96 Board Design Jobs - Page 4

Role & responsibilities 1. HW Design Life cycle Experience 2. Digital and Analog design 3. Design Validation 4. Vendor Interaction 5. Good Communication Skill 6. Aero Experience is an optional requirement. 7. Cross function team interactions 8. Design Documentation preparation 9. Design Release process Aero Domain experience is preferred but not mandatory

Knowledge of High-Speed Board Design Experience in designing with memories like DDR3 / DDR4 / eMMC / NAND / NOR Flash etc. Experience in designing with High-speed communication protocols like PCIe / SerDes / USB3.0 / SGMII / SFP+ /10G/100G/ Hands-on experience with MII, SGMII, RGMII, HSGMII, QSGMII, XGMII and its PHY interfaces Hands-on experience with Intel or Broadcom or Marvel or MediaTek Quad/Octal port Ethernet PHYs transceivers Should have design experience in Multiport Gigabit Network Switches, Hubs and Gigabit Router Added Advantage for knowledge of PoE 802.3at , PoE+ 802.3bt Type 2 , or PoE++ 802.3bt Type 3 or 4PPoE PoE++ Type 4 Should Have Experience of different Gbit Standard such as 1000Base – SX, 1000Base-LX, 1000Base- CX, and 1000Base-T 1Gb/s SFP(INF-8074i),10Gb/s SFP+ (SFF-8431 4.1) or 25Gb/s SFP28 (SFF-8402) and QSF,QSFP+,QSFP28 would be advantage Experience with High-speed Hardware design, Complex Analog and Digital Hardware System level design, circuit analysis, SI/PI, PSPICE simulation, Boundary scan, EMC/EMI analysis and safety standards Responsibilities include Schematic Capture, Component Selection, Library Creation and Guiding Board Layout. Should Have product development understanding like Enterprise switching, Port extender, Embedded Ethernet fabric, and TSN products Hands-on experience in Telecom/Datacom product design Experience like PDH/SDH/SONET/ and fibre optic products Should Have telecom backhaul Network transmission products design Experience, Experience in working with complex ASSPs, Microprocessors/controllers and FPGAs Experience in Signal Integrity / Power Integrity Should have worked on testing equipment like high-speed Oscilloscope, Network analysers, spectrum analysers etc

locationsIndia, Bangalore time typeFull time posted onPosted 5 Days Ago job requisition idJR0274956 Job Details: About The Role : Foundry Services (FS) is an independent foundry business that is established to meet our customers' unique product needs. With the first Open System Foundry model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient, and sustainable source of supply. This job opportunity in FS will be part of the Customer Solutions Engineering (CSE) group which is responsible for the portions of the system foundry that brings the best of Intel technologies to FS customers, differentiating and accelerating their solutions from architecture to post-silicon validation. We are looking experienced Floorplan Engineer to work on Foor plan, die estimation, Power planning of high performance designs . Responsibilities include Establishes the integration plans for die with optimization for package and board constraints. Bump planning, Die file generation , closing loop with package team on signal and power bump placement restrictions Create physical database for the IP or SoC. Collaborate with architects to optimize the placement of IPs for latency as well as die area/aspect-ratio. Collaborate with the design teams on clocking and dataflow to deliver the physical block level floorplans for APR. Derive specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies. Coordinate with power delivery team on trade-offs for metal allocation for signal and power. Have excellent understanding on, die-per-reticle/good-die-per-wafer maximization, and right technology selection on metal layers usage maximization Good knowledge on RDL routing and efficient usage higher metal layers Performs integration of all dies in a package and completes the relevant checks before tape-out. Qualifications: Qualification : 12+ Years of relevant Experience After a Bachelor or Master of Engineering degree in Electrical/ Electronic/VLSI Engineering or related field. Must have led multiple SOCs in capacity of SOC Floorplan lead. Strong Expertise in Design planning, die estimation, Good understanding on package and board level requirement . Must have knowledge on clocking , high speed design signal routing, industry standard protocols and IP architecture; Good understanding on relevant areas of Library / Memory / technology/submicron issues . Teamwork / flexibility / ability to thrive in a dynamic environment are very important Job Type: Experienced Hire Shift: Shift 1 (India) Primary Location: India, Bangalore Additional Locations: Business group: Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust N/A Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. *

Role Purpose The purpose of this role is to prepare test cases and perform testing of the product/ platform/ solution to be deployed at a client end and ensure its meet 100% quality assurance parameters. Do Instrumental in understanding the test requirements and test case design of the product Authoring test planning with appropriate knowledge on business requirements and corresponding testable requirements Implementation of Wipro's way of testing using Model based testing and achieving efficient way of test generation Ensuring the test cases are peer reviewed and achieving less rework Work with development team to identify and capture test cases, ensure version Setting the criteria, parameters, scope/out-scope of testing and involve in UAT (User Acceptance Testing) Automate the test life cycle process at the appropriate stages through vb macros, scheduling, GUI automation etc To design and execute the automation framework and reporting Develop and automate tests for software validation by setting up of test environments, designing test plans, developing test cases/scenarios/usage cases, and executing these cases Ensure the test defects raised are as per the norm defined for project / program / account with clear description and replication patterns Detect bug issues and prepare file defect reports and report test progress No instances of rejection / slippage of delivered work items and they are within the Wipro / Customer SLA's and norms Design and timely release of test status dashboard at the end of every cycle test execution to the stake holders Providing feedback on usability and serviceability, trace the result to quality risk and report it to concerned stakeholders Status Reporting and Customer Focus on an ongoing basis with respect to testing and its execution Ensure good quality of interaction with customer w.r.t. e-mail content, fault report tracking, voice calls, business etiquette etc On time deliveries - WSRs, Test execution report and relevant dashboard updates in Test management repository Updates of accurate efforts in eCube, TMS and other project related trackers Timely Response to customer requests and no instances of complaints either internally or externally NoPerformance ParameterMeasure1Understanding the test requirements and test case design of the productEnsure error free testing solutions, minimum process exceptions, 100% SLA compliance, # of automation done using VB, macros2Execute test cases and reportingTesting efficiency & quality, On-Time Delivery, Troubleshoot queries within TAT, CSAT score Mandatory Skills: VLSI Board Design. Experience3-5 Years.

