be responsible to engage with customer designs, assist customers in feature definition and design reviews, provide in-depth technical responses to customer queries, do troubleshooting of customer designs and provide necessary training to customers. Past expertise in interacting with multiple teams in HW, SW domains, skills in Digital/Baseband and sound technical knowledge of Qualcomm PMICs are desirable. . Preferred Qualifications Sound understanding of LDO/SMPS - Must to have Experience on power management for portable devices will be a plus Strong understanding PCB Signal/power integrity- Should be comfortable reviewing schematic/suggest changes for improvement - Experience with Schematic entry will be a plus . Should be fluent with CAD tools like Allegro/PADs to review customer layout . Knowledge on crystals/Clocks - Must to have Knowledge on display backlighting schemes - Must to have Knowledge on LabVIEW/python- Will be a plus Experience on Analog and mixed signal bench validation- Will be a plus Knowledge on battery charging and Fuel gauge will be a plus Good communication skills Keywords Power Management, Applications, Analog, PMIC, SMPS, DC/DC Converter, Buck, Boost, LDO, charger, fuel gauge/gas gauge, LED driver, ADC, oscillator, amplifier, Educational Bachelor's or Masters in Electronics and/or Electrical Engineering with 3 -5 years of relevant industrial experience

Genpact (NYSE: G) is a global professional services and solutions firm delivering outcomes that shape the future. Our 125,000+ people across 30+ countries are driven by our innate curiosity, entrepreneurial agility, and desire to create lasting value for clients. Powered by our purpose the relentless pursuit of a world that works better for people we serve and transform leading enterprises, including the Fortune Global 500, with our deep business and industry knowledge, digital operations services, and expertise in data, technology, and AI. Inviting applications for the role of Electrical Design Engineer (ECAD)! In this role, Join a global engineering team utilizing advanced design tools and techniques to develop state-of-the-art CT systems for leadership in medical diagnostic imaging systems. The ECAD designer is responsible for circuit board layout based on designs and schematics derived by the engineers. The ECAD designer will be tasked with creating circuit designs, maintaining BOMs and supplier interaction to develop prototypes. Looking for a well-rounded ECAD designer that can execute on a variety of tasks on this super-awesome fun-tastic team. Responsibilities Circuit board layout BOM creation in local database Qualifications we seek in you! Required Qualifications Associates degree in electrical design or related field and 5 years of industry experience in circuit board layout Ability to design in Cadence System Capture Ability to design in Cadence Allegro Knowledge of standard schematic practices Desired Qualifications Bachelor’s degree in electrical engineering Experience with Valor or Cadence True DFM Good understanding of circuit and circuit board design for analog/digital/power and documentation. Familiarity with digital electronics, switches and flux capacitors Strong oral and written communication skills. Ability to document, plan and execute projects/programs. Ability to multi-task, both on projects within the electrical team and within the greater hardware team. Genpact is an Equal Opportunity Employer and considers applicants for all positions without regard to race, color, religion or belief, sex, age, national origin, citizenship status, marital status, military/veteran status, genetic information, sexual orientation, gender identity, physical or mental disability or any other characteristic protected by applicable laws. Genpact is committed to creating a dynamic work environment that values respect and integrity, customer focus, and innovation. For more information, visit www.genpact.com . Follow us on Twitter, Facebook, LinkedIn, and YouTube. Furthermore, please do note that Genpact does not charge fees to process job applications and applicants are not required to pay to participate in our hiring process in any other way. Examples of such scams include purchasing a 'starter kit,' paying to apply, or purchasing equipment or training.

