Physical Design Engineer

Key Responsibilities: Floor planning: Develop and optimize floorplans for ASIC designs, ensuring optimal placement of cores, macros, and I/O cells while considering performance and manufacturability. Place & Route (P&R): Perform place-and-route tasks, optimizing for timing, power, and area, ensuring congestion-free routing and maximizing PPA (Performance, Power, Area). Static Timing Analysis (STA): Carry out static timing analysis to identify violations and work on techniques for timing closure such as resizing, retiming, or re-optimization. Power Analysis & Optimization: Perform power analysis, targeting low-power designs using techniques such as clock gating, power gating, and low-power state optimization. Signal Integrity & Noise Analysis: Perform signal integrity analysis to avoid noise and crosstalk in the design. Design Rule Check (DRC) and Layout vs. Schematic (LVS): Run DRC and LVS checks to ensure the layout adheres to manufacturing rules and matches the schematic. RC Extraction: Perform parasitic extraction and analyze RC effects to ensure the design functions at the required operating frequencies. Verification: Participate in the final sign-off processes for physical design and support tape-out efforts, ensuring all design specifications are met. Collaboration: Work closely with design, verification, and CAD teams to troubleshoot and resolve any design-related issues. Documentation: Maintain clear documentation throughout the physical design flow for ease of understanding and for future reference. Qualifications: Education: Bachelors/Masters degree in Electronics/Electrical Engineering or a relevant degree. Experience: Minimum 3-14 years of experience in ASIC physical design. Proficiency in place and route (P&R), static timing analysis (STA), power analysis , and DRC/LVS checks. Experience with tools like Cadence Innovus , Synopsys IC Compiler , or Mentor Graphics for physical design. Knowledge of advanced process nodes (e.g., 7nm, 5nm) is a plus. Technical Skills: Proficiency in digital design concepts and semiconductor process flows. Strong knowledge of timing optimization techniques and power optimization strategies. Familiarity with parasitic extraction and signal integrity analysis. Ability to script in languages like Tcl , Python , or Perl to automate tasks. Preferred Skills: Experience with 3D IC design or FinFET technologies. Familiarity with full-chip tape-out procedures. Exposure to machine learning techniques in physical design optimization will be added advantage. Personal Attributes: Strong problem-solving and analytical skills. Detail-oriented, with a focus on accuracy and optimization. Excellent communication and collaboration skills, capable of working in a cross-functional team. Ability to manage multiple tasks in a fast-paced environment.