NUMEROS MOTORS PRIVATE LIMITED is looking for Engineer - Embedded Hardware to join our dynamic team and embark on a rewarding career journey Analyzing customer needs to determine appropriate solutions for complex technical issues Creating technical diagrams, flowcharts, formulas, and other written documentation to support projects Providing guidance to junior engineers on projects within their areas of expertise Conducting research on new technologies and products in order to recommend improvements to current processes Developing designs for new products or systems based on customer specifications Researching existing technologies to determine how they could be applied in new ways to solve problems Reviewing existing products or concepts to ensure compliance with industry standards, regulations, and company policies Preparing proposals for new projects, identifying potential problems, and proposing solutions Estimating costs and scheduling requirements for projects and evaluating results

Wipro Limited (NYSEWIT, BSE507685, NSEWIPRO) is a leading technology services and consulting company focused on building innovative solutions that address clients’ most complex digital transformation needs. Leveraging our holistic portfolio of capabilities in consulting, design, engineering, and operations, we help clients realize their boldest ambitions and build future-ready, sustainable businesses. With over 230,000 employees and business partners across 65 countries, we deliver on the promise of helping our customers, colleagues, and communities thrive in an ever-changing world. For additional information, visit us at www.wipro.com. About The Role Role Purpose The purpose of the role is to design, and architect VLSI and Hardware based products and enable delivery teams to provide exceptional client engagement and satisfaction. ? Do Define product requirements, design and implement VLSI and HARDWARE Devices. Constant upgrade and updates of design tools, frameworks and understand the analysis of toolset chain for development of hardware products. Ability to analyse right components and hardware elements to choose for product engineering or development. Ability to conduct cost-benefit analysis and choose the best fit design. Knowledge on end to end flow of VLSI including design, DFT and Verification and Hardware product development from design, selection of materials, low level system software development and verification. Needs by displaying complete understanding of product vision and business requirements Develop architectural designs for the new and existing products Part Implementation of derived solution Debug and Solve critical problems during implementation Evangelize Architecture to the Project and Customer teams to achieve the final solution. Constant analysis and monitoring of the product solution Continuously improve and simplify the design, optimize cost and performance Understand market- driven business needs and objectives; technology trends and requirements to define architecture requirements and strategy Create a product-wide architectural design that ensures systems are scalable, reliable, and compatible with different deployment options Develop theme-based Proof of Concepts (POCs) in order to demonstrate the feasibility of the product idea and realise it as a viable one Analyse, propose and implement the core technology strategy for product development Conduct impact analyses of changes and new requirements on the product development effort ? Provide solutioning of RFPs received from clients and ensure overall product design assurance as per business needs Collaborate with sales, development, consulting teams to reconcile solutions to architecture Analyse technology environment, enterprise specifics, client requirements to set a product solution design framework/ architecture Provide technical leadership to the design, development and implementation of custom solutions through thoughtful use of modern technology Define and understand current state product features and identify improvements, options & tradeoffs to define target state solutions Clearly articulate, document and sell architectural targets, recommendations and reusable patterns and accordingly propose investment roadmaps Validate the solution/ prototype from technology, cost structure and customer differentiation point of view Identify problem areas and perform root cause analysis of architectural design and solutions and provide relevant solutions to the problem Tracks industry and application trends and relates these to planning current and future IT needs Provides technical and strategic input during the product deployment and deployment Support Delivery team during the product deployment process and resolve complex issues Collaborate with delivery team to develop a product validation and performance testing plan as per the business requirements and specifications. Identifies implementation risks and potential impacts. Maintain product roadmap and provide timely inputs for product upgrades as per the market needs Competency Building and Branding Ensure completion of necessary trainings and certifications Develop Proof of Concepts (POCs), case studies, demos etc. for new growth areas based on market and customer research Develop and present a point of view of Wipro on product design and architect by writing white papers, blogs etc. Attain market referencsability and recognition through highest analyst rankings, client testimonials and partner credits Be the voice of Wipros Thought Leadership by speaking in forums (internal and external) Mentor developers, designers and Junior architects for their further career development and enhancement Contribute to the architecture practice by conducting selection interviews etc ? Deliver No.Performance ParameterMeasure1.Product design, engineering and implementationCSAT, quality of design/ architecture, FTR, delivery as per cost, quality and timeline, POC review and standards2.Capability development% trainings and certifications completed, mentor technical teams, Thought leadership content developed (white papers, Wipro PoVs) ? Mandatory Skills: VLSI Board Design. Experience8-10 Years. Reinvent your world. We are building a modern Wipro. We are an end-to-end digital transformation partner with the boldest ambitions. To realize them, we need people inspired by reinvention. Of yourself, your career, and your skills. We want to see the constant evolution of our business and our industry. It has always been in our DNA - as the world around us changes, so do we. Join a business powered by purpose and a place that empowers you to design your own reinvention. Come to Wipro. Realize your ambitions. Applications from people with disabilities are explicitly welcome.