About Mistral: From the initial architecture stage all the way to manufacturing support, Mistral provides hardware design services for embedded product development which include PCB layout, board design, programmable logic and enclosure designs integrating FPGAs, DSPs, microprocessors, and complex RF, analog, and power systems to realize the complete embedded electronic design for a given application. Location: Bangalore Technical skill: Hardware design, system/product level experience, Project Management, customer interface, HDLC. Product architecture experience based on different SoC. Experience In hardware/product development, integration, testing, compliance & support Proposal & RFQ handling, BOM costing & optimization. Digital Design Experience for High Speed, RF, Aerospace & Defense Engineering. Mixed Signal Design Experience for High Speed, Analog and RF based signals. ARM / Microcontroller Experience -Intel, AMD, Freescale, Renesas, Xilinx, Altera FPGA. Experience in High-speed design like PCIe, JESD, 10/40G Ethernet, DDRx, MIPI, LVDS interfaces Audio and Video Design Experience in NTSC/CVBS, PAL, STANAC, LCD, HDMI, DVI etc. Product qualification / Compliances test experiences. Experience in product qualification for DO-160G, JSS55555 & MIL standard. Power Supply Design and Analysis experience for Aircraft, Navel and UAV based projects. Test and Debug - Board Bring Up, Interface testing Knowledge of debugging tools like IDEs, Emulators Instrument Knowledge - CROs, Logic Analysers, Spectrum Analyser, protocol analyser. Experience in Multi-layer PCB Layout design approach & design reviews, SI knowledge. Exposure to design tools - ORCAD, Allegro / Mentor Graphics Experience of interaction with PCB fabrication house and assembly house for hardware build. Design analysis for SI, PDN, Thermal, EMI/EMC. Experience in quality product release to customers. Desirable Skills • Technical management with team and customer. • Team management experience of 15 to 20 engineers. • Project management experience of scheduling and tracking. • Ability to recruit and grow the team.

At Sienna ECAD, you'll have the opportunity to work on high-complexity PCB designs, including cutting-edge technologies such as high-speed (up to 400Gbps), 5G, supercomputers, servers, next-generation chipsets, high-power solutions, Flex-Rigid, RF platforms, and HDI complex designs. If you're passionate about advancing your skills in these areas, this is an opportunity you shouldn't miss Summary: The Designer specializing in PCB Design contributes to the development of PCB layouts and designs, from conceptual to functional. Ensuring functionality, manufacturability, and adherence to customer requirements. Key Responsibilities: • Design and develop PCB layouts using CAD software. • Translate schematic diagrams into PCB designs, considering electrical performance and manufacturability. • Collaborate with cross-functional teams to understand design requirements, technical constraints, and project timelines. • Conduct design reviews and provide feedback for optimization. • Ensure compliance with industry standards and design guidelines. • Generate documentation and reports related to PCB designs. • Interact with External agencies for Fabrication & Assembly. • Ensure compliance with ISO 27001 requirements. Position will report to: Project Manager/Team Lead Experience: • Self-motivated and result-oriented team player with 3- 8 Years of experience in PCB Design Classification: External_ RDI-EMP-606 Qualifications & Prerequisites: • Bachelor of Engineering in Electronics /Telecom /EEE. / B.Sc-Electronics • Understanding of electronics and knowledge of different component types • Shall understand the basic flow for a PCB design activity • Should have analytical skills to work towards a solution. • Should have good work experience in any of the CAD Software's eg. Allegro, Expedition, Altium, Pads etc.. • Ability to collaborate effectively in a team environment • Familiarity with PCB fabrication processes and materials • Understand knowhow of Fabrication, Assembly, Testing and Troubleshooting Plus: • Knowledge of regulatory requirements related to information security and PCB design .

Hardware Design: Develop and design hardware boards, including schematics and PCB layout, for medical devices. Prototyping: Create prototypes to validate designs and iterate on them based on testing feedback. Testing: Perform rigorous testing to ensure that hardware meets functional and reliability standards. Compliance: Ensure designs comply with medical standards such as ISO 13485 and other relevant regulations (CE, FCC, UL). Analog and Sensor-Based Design: Design and implement analog circuits and sensor-based systems. Processor-Based Designs: Work on hardware involving processor-based architectures and systems. Collaboration: Work closely with firmware engineers, product managers, and regulatory teams to integrate hardware with software and ensure product compliance. Required Skills and Experience: Hardware Design: Strong experience in hardware board design, including schematics and PCB layout. Medical Product Design: Proven experience in designing medical products with a solid understanding of medical compliance standards. Compliance Standards: Familiarity with ISO 13485 and other relevant medical device regulations (CE, FCC, UL). Analog and Sensor-Based Design: Expertise in analog circuit design and sensor integration. Processor-Based Designs: Experience with processor-based hardware designs. Tools Familiarity: Proficiency with Cadence Allegro and OrCAD design tools. Prototyping and Testing: Hands-on experience with prototyping, debugging, and testing of hardware systems. Preferred Qualifications: Bachelors degree in Electrical Engineering, Computer Engineering, or a related field. 5+ years of experience in hardware design, particularly within the medical device industry. Strong problem-solving skills and the ability to work independently as well as part of a team. Excellent communication skills and attention to detail.

