Job
Description
Job Area: Engineering Group, Engineering Group > Mechanical Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Mechanical Engineer, you will design, analyze, troubleshoot, and test electro-mechanical systems and packaging. Qualcomm Engineers collaborate across functions to provide design information and complete project deliverables. Minimum Qualifications: Bachelor's degree in Mechanical Engineering or related field. Job Overview: The successful candidate will operate as a member of Corporate Engineering Hyderabad department. Responsibilities include working with US and India teams to perform thermal and structural analysis of high-performance electronic assemblies. Specific tasks include daily use of thermal and structural analysis software, taking concept layouts from the design team, creating representative analytical models, defining boundary and loading conditions, running simulations, analyzing results, and making recommendations for optimization of designs. The Engineer will interface with internal staff and outside partners in the fast-paced execution of a variety of multi-disciplined projects. Minimum Qualifications : Bachelor's / Masters degree in Mechanical/Thermal/ Electronic Engineering or a related field. 1-3 years actively involved in thermal and structural engineering analysis of high-density electronics packaging. Strong background in heat transfer fundamentals with a good understanding of electronics cooling technologies (passive and active). Knowledge of packaging technologies, electromechanical design, and thermal management materials. Analysis tools experience utilizing Flotherm,XT, Icepak, 6SigmaET, Celsius EC, Ansys, Abaqus, or equiv. Solid modeling experience utilizing Pro/E or Solidworks mechanical CAD system. Proven ability to work independently and collaboratively within a cross-functional team environment. Strong technical documentation skills and excellent written and verbal communication. Preferred Qualifications: Expected to possess a strong understanding of mechanical engineering and analysis fundamentals. Experience creating thermal and structural models of electronic circuit components, boards, and enclosures. Experience applying environmental spec conditions to analytical model boundary and loading conditions. Experience working with HW team for component, board, and system thermal power estimates. Experience specifying appropriate fans and heat sinks for electronic assemblies. Experience working with design teams for optimization based on analysis results. Demonstrated success in working with HW teams for appropriate thermal mitigation techniques. Proficiency with thermal testing (e.g.,LabVIEW, thermocouples, airflow measurements, thermal chambers, J-TAG) for computer hardware. Understands project goals and individual contribution toward those goals. Effectively communicates with project peers and engineering personnel via e-mail, web meetings, and instant messaging including status reports and illustrative presentation slides. Excellent verbal and written communication skills Interact and collaborate with other internal mechanical and electronics engineers for optimal product development processes and schedule execution. Effectively multitasks and meets aggressive schedules in a dynamic environment. Prepare and deliver design reviews to project team. Education Bachelor's / Masters degree in Mechanical/Thermal /Electronic Engineering or a related field. Keywords: Thermal analysis, electronics cooling, Flotherm, XT, Icepak, Celsius EC, thermal testing, thermal engineering, mechanical engineering.