About The Role Role Purpose The purpose of this role is to perform the development of VLSI system by defining the various functionalities, architecture, layout and implementation for a client ? Do 1. Conduct verification of the module/ IP functionality and provide customer support a. Understand the architecture of the module or the IP and create verification environment and the development plan as per Universal Verification Methodology b. Create test bench development and test case coding of the one or multiple module c. Write the codes or check the code as required d. Execute the test cases and debug the test cases if required e. Conduct functional coverage analysis and document the test cases including failures and debugging procedures on SharePoint/ JIRA or any other platform as directed f. Test the entire IP functionality under regression testing and complete the documentation to publish to client g. Troubleshoot, debug and upgrade existing systems on time & with minimum latency and maximum efficiency h. Write scripts for the IP i. Comply with project plans and industry standards 2. Ensure reporting & documentation for the client a. Ensure weekly, monthly status reports for the clients as per requirements b. Maintain documents and create a repository of all design changes, recommendations etc c. Maintain time-sheets for the clients d. Providing written knowledge transfer/ history of the project ? Deliver No. Performance Parameter Measure 1. Verification Timeliness Quality of Code/ Number of defects Customer responsiveness Project documentation (scripts, test cases etc) 2. Self-development Skill test for next level clearance on Trend Nxt ? ? Mandatory Skills: VLSI Board Design. Experience3-5 Years. Reinvent your world. We are building a modern Wipro. We are an end-to-end digital transformation partner with the boldest ambitions. To realize them, we need people inspired by reinvention. Of yourself, your career, and your skills. We want to see the constant evolution of our business and our industry. It has always been in our DNA - as the world around us changes, so do we. Join a business powered by purpose and a place that empowers you to design your own reinvention. Come to Wipro. Realize your ambitions. Applications from people with disabilities are explicitly welcome.

About The Role Role Purpose The purpose of this role is to lead the VLSI development and design of the system by defining the various functionalities, architecture, layout and implementation for a client ? Do 1. Lead end to end VLSI components & hardware systems a. Design, analyze, develop, modify and evaluate the VLSI components and hardware systems b. Determine architecture and logic design verification through software developed for component and system simulation c. Analyze designs to establish operating data, conducts experimental tests and evaluates results to enable prototype and production VLSI solutions d. Conduct system evaluations and make appropriate recommendations to modify designs or repair equipment as needed e. Allocates modules for testing and verification and reviews data and project documentation f. Provides guidance on technical escalations and review regression testing data g. Prepares documentation containing information such as test case and product scripts for IP and publishes it to the client for feedback and review h. Ensures all project documentation is complete and uploaded as per technical specifications required by the client 2. Provide customer support & governance of VLSI components & hardware systems a. Identify and recommend system improvements to improve technical performance b. Inspect VLSI components & hardware systems to ensure compliance with all applicable regulations and safety standards c. Be the first point of contact to provide technical support to client and help debug specific, difficult in-service engineering problems d. Evaluate operational systems, prototypes and proposals and recommend repair or design modifications based on factors such as environment, service, cost, and system capabilities ? 3. Team Management a. Resourcing i. Forecast talent requirements as per the current and future business needs ii. Hire adequate and right resources for the team iii. Train direct reportees to make right recruitment and selection decisions b. Talent Management i. Ensure 100% compliance to Wipro’s standards of adequate onboarding and training for team members to enhance capability & effectiveness ii. Build an internal talent pool of HiPos and ensure their career progression within the organization iii. Promote diversity in leadership positions c. Performance Management i. Set goals for direct reportees, conduct timely performance reviews and appraisals, and give constructive feedback to direct reports. ii. Incase of performance issues, take necessary action with zero tolerance for ‘will’ based performance issues iii. Ensure that organizational programs like Performance Nxt are well understood and that the team is taking the opportunities presented by such programs to their and their levels below d. Employee Satisfaction and Engagement i. Lead and drive engagement initiatives for the team ii. Track team satisfaction scores and identify initiatives to build engagement within the team iii. Proactively challenge the team with larger and enriching projects/ initiatives for the organization or team iv. Exercise employee recognition and appreciation ? Deliver No. Performance Parameter Measure 1. Verification Timeliness, Quality and coverage of verification, Compliance to UVM standards, Customer responsiveness 2. Project documentation and MIS 100% on time MIS & report generation Complete Project documentation (including scripts and test cases) 3. Team % trained on new skills, Team attrition %, Employee satisfaction score (ESAT) ? Mandatory Skills: VLSI Board Design. Experience5-8 Years. Reinvent your world. We are building a modern Wipro. We are an end-to-end digital transformation partner with the boldest ambitions. To realize them, we need people inspired by reinvention. Of yourself, your career, and your skills. We want to see the constant evolution of our business and our industry. It has always been in our DNA - as the world around us changes, so do we. Join a business powered by purpose and a place that empowers you to design your own reinvention. Come to Wipro. Realize your ambitions. Applications from people with disabilities are explicitly welcome.

