Posted:4 days ago|
Platform:
Work from Office
Full Time
Advanced Packaging SME - Overall 15 plus years of Industry experience (Electronics/Semiconductors)
Handon working experience on electronics product engineering and development area.Knowledge/experience in outsourced semiconductor assembly and test (OSAT) operations, including: traditional and advanced assembly and test processes, terminology, data requirements, implications of OSAT services on MES, (B2B-SCM-MES integration)Design validation, Foundry fabrication experienceKnowledge of any Semiconductor MES System in the market (FactoryWorks, OpsCenter, Critical Manufacturing, SiView)Excellent communication skills, with the ability to convey complex technical concepts to non-technical stakeholders.
Minimum 10 + years of experience into Semiconductor / electronics product engineering and development.
Knowledge/experience in outsourced semiconductor assembly and test (OSAT) operations, including: traditional and advanced assembly and test processes, terminology, data requirements, implications of OSAT services on MES, (B2B-SCM-MES integration)Electronics product engineering and development (From OSAT, EMS industries)Foundry fabrication experienceKnowledge of any Semiconductor MES System in the market (FactoryWorks, OpsCenter, Critical Manufacturing, SiView)
Handon working experience on electronics product engineering and development area (From OSAT, EMS industries)
Knowledge/experience in outsourced semiconductor assembly and test (OSAT) operations, including: traditional and advanced assembly and test processes, terminology, data requirements, implications of OSAT services on MES, (B2B-SCM-MES integration)Design validation, Foundry fabrication experience, Discrete Manufacturing (PP) skills preferred.
IBM
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