Description: Job Title: Senior ECAD PCB Librarian/ECAD Component Specialist Key Responsibilities: • Technical Expertise: Develop and manage the creation of ECAD library smart” symbols, accurately defining pin types, pin properties, and component types. • Design and Development: Analyze component datasheets to input pin properties and relevant metadata, enabling automated schematic validation against predefined design criteria. • Quality Assurance: Ensure all ECAD logical symbols and library components comply with internal quality standards, IPC standards, and industry best practices (DFM/DFA). • Problem Solving: Troubleshoot and resolve issues with ECAD library components, Cadence EDM/Pulse databases, and related tools. • Documentation: Maintain comprehensive, accurate documentation of all ECAD Library parts within Cadence EDM/Pulse environment, updating procedures and process documents as needed. • Cross-Functional Collaboration: Partner with hardware, signal integrity/power integrity simulation teams, mechanical engineers, and component engineers to ensure accurate representation and integration of ECAD components within system designs. • Continuous Improvement: Actively participate in DFM/DFA reviews, identifying opportunities for improvement, proposing enhancements to current standards and methodologies. Responsibilities: • Create and maintain ECAD “smart” symbols within the Cadence EDM system, accurately defining pin types, pin properties, component types, and critical data attributes. • Analyze and interpret component datasheets, accurately inputting data into ECAD symbols for automated schematic audits. • Perform automated schematic checks using Cadence Schematic Audit. • Maintain comprehensive documentation of ECAD library parts and associated procedures. • Engage in cross-team collaboration to ensure seamless ECAD integration into hardware designs. • Continuously identify opportunities to improve ECAD library development processes and implement best practices. Qualifications: • Bachelor’s degree in Electrical Engineering or related discipline. • Proven expertise creating ECAD logical symbols and managing Cadence libraries (minimum 5+ years). • Strong proficiency with Cadence PCB design tools (Allegro, EDM/Pulse, Part Developer, System Capture). • Solid understanding of ECAD symbol creation, pin types, pin properties, and automated schematic audits. • Familiarity with Schematic Audit automation and industry-standard electronic component datasheets. • Knowledgeable in Design for Manufacturing (DFM) and Design for Assembly (DFA) constraints. • Exceptional analytical, communication, and collaboration skills. • High level of attention to detail to ensure precision in data entry and compliance with standards. Preferred Qualifications\Mandatory Skill set: • Strong knowledge of Cadence System Capture\DEHDL Schematic Audit (formerly Checkplus) • Ability to read data sheets and transfer data into ECAD logical symbols. • Proficiency in Cadence PCB design software (ie Allegro, EDM\Pulse, Part Developer) • Create automated checks using Schematic Audit • Thorough understanding of electronic component data sheets and terminology • Knowledge of DFM/DFA constraints. MUST HAVES: MANDATE SKILLS : 1. Solid understanding of ECAD symbol creation( Logical and Physical) using Cadence\Allegro tool 2. Knowledge of DFM/DFA constraints. 3. Good understanding with internal quality standards, IPC standards, JEDEC on Parts creation

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. Location

At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more at www.te.com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. Location

Works in the area of Software Engineering, which encompasses the development, maintenance and optimization of software solutions/applications. 1. Applies scientific methods to analyse and solve software engineering problems. 2. He/she is responsible for the development and application of software engineering practice and knowledge, in research, design, development and maintenance. 3. His/her work requires the exercise of original thought and judgement and the ability to supervise the technical and administrative work of other software engineers. 4. The software engineer builds skills and expertise of his/her software engineering discipline to reach standard software engineer skills expectations for the applicable role, as defined in Professional Communities. 5. The software engineer collaborates and acts as team player with other software engineers and stakeholders. Works in the area of Software Engineering, which encompasses the development, maintenance and optimization of software solutions/applications.1. Applies scientific methods to analyse and solve software engineering problems.2. He/she is responsible for the development and application of software engineering practice and knowledge, in research, design, development and maintenance.3. His/her work requires the exercise of original thought and judgement and the ability to supervise the technical and administrative work of other software engineers.4. The software engineer builds skills and expertise of his/her software engineering discipline to reach standard software engineer skills expectations for the applicable role, as defined in Professional Communities.5. The software engineer collaborates and acts as team player with other software engineers and stakeholders. - Grade Specific Is fully competent in it's own area and has a deep understanding of related programming concepts software design and software development principles. Works autonomously with minimal supervision. Able to act as a key contributor in a complex environment, lead the activities of a team for software design and software development. Acts proactively to understand internal/external client needs and offers advice even when not asked. Able to assess and adapt to project issues, formulate innovative solutions, work under pressure and drive team to succeed against its technical and commercial goals. Aware of profitability needs and may manage costs for specific project/work area. Explains difficult concepts to a variety of audiences to ensure meaning is understood. Motivates other team members and creates informal networks with key contacts outside own area. Skills (competencies) Verbal Communication