Who We Are Applied Materials is the global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to work beyond the cutting-edge, continuously pushing the boundaries ofscience and engineering to make possiblethe next generations of technology, join us to Make Possible a Better Future. What We Offer Location: Bangalore,IND At Applied, we prioritize the well-being of you and your family and encourage you to bring your best self to work. Your happiness, health, and resiliency are at the core of our benefits and wellness programs. Our robust total rewards package makes it easier to take care of your whole self and your whole family. We're committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our . You'll also benefit from a supportive work culture that encourages you to learn, develop and grow your career as you take on challenges and drive innovative solutions for our customers.We empower our team to push the boundaries of what is possible"while learning every day in a supportive leading global company. Visit our Careers website to learn more about careers at Applied. HARDWARE DESIGN AND SUPPORT ENGINEER About Applied Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. At Applied Materials, our innovations make possible the technology shaping the future. Our Team Your O pportunity As a hardware Support Engineer, you can deepen your technical skills and become an expert in specific technologies or equipment. This expertise can lead to roles where you might take on more complex projects and responsibilities. Roles and Responsibility Understand specifications and schematics for image computers, ensuring compatibility with other hardware and software systems. Integrate image processing hardware with existing systems, ensuring seamless operation and high performance. Develop testing protocols for image computers and system controllers to validate functionality and performance. Conduct rigorous testing and analysis to identify and resolve issues in hardware design and integration. Provide technical support for image computers and system controllers, diagnosing and resolving hardware and integration issues. Collaborate with software and firmware engineers to troubleshoot system-level problems and optimize performance. Maintain documentation for all hardware designs, integration processes, and troubleshooting efforts. Communicate effectively with stakeholders to gather requirements, provide updates, and deliver technical support. Our Ideal Candidate Handling the SFP, SFP+ QSFP module for Network management Working as lab POC for all lab management and project execution activities and the status report of the lab handling. Proficiency in hardware testing and validation techniques. Excellent problem-solving skills and attention to detail. Strong communication skills and ability to work collaboratively in a team environment. Familiar with server architectures, specs, roadmaps, cost vs. performance. Including CPUs, PCIe, GPUs, memory, interconnects, networking, power, cooling, SW interfacing. Qualifications Bachelor's degree in Electrical Engineering, Computer Engineering/ECE/EEE, or a related field. Additional Qualifications: Understanding of laboratory environments and the specific requirements for testing and development within such settings. Ability to manage multiple projects and adapt to changing priorities and technologies. Additional Information Time Type: Full time Employee Type: Assignee / Regular Travel: Yes, 10% of the Time Relocation Eligible: Yes Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

Dear Candidate: We are looking for an ideal candidate for this role who is experienced and detail-oriented visual merchandiser with a strong background in retail, preferably in the supermarket or similar consumer-facing sectors . We have two vacancies where the candidate should be highly adaptable, with the ability to work in diverse cultural and regional settings, including Telangana and Rajasthan. Role & responsibilities: Coordinate with Creative Agencies: Serve as the primary point of contact with external creative agencies for the design and production of required in-store and outdoor signage. Ensure timely delivery and alignment with promotional calendars. Signage Management & Execution: Oversee the end-to-end availability and accurate placement of all visual communication materials within and outside the designated store locations. Ensure consistency across all outlets by monitoring signage deployment and maintenance. Vendor Collaboration: Liaise with vendors and internal stakeholders to ensure seamless and timely execution of signage and display initiatives across all stores. Brand Compliance: Uphold and enforce brand guidelines, ensuring all visual merchandising elements meet corporate identity standards and enhance the overall customer experience. Market & Competitor Analysis: Conduct regular benchmarking studies to analyze competitors' visual merchandising strategies. Leverage insights to enhance in-store communication and positioning. Audit & Quality Control: Review and verify floor fixture audits to ensure all displays are functional, safe, and aligned with visual merchandising standards. Take corrective action where necessary to maintain quality and compliance. Preferred candidate profile: Any Graduate, Exposure to Visual Merchandising with working experience of minimum 3 years. Hands-on Experience of Coral Draw, Photoshop and Adobe Illustrator is a MUST Experience in a similar job profile is highly preferred. Should be willing to Travel Good communication and co-ordination skills.

Hiring electronics designer for Lighting company. Who is good in to electronics designing /PCB/ program manager etc. Pls share CV on sarika.vasdev@provisionconsulting.in

Job Type: Full-time Job Summary: Part of R&D team - Electrical/Electronic Hardware. Candidate will be involved in research and development for off board AC and DC Chargers and would be responsible for designing, developing, troubleshooting, debugging and maintaining large and efficient embedded systems. Key Responsibilities: Take responsibility for the design and overall quality of the hardware. Uphold hardware design standards and methodologies. Realization of complex system requirements to provide robust and reliable hardware solutions. Responsibility for the complete implementation of detailed technical items and an understanding/appreciation of system level items. Collaboration with other team members (including both hardware and software engineers) to agree system designs, interfaces and protocols, etc. Co-ordination for meeting the standard compliances and EMI/EMC testing with external agencies. Skills/ Requirements: Experience in design and development of embedded systems based on 32 bit microcontrollers like ARM Cortex, STM 32 etc. Hands-on technical experience in hardware design and development, schematic design, board design, digital and analog electronics Exposure in ARM architecture Deep understanding of hardware-software integrations and working Company Confidential Good to have understanding and experience of PCB design Software like Altium Designer, Cadence OrCad / Allegro, or other related software and multilayer PCB Desgin and PCB testing standards Enthusiastic about working in R&D and excited to learn more in order to develop EV chargers. Qualifications: - Bachelors/Masters degree in Electrical/ Electronic or related field. - 4-6 years of relevant experience.

