Semiconductor Packaging – Mechanical Modeler

IBM

3 - 8 years

4 - 7 Lacs

bengaluru karnataka india

Posted:2 weeks ago| Platform: Foundit logo

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Skills Required

dma tma tga.

Work Mode

On-site

Job Type

Full Time

Job Description

Key Responsibilities:

Develop and simulate system-level hardware models using CAD and FEA tools.
Acquire or collaborate to obtain accurate material properties for modeling.
Analyze qualification test data and validate against simulation results.
Prepare detailed technical reports and presentations for stakeholders.
Provide design guidelines for components such as laminates, TIMs, coolers, chips, GPUs, HBMs, and load actuation hardware.
Influence design decisions to ensure robust packaging and system integration.
First-level packaging (chip, laminate, module) and module-to-socket integration
Required technical and professional expertise
Master's/PhD in Mechanical Engineering.
3+ years of experience in Finite-Element Modeling (FEM).
Proficiency in CAD (SolidWorks preferred) and FEM tools (ANSYS or Abaqus).
Ability to create scripts (APDL, Python) beyond GUI modifications.
Experience in design for manufacturability (DFM).
Hands-on lab experience.
Strong communication, problem-solving, and time management skills.
Ability to work independently and in cross-functional teams.
Familiarity with electronic packaging and heterogeneous integration.
Preferred technical and professional experience
5+ years in mechanical modeling.
Experience in static structural FEA (stress, strain, warpage prediction).
Moisture diffusion and swelling simulation expertise.
Knowledge of server/computer architecture.
Experience with lab toolstensile testers (Instron/MTS), DMA, TMA, TGA.
Applied statistics and DOE knowledge (Minitab, JMP).
Programming experience in Matlab, Python, LabView, or C++.

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