Role & responsibilities: 1. Requirement gathering based on discussion with customer or Lead 2. Selection of suitable component for the above requirements 3. Design analysis 4. Schematics design, optimized BOM generation 5. Interact with the PCB Team and get the layout completed with the following items followed • Standard guidelines for best EMI/EMC performance • Standard DFM guidelines 7. Completion of doing EMI/EMC pre-compliance testing at standard laboratories 8. Handover to production team for mass production 9. Laying out production test plan considering the test jig feasibilities and with the help of a software resource 10. Supporting production team for production issues. Preferred candidate profile: Interested candidate kindly share me your updated CV at jeevabvr@gmail.com

Major skills that we need to look for -> Hardware Design, Board design, Digital circuit design, Low power design, Board debug, Board testing, x86, Documentation Detailed JD :- Hardware design engineer with x86 Board design background. Strong fundamentals and experience in Digital circuit design and low power Electronic circuits. Understanding of signal integrity, EMI/EMC concepts for Digital and Power Electronics Experience in at least one complete project starting from the high-level design to the final validation. Should be able to independently handle the schematic design, design analysis and review coordination with peer designers, Layout, SI and EMC teams. Experience in board bring-up and issue investigation & triage, in coordination with firmware and software teams. Experience in preparing and reviewing hardware design documentation and issue investigation reports. Should be able to develop the board bring-up plan, be able to identify the test equipment required and execute independently . Strong communication and interpersonal skills to collaboratively work with various cross functional teams involving post silicon IP Validation, BIOS and Driver Development/QA.

Job Responsibilities: Responsible for the hardware circuit design of the brushless DC/BLDC/PMSM motor and the controller of the DC motor, the simulation design and analysis of the core hardware part Responsible for hardware requirement capture, analysis and documentation. Electronic component selection, control circuit schematic design, PCB layout design , and commissioning and testing of single-board components Work with software engineers to complete the commissioning and testing of the motor drive; Responsible for the compilation of project-related technical documents, BOM output and DFEMA; Responsible for Hardware qualification (CVT, DVT and PVT), EMC/EMI certification Lead the development of Hardware design, prototyping and validation quality processes Job requirements: (Please alter the Job requirements as per the JD Please) Bachelor/Master degree, major in motor control, electronics, electrical, automation Familiar with the position sensorless control algorithm of BLDC square wave and sine wave, FOC, space vector control, experience in related projects is preferred Proficient in at least one 16 or 32-bit microcontroller software design; proficient in Infenon or arm cortex software/hardware design is preferred Familiar with Matlab/Simulink modeling and simulation, and proficient in using at least one circuit simulation (Multisim, Pspice, Seber, etc.) software. Experience in applying matlab motor control software to automatically generate is preferred Familiar with automotive electronics, body network (CAN/LIN protocol), experience in related automotive projects is preferred Practical experience with ARM-based SW architecture development for BLDC motor drives - Lead complex projects - Meet customers to understand and design products according to customers' requirements - Share and transfer knowledge to other engineers Come join our global, inclusive & diverse team Our purpose is to improve the quality of life of everyone we touch through our innovative motion systems. We are a truly global team bound together by our shared values. Our culture is built on the diversity, knowledge, skills, creativity, and talents that each employee brings to the company. Our people are our company’s most valuable asset. We are committed to providing an inclusive, diverse and equitable workplace where employees of different backgrounds feel valued and respected, regardless of their age, gender, race, ethnicity or religious background. We are committed to inspiring our employees to grow, act with ownership and find fulfilment and meaning in the work they do.