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } PRINCIPAL R&D/PRODUCT DVL ENGINEER Job Posting TitlePRINCIPAL R&D/PRODUCT DVL ENGINEER Business UnitDIGITAL DATA NETWORKS (50461863) BuildingSahasra Shree (N84) At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview As a Principal Product Development Engineer for TE Connectivity, you will focus on the electrical design, simulation, and verification-validation testing of high-speed products in cable assemblies targeting high speed communications and connectivity within datacenters and wireless infrastructure. You will be expected to independently work on projects in the areas of hardware design and validation for product, system design including modeling, simulation, testing and circuit board layout. You will work collaboratively within a broader cross functional team of mechanical, manufacturing, & operations to execute leading edge products designs. You will be the subject matter expert for the electrical performance of a product/platform beginning with the initial analysis through prototype fabrication & evaluation, and production verification testing. You will tackle challenging design problems and utilize simulation tools to guide complex designs toward success. Roles and Responsibilities: Responsibilities: Subject matter expert in high-speed data, electronics design, simulation and validation activities through product development cycles Establishing electrical design performance/functional requirements for new products Product development of high-speed cables assemblies from conception to manufacturing Component selection, schematic design, PCB Layout, and product validation testing and verify SI test results Creating actionable recommendations based upon design reviews and simulation results Making data driven decisions about the product functionality and areas for improvement. Required Skills/Experience: Bachelor’s degree in electrical or electronicsengineering, master’s degree preferred Minimum of 10 years of work experience in a high-speed hardware engineering role Electronic design and analysis tools (Altium PCB, ADS, Ansys Designer, Ansys HFSS) Experience with cable/cable assembly designs (high speed twin-ax cables, direct attach copper (DAC) cables, active copper cables) Experience with high-speed test equipment (Digital Sampling Oscilloscope, Vector Network Analyzer, Bit Error Rate Tester, TDR, Pattern Generators, Power Supplies, etc.) Knowledge on power integrity and PDM analysis is added advantage. Experience with signal conditioning techniques (equalization, amplification, FIR’s, CTLE’s) Experience with component selection, schematic capture, printed circuit board design, fabrication and assembly. A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Experience in project leadership, especially as it applies across design, development & manufacturing teams Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies Individual must be highly motivated, a quick learner, and able to work independently Nice to have Skills/Experience: Familiarity with SFF/IEEE specifications for high-speed cable assemblies Familiarity with PAM4/8 and other higher order modulation techniques Six Sigma methodologies or other strong data analytics background a PLUS Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131404 Alternative Locations: Function: Engineering & Technology Job Segment Six Sigma, R&D Engineer, Electrical, Electronics Engineer, Hardware Engineer, Management, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Sr Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Bachelor’s degree in Electrical Engineering or equivalent work experience 5 years of relevant work experience in electrical design, RF design, or PCB design Proficient with signal integrity analysis tools (Agilent ADS, Ansys HFSS, CST, or equivalent tools) A solid understanding of electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Fluent in English (both verbal and written) to facilitate global communication both internally and with external customers. Ability to work in a global environment – able to accommodate varying time zones and capable of collaborating with individuals across geographies. Individual must be highly motivated, a quick learner, and able to work independently DESIRED SKILLS: Experience with interconnect design, including socket/connector/cable/cable assembly design (high-speed twinax cables, direct attach copper (DAC) cables), and/or RF antenna, RF sub-system Design experience with communication systems (high-speed servers, switches, routers, storage, antennas, RF front end or similar systems) Solid presentation skills with an ability to clearly communicate technical concepts to diverse audiences in English Strong organizational and time management skills with an ability to manage and execute multiple tasks/deadlines/projects simultaneously with limited direction. SixSigma methodologies or other strong data analytics background. Printed circuit board design, fabrication and assembly (Altium, AutoCAD) Experience in project leadership, especially as it applies across design, development & manufacturing teams Test equipment (oscilloscope, vector network analyzer, BERT) Signal conditioning techniques (equalization, amplification) Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 132207 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Electrical Engineering, Drafting, Manufacturing Engineer, Front End, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Sr Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world.DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. KEY RESPONSBILITIES: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Bachelor’s degree in Electrical Engineering. Should have total work experience of 3-5+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design(high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131811 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Electrical Engineering, Manufacturing Engineer, Front End, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } R&D/PRODUCT DVL ENGINEER II At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB engineer is scalable to contribute individually. He/she is responsible for delivering the project from schematic scratch till the board get fabricated. Stackup analysis, routing strategy, placement feasibility is more important. R&D engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT & PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board design. The candidate is expected to interface with US and China based engineering teams for input and independently work on printed circuit board layout while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to create detailed custom designs. The candidate will be responsible for ensuring the accuracy and functionality of the end design and be able to take ownership of various aspects of the PCB design. Programs may additionally include pre-layout analysis and coordination of global vendors for prototype fabrication and assembly. Candidate Desired Profile Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board design is required. Experience in a senior technical or leadership role is required. Must be able to deliver the board design from scratch schematic to gerber release for manufacturing. Very good exposure in design software - Altium, Allegro, AutoCAD is must. Previous work experience in high-speed board designs will be highly preferred. Altium/Allegro tool scripting knowledge will be an added advantage for this role. Able to address supplier Engineering Queries. Familiarity with the following a plus: CAM350 High speed and/or RF circuits Signal integrity analysis Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competency ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity plc (NYSETEL) is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, energy networks, automated factories, data centers, medical technology and more. With more than 85,000 employees, including 9,000 engineers, working alongside customers in approximately 130 countries, TE ensures that EVERY CONNECTION COUNTS. Learn more atwww.te.com and onLinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group IMPORTANT NOTICE REGARDING RECRUITMENT FRAUD TE Connectivity has become aware of fraudulent recruitment activities being conducted by individuals or organizations falsely claiming to represent TE Connectivity. Please be advised that TE Connectivity never requests payment or fees from job applicants at any stage of the recruitment process. All legitimate job openings are posted exclusively on our official careers website at te.com/careers, and all email communications from our recruitment team will come only from actual email addresses ending in @te.com . If you receive any suspicious communications, we strongly advise you not to engage or provide any personal information, and to report the incident to your local authorities. Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 131824 Alternative Locations: Function: Engineering & Technology Job Segment R&D Engineer, Manufacturing Engineer, Testing, Engineer, Electrical, Engineering, Technology Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } SR R&D/PRODUCT DVL ENGINEER At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview The Sr. R&D/Product Development Engineer will be responsible for Design & Development of RF circuits/modules for RFoF (Radio Frequency Over Fiber) products for Aerospace, Defense & Marine Market requirements. The Sr Engineer will work closely with global and local cross functional teams to develop products by translating a customer requirements into a product requirement, work through the development cycle including testing, approval and release into Production. Responsibilities Design and analysis of RF and/or Mixed Signal hardware, define RF link architecture Conduct detailed electrical design, supporting prototype and final hardware build & test Carry out component selection, schematic capture and PCB layout of parts Lead RF hardware projects from design to test to delivery through proper design methodology. Ensure on time delivery and first time right approach in all the project deliverables. Work with local and global counterpart / stake holder for ensuring quality deliverable and project execution. Interface with system, mechanical, software, and other engineers for ensuring design and task completion Work closely with third party vendor / supplier to define the technical requirements for the product and project execution. Mentor the new team members on design and development of RF product design Required Skills Education/ Knowledge: BE/BTech with specialization in Electronics & Communications Engineering Min 10 years of experience in RF Microwave board design and development Critical experience: Experience with RF Microwave design for aerospace & defense applications Handson with LNA and RF PA design and functional testing RF link loss analysis for transceivers and RADAR applications Experience with ADS or Microwave Office, Cadence, Sonnet and HFSS software applications Familiarity with standard test equipment such as oscilloscopes, power meters, logic analyzers, signal/spectrum analyzers, etc. Familiarity with EMI/EMC requirements, qualification processes and electronics documentation Knowledge of RF module applications such as RADAR, Satcom, C5ISER, EW Familiarity with optical transceivers will be an added advantage COMPETENCIES Technical capabilitiesExpert functional/domain knowledge Strong Technical Aptitude with Willingness to learn new Technologies quickly. Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: Less than 10% Requisition ID: 134427 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Aerospace Engineering, R&D Engineer, Electronics Engineer, Electrical, Technology, Engineering Apply now »

Apply now » .buttontext88d8dcea45dcd44d a{ border1px solid transparent; } .buttontext88d8dcea45dcd44d a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Signal Integrity Engineer At TE, you will unleash your potential working with people from diverse backgrounds and industries to create a safer, sustainable and more connected world. Job Overview TE Connectivity’s R&D/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. They are responsible for product development, and qualification from market definition through production and release; assist in the qualification of suppliers for new products to ensure suppliers deliver quality parts, materials, and services for new or improved manufacturing processes; conduct feasibility studies, testing on new and modified designs; direct and support detailed design, testing, prototype fabrication and manufacturing ramp. The R&D/Product Development Engineering Teams provide all required product documentation including, but not limited to, Solid Model, 2D/3D production drawings, product specifications, and testing requirements. They create and modify detailed drawings and drafting or conceptual models from layouts, rough sketches or notes and contribute to design modifications to facilitate manufacturing operation or quality of product. Typical fields of expertise includematerials, mechanics and systems, electrical, optics, chemistry, software, automation systems, packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsbilties: Drive SI design, simulation, and validation for next-gen high-speed interconnects (112G/224G PAM4, PCIe Gen6/7, Co-Packaged Optics) through the product development cycle. Conducting SI COE analysis, including o Performing signal integrity simulations and analysis for high-speed interconnect product development. This includes determining the correct simulation methodology and setup to use, as well as a good understanding of the criteria for each interface. o Modeling the connector with the consideration of manufacture impact and application impact. o Providing solutions to the SI challenges. This includes identifying the problems, making research plan, developing new technologies, and training and sharing the findings to the SI community. Develop novel interconnect solutions by optimizing mating interfaces, lead frames, and PCB transitions for resonance-free, low-loss performance. Enhance bulk cable design & termination techniques to minimize skew, impedance mismatches, and signal degradation. Advance high-frequency testing methodologies beyond 67 GHz with innovative non-PCB-based test fixtures. Utilize AI & big data analytics for predictive SI modeling, auto-routing, and performance optimization. Optimize material selection & electromagnetic design to improve noise isolation, signal integrity, and high-frequency response. Collaborate with NPD teams & industry partners to influence SI strategies, technology roadmaps, and next-gen product designs. Represent TE at industry forums (IEEE, OIF, PCI-SIG, etc.) and contribute to next-gen SI standards. Should have total work experience of 3-8+years. Minimum of 5+ years of work experience in a signal integrity engineering role or related experience Minimum of 3+ years of work experience in connector development - Experience with interconnect design or experience with connector &/or cable/cable assembly design (high speed twinax cables, direct attach copper (DAC) cables) Demonstrated experience using Signal integrity analysis tools (Agilent ADS, Ansys HFSS or equivalent, 3D modeling tools) and testing equipment (including VNA, TDR and BERT). A solid understanding of statistical analysis and AI training. A solid understanding of SI knowledge, including electromagnetic theory and electrical circuit behavior Strong analytical capabilities to interpret simulation and lab data to identify issues and provide solutions to fix identified problem. Familiarity with printed circuit board design, fabrication and assembly. Familiar with material, manufacturing process, and manufacture inspection. Familiar with at least one programming language, such as Matlab, python, C++, VB, etc. Excellent verbal and written communication skills Ability to work in a global environment – able to accommodate varying time zones, fluent in English (verbal/written), able to collaborate with individuals across geographies DESIRED SKILLS Printed circuit board design (proficient in Altium a PLUS), fabrication and assembly (AutoCAD) Communication systems (high-speed servers, switches, routers, storage) Signal conditioning techniques (equalization, amplification) SixSigma methodologies or other strong data analytics background a PLUS. Experience in project leadership, especially as it applies across design, development & manufacturing teams Direct customer design and support experience Application and test knowledge of high-speed devices and equalization techniques Design experience with high-speed servers, switches, routers, storage, antenna, RF front end or similar systems Competencies ValuesIntegrity, Accountability, Inclusion, Innovation, Teamwork .videocomponent8ae3a91ad732ccb9 a{ border1px solid transparent; } .videocomponent8ae3a91ad732ccb9 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } .buttontext13c01d781def3077 a{ border1px solid transparent; } .buttontext13c01d781def3077 a:focus{ border1px dashed #5B94FF !important; outlinenone !important; } Location: Bangalore, KA, IN, 560066 #job-location.job-location-inline {displayinline;} City: Bangalore State: KA Country/Region: IN Travel: 10% to 25% Requisition ID: 131812 Alternative Locations: Function: Engineering & Technology Job Segment Testing, Drafting, Manufacturing Engineer, Front End, CAD, Technology, Engineering Apply now »