Position: PCB Design Engineer Department: PCB Tech. CoE Project Area: Electronics product design for industrial and electrical sectors Openings: 2 Qualification: BE/BTech in Electronics Experience Required: 8+ years Key Skills (Mandatory): Hands-on experience in Allegro or Altium Expertise in high-speed, multi-layer PCB layout (including stack-up, differential pair, impedance control, matched delay) Strong understanding of SMD & through-hole components Good knowledge of IPC standards (IPC2221A, IPC-SM-782, IPC 7351), UL , and MIL standards Experience in footprint creation , library management , and layout validation Understanding of EMI/EMC design guidelines Some exposure to hardware testing Other Details: Start Date: - Immediate Pre-requisite Tools/Training: Allegro or Altium

Design multilayer PCBs using cadence allegro tools Collaborate with electrical engineers to translate schematics into PCB layouts Define board stack-ups, impedance control, and layout constraints Perform signal integrity, power integrity, and DFA/DFT/DFM analysis Generate and review fabrication and assembly documentation (Gerber files, BOMs, pick & place, assembly drawings) Work with vendors and manufacturers for PCB fabrication and assembly Create and maintain PCB design libraries Ensure compliance with regulatory standards (e.g., IPC, RoHS, UL) Proficiency with one or more PCB CAD tools Understanding of high-speed design principles and layout best practices Familiarity with EMI/EMC considerations and thermal management Strong attention to detail and analytical skills Experience with HDI, mixed, and RF PCB designs Knowledge of IPC standards (e.g., IPC-2221, IPC-7351) Experience with DFx

locationsIndia, Bangalore time typeFull time posted onPosted 5 Days Ago job requisition idJR0274956 Job Details: About The Role : Foundry Services (FS) is an independent foundry business that is established to meet our customers' unique product needs. With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient, and sustainable source of supply. This job opportunity in FS will be part of the Customer Solutions Engineering (CSE) group which is responsible for the portions of the system foundry that brings the best of Intel technologies to FS customers, differentiating and accelerating their solutions from architecture to post-silicon validation. We are looking experienced Floorplan Engineer to work on Foor plan, die estimation, Power planning of high performance designs . Responsibilities include Establishes the integration plans for die with optimization for package and board constraints. Bump planning, Die file generation , closing loop with package team on signal and power bump placement restrictions Create physical database for the IP or SoC. Collaborate with architects to optimize the placement of IPs for latency as well as die area/aspect-ratio. Collaborate with the design teams on clocking and dataflow to deliver the physical block level floorplans for APR. Derive specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies. Coordinate with power delivery team on trade-offs for metal allocation for signal and power. Have excellent understanding on, die-per-reticle/good-die-per-wafer maximization, and right technology selection on metal layers usage maximization Good knowledge on RDL routing and efficient usage higher metal layers Performs integration of all dies in a package and completes the relevant checks before tape-out. Qualifications: Qualification : 12+ Years of relevant Experience After a Bachelor or Master of Engineering degree in Electrical/ Electronic/VLSI Engineering or related field. Must have led multiple SOCs in capacity of SOC Floorplan lead. Strong Expertise in Design planning, die estimation, Good understanding on package and board level requirement . Must have knowledge on clocking , high speed design signal routing, industry standard protocols and IP architecture; Good understanding on relevant areas of Library / Memory / technology/submicron issues . Teamwork / flexibility / ability to thrive in a dynamic environment are very important Job Type: Experienced Hire Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations: Business group: Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. *

Key Skills (Mandatory): Hands-on experience in Allegro or Altium. Expertise in high-speed, multi-layer PCB layout (including stack-up, differential pair, impedance control, matched delay). Strong understanding of SMD & through-hole components . Good knowledge of IPC standards (IPC2221A, IPC-SM-782, IPC 7351), UL , and MIL standards. Experience in footprint creation , library management , and layout validation. Understanding of EMI/EMC design guidelines . Some exposure to hardware testing .

Job Area: Engineering Group, Engineering Group > Hardware Applications Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Application Engineer, you will provide technical expertise of hardware through trainings, product demonstrations, and the design, debug, test, and quality support of customer products. Qualcomm Hardware Application Engineers collaborate with cross-functional teams to assess the potential application of company products that meet and exceed customer needs. Minimum Qualifications: "¢ Bachelor's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 2+ years of Hardware Applications Engineering or Hardware Design experience or related work experience. OR Master's degree in Electrical/Electronics Engineering, Computer Engineering, or related field and 1+ year of Hardware Applications Engineering or Hardware Design experience or related work experience. OR PhD in Electrical/Electronics Engineering, Computer Engineering, or related field. IOT JD Title IOT Applications Engineering "“ Senior Engineer Job Function Qualcomm is seeking candidates to assist its customers in designing IoT solutions utilizing Qualcomm hardware and software. The individual will contribute to the dynamic Customer Engineering team for product designs and will be responsible for supporting Qualcomm's expanding portfolio of platforms and applications. This role involves collaborating closely Qualcomm customers to support hardware design sign-offs, system/PCB/chip-level debugging, and ownership of design collaterals that helps customers to bring out products faster. Preferred Qualifications A strong understanding of Digital/baseband HW design and PCB design is required. Good troubleshooting skills with the ability to analyze and debug during board bring up (boot-up) are essential. An understanding of LDO/SMPS is essential, along with experience in power management for portable devices being advantageous. Solid knowledge in High-Speed digital interfaces, such as memory Bus I/F (UFS, eMMC, LPDDR, NAND), Display interfaces (parallel and serial, preferably MIPI DSI), Camera interfaces (parallel and serial, preferably MIPI CSI), High Speed peripherals (USB, SDC, PCIe, Ethernet), and Standard Peripheral interfaces (UART, SPI, I2C, JTAG, HDMI) are necessary. Experience with Digital HW/baseband systems and board-level design, as well as familiarity with Digital ASICs and system design, is important. Understanding of system-level clocking schemes, interface-level handshakes are necessary A strong understanding of mobile and consumer electronics products is needed. Hands-on experience with oscilloscopes, logic analyzers, test and measurement tools are required. Basic knowledge of ARM processors and experience with JTAG emulators, display drivers, and memory is preferable. Knowledge of multi-core system/inter-chip system design is advantageous. A strong understanding of PCB signal/power integrity is necessary Must be comfortable in reviewing schematics and suggesting improvements is required. Experience with schematic entry is a plus. Must have knowledge to review PCB layout in various CAD tools like Cadence Allegro, Siemens Mentor Graphics suite. Knowledge of multi-layer PCB designs, vias, and stack-up configuration is essential. The ability to interact with multi-geography customers and stakeholders is desired. Knowledge of prototyping platforms like Arduino and Raspberry Pi is beneficial. About The Role As a member of Qualcomm's Customer Engineering team, responsibilities include creating chip and chipset documentation, reference schematics, and training materials for global customer support. Candidate will assist with hardware design reviews, respond to technical queries, and troubleshoot designs at the system, SoC, and PCB levels. A minimum of 3 years' relevant experience is required, along with skills in hardware, digital/high speed/power management, and Silicon validation. Keywords Board Design, Board bring up, UFS, LPDDR, NAND, eMMC, MIPI, USB, UART, SPI, I2C, Logic Analyzer, PADS, Allegro, LDO, SMPS, Clocks, Crystal, ARM processor, JTAG Educational Requirements RequiredBachelor's, Electronics and/or Electrical Engineering PreferredMaster's, Electronics and/or Electrical Engineering

Responsible for the hardware Mechanical design of the brushless DC motor and the controller of the DC motor, Responsible for PCB Conceptual design and mfg. feasibility . hardware mechanical requirement capture, analysis and documentation. Electronic component Interface and assembly design, PCB layout BOM, and CAD Drawing release. Work with Hardware engineers to complete the commissioning and testing of the motor drive ; support for the compilation of project-related technical documents, BOM output and DFEMA; Support the development of Hardware design, Virtual prototyping and input to validation quality processes team. Understand and design products according to customers' requirements Come join our global, inclusive & diverse team Our purpose is to improve the quality of life of everyone we touch through our innovative motion systems. We are a truly global team bound together by our shared values. Our culture is built on the diversity, knowledge, skills, creativity, and talents that each employee brings to the company. Our people are our company’s most valuable asset. We are committed to providing an inclusive, diverse and equitable workplace where employees of different backgrounds feel valued and respected, regardless of their age, gender, race, ethnicity or religious background. We are committed to inspiring our employees to grow, act with ownership and find fulfilment and meaning in the work they do.

Project Role : Quality Engineering Lead (Test Lead) Project Role Description : Leads a team of quality engineers through multi-disciplinary team planning and ecosystem integration to accelerate delivery and drive quality across the application lifecycle. Applies business and functional knowledge to develop end-to-end testing strategies through the use of quality processes and methodologies. Applies testing methodologies, principles and processes to define and implement key metrics to manage and assess the testing process including test execution and defect resolution. Must have skills : Allegro ERTM Good to have skills : DevOps Minimum 5 year(s) of experience is required Educational Qualification : 15 years full time education Summary :As a Quality Engineering Lead (Test Lead), you will lead a team of quality engineers through multi-disciplinary team planning and ecosystem integration to accelerate delivery and drive quality across the application lifecycle. You will apply business and functional knowledge to develop end-to-end testing strategies through the use of quality processes and methodologies. Your role will involve applying testing methodologies, principles, and processes to define and implement key metrics to manage and assess the testing process including test execution and defect resolution. Roles & Responsibilities: Expected to be an SME, collaborate and manage the team to perform. Responsible for team decisions. Engage with multiple teams and contribute on key decisions. Provide solutions to problems for their immediate team and across multiple teams. Lead a team of quality engineers through multi-disciplinary team planning and ecosystem integration to accelerate delivery and drive quality across the application lifecycle. Apply business and functional knowledge to develop end-to-end testing strategies through the use of quality processes and methodologies. Apply testing methodologies, principles, and processes to define and implement key metrics to manage and assess the testing process including test execution and defect resolution. Collaborate with cross-functional teams to ensure effective testing and quality assurance practices are implemented. Professional & Technical Skills: Must To Have Skills:Proficiency in Allegro ERTM. Good To Have Skills:Experience with DevOps. Strong understanding of quality engineering principles and practices. Experience in designing and implementing test strategies and plans. Knowledge of test automation frameworks and tools. Experience in test execution, defect tracking, and reporting. Excellent problem-solving and analytical skills. Strong communication and collaboration skills. Additional Information: The candidate should have a minimum of 5 years of experience in Allegro ERTM. This position is based at our Bengaluru office. A 15 years full-time education is required. Qualifications 15 years full time education

Project Role : Application Lead Project Role Description : Lead the effort to design, build and configure applications, acting as the primary point of contact. Must have skills : Allegro ERTM Good to have skills : ASP.NET MVC, DevOps Minimum 7.5 year(s) of experience is required Educational Qualification : Minimum 15 years of fulltime education Summary :As an Application Lead for Allegro ERTM, you will be responsible for leading the effort to design, build, and configure applications. You will act as the primary point of contact and work with a team to ensure successful project delivery. Your typical day will involve collaborating with cross-functional teams, developing and implementing software solutions, and ensuring project timelines are met. Key Responsibilities:1 Requirements gathering, technical analysis, technical design and end to end configuration of product set up in Allegro/Horizon 2 Adept in handling business changes and managing client expectations 3 Provide comprehensive document of changes, coordinate user testing, user training 4 Effective management of tasks, timelines, progress reporting on tasks - Manage communication across multiple teams and be a good team player Technical Experience:1 Thorough understanding of Agile and waterfall delivery methodology 2 Minimum Hands-on experience in Allegro 6years overall 8years in Net, WinForms /WPF, Webservices, Wcf, Design Patterns, Svn, Sql Server above 2016 etc, good software engineering skillset 3 Added Advantage Azure DevOps, Cloud and Net Core 4 Should have experience in managing an end-to-end delivery of a module 5 Strong functional understanding of Gas, power, coal, emissions/ renewables trading Professional Attributes:1 Candidate must be able to work in small teams, or alone, for project delivery 2 Candidate should be able to exhibit strong analytical and problem-solving skills,to deliver high quality solutions to clients 3 Candidate should be able to liaise with other support/development teams to resolve cross Additional Information: The candidate should have a minimum of 7.5 years of experience in Allegro ERTM. The ideal candidate will possess a strong educational background in computer science or a related field, along with a proven track record of delivering successful software solutions. This position is based at our Bengaluru office. Qualifications Minimum 15 years of fulltime education

Project Role : Application Developer Project Role Description : Design, build and configure applications to meet business process and application requirements. Must have skills : Allegro ERTM, Hands on experience in BDM Good to have skills : DevOps, ASP.NET MVC Minimum 3 year(s) of experience is required Educational Qualification : 15 years full time education Summary :As an Application Lead for Allegro ERTM, you will be responsible for leading the effort to design, build, and configure applications. You will act as the primary point of contact and work with a team to ensure successful project delivery. Your typical day will involve collaborating with cross-functional teams, developing and implementing software solutions, and ensuring project timelines are met. Roles & Responsibilities:-Requirements gathering, technical analysis, technical design and end to end configuration of product set up in Allegro/Horizon -Adept in handling business changes and managing client expectations -Provide comprehensive document of changes, coordinate user testing, user training -Effective management of tasks, timelines, progress reporting on tasks - Manage communication across multiple teams and be a good team player Technical Experience:-Thorough understanding of Agile and waterfall delivery methodology -Minimum Hands-on experience in Allegro 4years overall 6years in Net, WinForms /WPF, Webservices, Wcf, Design Patterns, Svn, Sql Server above 2016 etc, good software engineering skillset -Added Advantage Azure DevOps, Cloud and Net Core -Should have experience in managing an end-to-end delivery of a module -Strong functional understanding of Gas, power, coal, emissions/ renewables trading Professional Attributes:-Candidate must be able to work in small teams, or alone, for project delivery -Candidate should be able to exhibit strong analytical and problem-solving skills,to deliver high quality solutions to clients -Candidate should be able to liaise with other support/development teams to resolve cross Additional Information: The candidate should have a minimum of 6 years of experience in Allegro ERTM. The ideal candidate will possess a strong educational background in computer science or a related field, along with a proven track record of delivering successful software solutions. This position is based at our Bengaluru office. Qualifications 15 years full time education

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } R&D PRODUCT DVL PCB ENGINEER I- PCB Design Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB CAM engineer is scalable to contribute individually. He/she is responsible for delivering the project with zero DFM’s for manufacturing. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board DFM validation. The candidate is expected to interface with US and China based fabrication vendors and independently work on resolving vendor engineering queries while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to validate detailed manufacturing aspects of pcb using CAM350. The candidate will be responsible for ensuring the accuracy and functionality of the end design (includes IPC matching, Min/max clearance definition) and be able to take ownership of various aspects of the DFM constraint. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board validation is required. Very good exposure in CAM software – CAM350 Previous work experience in high-speed board validation will be highly preferred. Able to address supplier Engineering Queries. Familiarity with the following a plus: Altium, Allegro Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 8,000 engineers, working alongside customers in approximately 140 countries. TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131828 Alternative Locations: Function: Engineering & Technology Job Segment R&D Engineer, Manufacturing Engineer, Design Engineer, Testing, Fabrication, Engineering, Technology, Manufacturing Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } R&D/PRODUCT DVL ENGINEER II At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competency ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131824 Alternative Locations: Function: Engineering & Technology Job Segment R&D Engineer, Manufacturing Engineer, Testing, Engineer, Electrical, Engineering, Technology Apply now »

7+ years experience Proficient in Allegro/OrCAD Proficient in communications signal integrity, impedance matching, speed up to 1GHz Proficient in PCB design standards Proficient in routing techniques Proficient in design for EMC compliance Proficient in PCB footprint creation, component placement, layer stack-up, design rules Good thermal and power integrity analysis Good electronics and schematics understanding Good knowledge of PCB manufacturing technologies, cost, and limitations Good troubleshooting ability Footprint, Routing, Pcb Layout Design, Allegro, Orcad, Pcb Design, Emc

Expertise in Symbol and Foot print creation using OrCAD capture & Allegro tool Expertise in Cadence Tool. Good Knowledge in library management, CIS Component Information System & CIP -Component information portal. How to leverage the capture CIS/CIP database management functionality for PCB schematic design. Worked on Orcad Centralized library Secondary Proficient to specify OEM component sources based on design engineering specs Proficient in Silicon Expert and similar tools to find second sources, validate component life cycles, etc. Proficient in creating footprints and symbols in Allegro/OrCAD Experience managing Allegro/OrCAD libraries Good in creating documentation for component release into TCE Footprint, Orcad, Allegro, Librarian, Component Engineer, Cadence