Alexa+ is our next-generation assistant powered by generative AI. Alexa+ is more conversational, smarter, personalized, and gets things done. Our goal is make Alexa+ an instantly familiar personal assistant that is always ready to help or entertain on any device. At the core of this vision is Alexa AI Developer Tech, a close-knit team that s dedicated to providing software developers with the tools, primitives, and services they need to easily create engaging customer experiences that expand the wealth of information, products and services available on Alexa+. Interested in Alexa+Ever wonder whats involved in enabling third-party partners to create experiences for Alexa+Then come help us build the AI-native SDKs that partners use every day to expand Alexa+ capabilities! You will join a growing organization working on top technology using Generative AI and have an enormous opportunity to make an impact on the design, architecture, and implementation of products used every day, by people you know. We re working hard, having fun, and making history; come join us! Key job responsibilities Building software that runs with high quality on millions of Echo family devices, and Alexa-enabled Devices using latest AI technologies, including LLMs. Taking a long-term view of architecture, proactively fixing deficiencies and/or proposing larger projects. Understanding the business impact of your systems and show good judgment when making technical trade-offs. Driving engineering best practices (e.g., Operational Excellence, Security, Quality, etc.) and set standards. When confronted with discordant views, you are able to find the best way forward and influence others to follow that path, building consensus. You contribute to the professional development of colleagues, improving their technical knowledge and engineering practices A day in the life A typical day will start with a morning huddle to catch up on what you and your team worked on the previous day. This is usually followed by some white-board design discussions on the problems the team is working on, with afternoon mostly spent on project design and implementation work with a heavy dose of code reviews from and for your team along the way. We are a fun, close knit team where everyone is ready to roll their sleeves and help each other out, push boundaries and have fun doing it! About the team Alexa AI Developer Tech is an organization within Alexa on a mission to empower developers to create delightful and engaging experiences by making Alexa more natural, accurate, conversational, and personalized. - 3+ years of non-internship professional software development experience - 2+ years of non-internship design or architecture (design patterns, reliability and scaling) of new and existing systems experience - Experience programming with at least one software programming language - 3+ years of full software development life cycle, including coding standards, code reviews, source control management, build processes, testing, and operations experience - Bachelors degree in computer science or equivalent

Job Area: Engineering Group, Engineering Group > Hardware Engineering General Summary: As a leading technology innovator, Qualcomm pushes the boundaries of what's possible to enable next-generation experiences and drives digital transformation to help create a smarter, connected future for all. As a Qualcomm Hardware Engineer, you will plan, design, optimize, verify, and test electronic systems, bring-up yield, circuits, mechanical systems, Digital/Analog/RF/optical systems, equipment and packaging, test systems, FPGA, and/or DSP systems that launch cutting-edge, world class products. Qualcomm Hardware Engineers collaborate with cross-functional teams to develop solutions and meet performance requirements. Minimum Qualifications: Bachelor's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 2+ years of Hardware Engineering or related work experience. OR Master's degree in Computer Science, Electrical/Electronics Engineering, Engineering, or related field and 1+ year of Hardware Engineering or related work experience. OR PhD in Computer Science, Electrical/Electronics Engineering, Engineering, or related field. The Power & Signal Integrity Group (PSIG) resides in the CHS (Central Hardware Systems) unit of Qualcomm Technologies, Inc., a leader in wireless communication technology. Engineers in the Power & Signal Integrity Group work with the various business units across Qualcomm to help bring leading edge mobile, AR\VR, IoT, Automotive and various others products to market. The candidate will work in a team-oriented environment with cross functional leads to provide electrical design expertise in the areas of signal integrity and power integrity for the design of wireless products and development systems. The engineer will be located in Bangalore, India and will be closely working with the Product architects, Platform HW teams, IO\PHY, IC Packaging, and other teams. The candidate is expected to perform SI / PI analyses and provide guidance on signal and power integrity challenges. Working effectively across organizational boundaries is essential as is the effective documentation and presentation of results. The candidate is expected to work closely with an experienced SI engineer while applying established PSIG methodologies. The engineer will have the opportunity to influence the evolution of analysis methodologies. Responsibilities Perform various IO analyses using established methodologies, potentially from model extraction through simulation and reporting of conclusions. IO types include DDR memory interfaces and variety of serial interfaces. Analyze and provide design guidance for DIE floor plans, IC packages, PCB power distribution networks using established methodologies. Document, distribute, and present results at appropriate meetings. 2+ years of work experience in the following areas: Electromagnetic theory and transmission lines Basic signal and power integrity concepts Commercial 3D electromagnetic field solver Commercial SI or RF simulation and analysis tools SPICE transient simulation including use of IBIS models The following experience is a plus: DDR and LPDDR design and analysis High speed serial IO design and analysis, PCIE, USB, UFS, CSI/DSI/MIPI Power Integrity analysis SI/PI tools :Ansys HFSS/SIwave, Cadence/Sigrity, Keysight ADS, HSPICE Spreadsheets and similar productivity tools Mentor or Cadence board design tools Education Requirements: Minimum Bachelor degree in Electrical Engineering or related discipline, Master degree preferred

Job Overview TE Connectivity s RD/Product Development Engineering Teams conceive original ideas for new products, introduce them into practice. PCB CAM engineer is scalable to contribute individually. He/she is responsible for delivering the project with zero DFM s for manufacturing. Stackup analysis, routing strategy, placement feasibility is more important. RD engineer should familiarize in manufacturing process and the different soldering process, IPC standards for SMT PTH library footprint creation. Responsible for all the documentation related to the board design and fabrication data. Typical fields of expertise include Analysing different dielectric materials, knowledge on high-speed design constraint, electrical, software, automation systems, data packaging, testing and measurement, and manufacturing of electrical, mechanical and electronic components, products, and their integration into systems. Responsibilities: TE Connectivity is seeking an experienced candidate for high speed printed circuit board DFM validation. The candidate is expected to interface with US and China based fabrication vendors and independently work on resolving vendor engineering queries while also providing guidance and direction to local designers. The position requires that the candidate be able to utilize generalized engineering direction to validate detailed manufacturing aspects of pcb using CAM350. The candidate will be responsible for ensuring the accuracy and functionality of the end design (includes IPC matching, Min/max clearance definition) and be able to take ownership of various aspects of the DFM constraint. Candidate Desired Profile: Candidate should have excellent verbal communication skills, a high attention to detail, be highly motivated, a quick learner, and be able to work independently. Understanding of printed circuit board design, manufacturing, and assembly is required. Experience with printed circuit board validation is required. Very good exposure in CAM software - CAM350 Previous work experience in high-speed board validation will be highly preferred. Able to address supplier Engineering Queries. Familiarity with the following a plus: Altium, Allegro Connectors and cable assemblies PCB manufacturing tolerances and cost drivers PDMLink process ECR/ECN release process Competencies Values: Integrity, Accountability, Inclusion, Innovation, Teamwork ABOUT TE CONNECTIVITY TE Connectivity is a global industrial technology leader creating a safer, sustainable, productive, and connected future. Our broad range of connectivity and sensor solutions enable the distribution of power, signal and data to advance next-generation transportation, renewable energy, automated factories, data centers, medical technology and more. With more than 85, 000 employees, including 8, 000 engineers, working alongside customers in approximately 140 countries. TE ensures that EVERY CONNECTION COUNTS. Learn more at www. te. com and on LinkedIn , Facebook , WeChat, Instagram and X (formerly Twitter). WHAT TE CONNECTIVITY OFFERS: We are pleased to offer you an exciting total package that can also be flexibly adapted to changing life situations - the well-being of our employees is our top priority! Competitive Salary Package Performance-Based Bonus Plans Health and Wellness Incentives Employee Stock Purchase Program Community Outreach Programs / Charity Events Employee Resource Group Across our global sites and business units, we put together packages of benefits that are either supported by TE itself or provided by external service providers. In principle, the benefits offered can vary from site to site. Location: